Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1990
05/02/1990EP0366386A2 Flagless semiconductor package
05/02/1990EP0366343A2 Integrated circuit fabrication, including low temperature method for making silicide structures
05/02/1990EP0366338A2 A substrate for an electrical circuit system and a circuit system using that substrate
05/02/1990EP0366282A2 Cavity packages
05/02/1990EP0366082A2 Member for carrying semiconductor device
05/02/1990EP0365933A2 Moistureproof coating composition for electronic components
05/02/1990EP0365854A2 Semiconductor device having a multi-layered wiring structure
05/02/1990EP0365783A2 Multilevel integrated circuit packaging structures
05/02/1990CN1041849A Method of manufacturing electric devices
05/01/1990US4922379 Power semiconductor package
05/01/1990US4922378 Baseboard for orthogonal chip mount
05/01/1990US4922377 Module and a substrate for the module
05/01/1990US4922376 Spring grid array interconnection for active microelectronic elements
05/01/1990US4922326 Ceramic semiconductor package having crack arrestor patterns
05/01/1990US4922325 Multilayer ceramic package with high frequency connections
05/01/1990US4922324 Semiconductor integrated circuit device
05/01/1990US4922322 Bump structure for reflow bonding of IC devices
05/01/1990US4922321 Semiconductor device and a method of producing same
05/01/1990US4922320 Integrated circuit metallization with reduced electromigration
05/01/1990US4922318 Bipolar and MOS devices fabricated on same integrated circuit substrate
05/01/1990US4922117 Photoelectric conversion device having a constant potential wiring at the sides of the common wiring
05/01/1990US4922077 Method of laser marking metal packages
05/01/1990US4921158 Brazing material
05/01/1990US4920640 Compressing composite of ceramic powder and organic binder between boron nitride sheets
05/01/1990US4920639 Method of making a multilevel electrical airbridge interconnect
04/1990
04/25/1990EP0365275A2 A composite material heat-dissipating member for a semiconductor element and method of its fabrication
04/25/1990EP0365036A2 Thin film transistor and crossover structure for liquid crystal displays and method of making
04/25/1990EP0365007A2 Crimp-type semiconductor device having non-alloy structure
04/25/1990EP0364981A2 Overcurrent preventive diode
04/25/1990EP0364758A2 Semiconductor module comprising cooling structures, and an electronic computer using the semiconductor module
04/25/1990EP0364536A1 Burn-in pads for tab interconnect structures
04/25/1990EP0364479A1 Gold compression bonding.
04/25/1990CN1041668A Semiconductor module and computer using same
04/24/1990US4920574 Cooling system for an electronic circuit device
04/24/1990US4920454 Wafer scale package system and header and method of manufacture thereof
04/24/1990US4920444 Arrangement for decoupling integrated circuits electrically
04/24/1990US4920406 Semiconductor device
04/24/1990US4920404 Low stress light-emitting diode mounting package
04/24/1990US4920403 Selective tungsten interconnection for yield enhancement
04/24/1990US4920074 Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof
04/24/1990US4920073 Inhibiting oxidation of titanium layer prior to reaction with zilicon high conductivity
04/24/1990US4920072 A non planarized semiconductor; depositing spin on glass a barrier, photoresists layers, etching
04/24/1990US4920071 High temperature interconnect system for an integrated circuit
04/24/1990US4919857 Dispensing fluid resin into gaps, hardening; heat resistant, non-conductive
04/24/1990US4919731 Brazing paste
04/24/1990US4918811 Multichip integrated circuit packaging method
04/24/1990CA1268263A1 Method of making a diamond heat sink
04/19/1990WO1990004262A1 Aluminum alloy semiconductor packages
04/18/1990EP0364347A1 Cryostat for a radiation detector
04/18/1990EP0364186A2 Quasi-folded bitline
04/18/1990EP0364155A2 Diamond composite heat sink for use with semiconductor devices
04/18/1990EP0364056A2 Surface mounted decoupling capacitor
04/18/1990EP0363936A2 Method of manufacturing electric devices
04/18/1990EP0363687A2 Cooling structure for electronic components
04/18/1990EP0363679A2 Method of fabricating a semiconductor device
04/18/1990CN1007678B Process for preparing semiconductor device
04/17/1990US4918571 Chip carrier with energy storage means
04/17/1990US4918514 Press-contact type semiconductor device
04/17/1990US4918512 Semiconductor package having an outwardly arced die cavity
04/17/1990US4918511 Thermal expansion compensated metal lead frame for integrated circuit package
04/17/1990US4918335 Interconnection system for integrated circuit chips
04/17/1990US4917759 Method for forming self-aligned vias in multi-level metal integrated circuits
04/17/1990US4916809 Method for programmable laser connection of two superimposed conductors of the interconnect system of an integrated circuit
04/17/1990CA1267990A1 Diffusion isolation layer for maskless cladding process
04/17/1990CA1267915A1 Sintered silicon carbide ceramic body of high electrical resistivity
04/14/1990CA2000702A1 Surface mounted decoupling capacitor
04/11/1990EP0363297A1 Improved contact stud structure for semiconductor devices
04/11/1990EP0363286A2 Material for electronic components and process for preparing the components
04/11/1990EP0363133A1 Metallization process for an integrated circuit
04/11/1990EP0362867A2 Method for manufacturing semiconductor devices
04/11/1990EP0362547A1 Power device with self-centering electrode
04/10/1990US4916716 Varactor diode
04/10/1990US4916523 PGA integrated circuit package
04/10/1990US4916522 Integrated circuit package using plastic encapsulant
04/10/1990US4916521 Contact portion of semiconductor integrated circuit device
04/10/1990US4916520 Semiconductor device with airbridge interconnection
04/10/1990US4916519 Semiconductor package
04/10/1990US4916518 Plastic encapsulated semiconductor device and method for manufacturing the same
04/10/1990US4916516 Semiconductor contact arrangement
04/10/1990US4916515 Microwave circuit integrating
04/10/1990US4916514 Integrated circuit employing dummy conductors for planarity
04/10/1990US4916509 Method for obtaining low interconnect resistance on a grooved surface and the resulting structure
04/10/1990US4916506 Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means
04/10/1990US4916502 Semiconductor device to be coupled with a control circuit by a photocoupler
04/10/1990US4916413 Package for piezo-oscillator
04/10/1990US4916397 Semiconductor device with bonding pad
04/10/1990US4916259 Composite dielectric structure for optimizing electrical performance in high performance chip support packages
04/10/1990US4916114 Method for producing a layer-like composition of oxide-ceramic superconducting material
04/10/1990US4916009 Polyimide
04/10/1990US4915167 Thermal coupling to enhance heat transfer
04/10/1990US4914814 Process of fabricating a circuit package
04/10/1990US4914812 Method of self-packaging an IC chip
04/10/1990US4914804 Method of making a surface mountable electronic device
04/10/1990CA2000338A1 Lead frame for a multiplicity of terminals
04/05/1990WO1990003662A1 Hybrid microchip bonding article
04/05/1990DE3931996A1 Halbleitervorrichtung und verfahren zu deren herstellung Semiconductor device and process for their preparation
04/04/1990EP0362161A2 Method of manufacturing a substrate for microwave integrated circuits
04/04/1990EP0361985A1 Hybrid microchip bonding article
04/04/1990EP0361975A2 Adhesive tapes
04/04/1990EP0361825A2 Semiconductor chip and method of manufacturing it
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