Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1990
05/23/1990EP0369652A2 Electronic device sealing resin compositions and sealed electronic devices
05/23/1990EP0369449A1 Socketing a semiconductor device
05/23/1990EP0369427A2 Semiconductor device
05/23/1990EP0369336A2 Process for fabricating bipolar and CMOS transistors on a common substrate
05/23/1990EP0369244A2 Polyarylene sulfide resin composition
05/23/1990EP0369115A1 Thermal conduction module
05/23/1990EP0368938A1 Self-aligned, planarized contacts for semiconductor devices
05/23/1990EP0324743B1 High-frequency power transistor with bipolar epitaxial technology
05/23/1990EP0225333B1 Mini chip carrier slotted array
05/23/1990EP0208970B1 Mofset having a thermal protection
05/23/1990EP0202240B1 Coating of iii-v and ii-vi compound semiconductors
05/23/1990DE3937504A1 Semiconductor device with IC and redundant circuit - has protective layers preventing damage during testing
05/23/1990DE3837300A1 Method for producing microelectronic circuits and hybrids
05/22/1990US4928207 Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston
05/22/1990US4928199 Chip package including threshold switching device formed from chalcogenide glass
05/22/1990US4928164 Integrated circuit device having a chip
05/22/1990US4928162 Semiconductor die
05/22/1990US4928161 Thin-film transistor and wiring matrix device and its forming method
05/22/1990US4928002 Method of recording test results of die on a wafer
05/22/1990US4927784 Simultaneous formation of via hole and tube structures for GaAs monolithic microwave integrated circuits
05/22/1990US4927783 Contact hole filled with conductive material and is maintained small; miniaturization
05/22/1990US4927711 Hybrid circuits and thick film dielectrics used therein
05/22/1990US4927505 Metallization scheme providing adhesion and barrier properties
05/22/1990US4927491 Method of bonding IC unit
05/22/1990US4927371 Socket for semiconductor device
05/22/1990US4927224 For directly applying laser beams to a workpiece
05/22/1990US4926935 Compressed fin heat sink
05/22/1990US4926549 Method of producing electrical connection members
05/22/1990US4926547 Method for manufacturing a modular semiconductor power device
05/22/1990CA2003543A1 Self-tightening heat sink
05/22/1990CA1269461A1 Low-temperature monolithic chip
05/21/1990CA2002402A1 Tabcircuit electrical connector supporting multiple components thereon
05/17/1990WO1990005382A1 Positive working polyamic acid/imide photoresist compositions and their use as dielectrics
05/17/1990WO1990005381A1 Liquid cooled multi-chip integrated circuit module
05/17/1990WO1990005380A1 Hermetically sealed modular electronic cold plate utilizing reflux cooling
05/17/1990WO1990005379A1 Acceleration-resistant packaging for integrated circuits and process for manufacturing it
05/17/1990DE3937549A1 Electronic circuit with applied metallisation pad - has applied dielectric layer of same material as substrate covering edges of metallisation pad
05/16/1990EP0368743A2 High performance integrated circuit chip package and method of making same
05/16/1990EP0368741A1 Integrated-circuit support and its manufacturing method, integrated circuit adapted to the support and resulting housings
05/16/1990EP0368740A1 High-density integrated-circuit housing
05/16/1990EP0368646A1 Semiconductor device
05/16/1990EP0368524A1 Output buffer circuit
05/16/1990EP0368514A1 Static shielding film
05/16/1990EP0368262A2 Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
05/16/1990EP0368142A2 Electronic control apparatus
05/16/1990EP0368133A2 Support body for the electrically insulated arrangement of components
05/16/1990EP0145595B1 Integrated circuit device
05/15/1990US4926378 Bipolar static RAM having two wiring lines for each word line
05/15/1990US4926242 Aluminum-silicon alloy heatsink for semiconductor devices
05/15/1990US4926241 Flip substrate for chip mount
05/15/1990US4926240 Semiconductor package having recessed die cavity walls
05/15/1990US4926239 Plastic encapsulant for semiconductor
05/15/1990US4926238 Semiconductor device and method for producing the same
05/15/1990US4926237 Semiconductors
05/15/1990US4926236 Multilayer interconnect and method of forming same
05/15/1990US4926234 Semiconductor device operating in high frequency range
05/15/1990US4926227 Sensor devices with internal packaged coolers
05/15/1990US4926194 Device for controlled deflection of a light beam
05/15/1990US4925772 Crosslinked polyphosphazenes
05/15/1990US4925723 Forming holes; filling with metal
05/15/1990US4925524 Method for forming tungsten structures in a semiconductor
05/15/1990US4925515 Method and apparatus for applying a protective tape on a wafer and cutting it out to shape
05/15/1990US4925024 Hermetic high frequency surface mount microelectronic package
05/14/1990EP0368938A4 Self-aligned, planarized contacts for semiconductor devices.
05/14/1990EP0344292A4 Self-aligned semiconductor devices.
05/14/1990CA2002927A1 Connection to a component for use in an electronics assembly
05/10/1990DE3837618A1 Electrical or electronic arrangement
05/10/1990DE3837275A1 Case and connection system for large-scale integrated circuits
05/09/1990EP0367680A1 Monolithic semiconductor module comprising an avalanche diode with adaptation circuits for hyperfrequency applications, and method for producing it
05/09/1990EP0367679A1 Process for protecting electronic standard components from high pressures
05/09/1990EP0367630A1 Package for electronic devices operating at different respective temperatures
05/09/1990EP0367571A2 Superconducting thick film circuit board, production thereof, thick film superconductor and production thereof
05/09/1990EP0366958A2 Epoxy composition and use thereof
05/09/1990EP0366744A1 Improved retention means for chip carrier sockets.
05/09/1990EP0366711A1 Semiconductor casing.
05/09/1990CN1007909B Multipurpose cooper alloys and processing therefor with moderate conductivity and high strength
05/08/1990US4924353 Connector system for coupling to an integrated circuit chip
05/08/1990US4924352 Method and device for cooling an integrated circuit package
05/08/1990US4924351 Recessed thermally conductive packaged semiconductor devices
05/08/1990US4924340 Circuit protection device
05/08/1990US4924297 Semiconductor device package structure
05/08/1990US4924296 Multiple-chip semiconductor element in a case of metal and resin
05/08/1990US4924295 Integrated semi-conductor circuit comprising at least two metallization levels composed of aluminum or aluminum compounds and a method for the manufacture of same
05/08/1990US4924294 Electrical continuity between two spaced apart conductors on a substrate
05/08/1990US4924293 Semiconductor integrated circuit device
05/08/1990US4924292 Direct bond circuit assembly with crimped lead frame
05/08/1990US4924291 Flagless semiconductor package
05/08/1990US4924290 Semiconductor device having improved multilayered wirings
05/08/1990US4924289 Air bridge wiring for semiconductor devices
05/08/1990US4924287 Personalizable CMOS gate array device and technique
05/08/1990US4923825 Method of treating a semiconductor body
05/08/1990US4923526 Reacting gas and metal; semiconductors, integrated circuits
05/08/1990US4923386 Apparatus for forming leads of a semiconductor device
05/08/1990US4923179 Spring panel heat sink for electrical components
05/08/1990US4923100 Process for producing clad sheets
05/08/1990US4923000 Heat exchanger having piezoelectric fan means
05/08/1990US4922601 Method of making a heat sink for electrical components
05/04/1990CA2001207A1 Polyarylene sulfide resin composition
05/03/1990WO1990004914A1 Plate fin/chic heat exchanger
05/03/1990WO1990004854A1 Flame retardant epoxy molding compound, method and encapsulated device
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