Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1990
06/20/1990EP0373241A1 Film carrier and method of manufacturing same
06/19/1990US4935864 Localized cooling apparatus for cooling integrated circuit devices
06/19/1990US4935804 Semiconductor device
06/19/1990US4935803 Electronic device
06/19/1990US4935801 Metallic fuse with optically absorptive layer
06/19/1990US4935792 Thin film transistor array
06/19/1990US4935789 Buried channel FET with lateral growth over amorphous region
06/19/1990US4935637 Linear element array with wire bonding arrangement
06/19/1990US4935581 Pin grid array package
06/19/1990US4935454 Broad spectrum light and heat curable sealant composition and method of using same
06/19/1990US4935312 Film carrier having tin and indium plated layers
06/19/1990US4935285 Ceramic substrates for microelectronic circuits and process for producing same
06/19/1990US4935095 Depositing solution of tetraethoxy silane, tetraethoxygermane, solvent, acid on wafer, spinning, baking
06/19/1990US4934961 Bi-level card edge connector and method of making the same
06/19/1990US4934820 Semiconductor device
06/14/1990WO1990006668A1 Coolant activated contact compact high intensity cooler
06/14/1990WO1990006593A1 Tape automated bonded lead package and reusable transport tape for use therewith
06/14/1990WO1990006592A1 Hydrostatic clamp for compression type power semiconductors
06/14/1990WO1990006265A1 Antistatic sheet material, package and method of making
06/13/1990EP0372880A2 Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
06/13/1990EP0372356A2 Liquid crystal display device
06/13/1990EP0372126A1 Method for encapsulating electronic parts and encapsulated parts
06/13/1990EP0372108A1 Vacuum container for cryogenically cooled electron device packaging
06/13/1990EP0372017A1 Epoxy resin compositions for sealing semiconductor devices.
06/13/1990EP0202254B1 Semiconductor device provided with a metal layer
06/13/1990EP0197148B1 Printed-circuit board for mounting electronic element and method of manufacture thereof
06/12/1990US4933898 Secure integrated circuit chip with conductive shield
06/12/1990US4933812 Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture
06/12/1990US4933810 Integrated circuit interconnector
06/12/1990US4933808 Solderless printed wiring board module and multi-module assembly
06/12/1990US4933804 Interference suppression for semi-conducting switching devices
06/12/1990US4933747 Interconnect and cooling system for a semiconductor device
06/12/1990US4933746 For attaching a semiconductor to a heat sink
06/12/1990US4933745 Microwave device package
06/12/1990US4933744 Noncracking, stress resistance; rubber particles in cured resin matrix
06/12/1990US4933743 High performance interconnect system for an integrated circuit
06/12/1990US4933742 Metallization contact system for large scale integrated circuits
06/12/1990US4933741 Multifunction ground plane
06/12/1990US4933738 Customizable semiconductor devices
06/12/1990US4933737 Polysilon contacts to IC mesas
06/12/1990US4933635 In-line process monitors for thin film wiring
06/12/1990US4933305 Forming dielectric, bonding pad, passivation film
06/12/1990US4933285 Multiple monolayers of polymeric linkages on a solid phase for immobilizing macromolecules
06/12/1990US4933042 Method for packaging integrated circuit chips employing a polymer film overlay layer
06/12/1990US4932585 Method and apparatus for solder plating an object
06/12/1990CA1270340A1 Hermetically sealed electronic component
06/06/1990EP0371862A2 Method of forming a nonsilicon semiconductor on insulator structure
06/06/1990EP0371861A2 High density semiconductor structure and method of making the same
06/06/1990EP0371855A1 Method of manufacturing an electronic module, and electronic module made by this method
06/06/1990EP0371696A2 Electronic system having a microprocessor and a coprocessor disposed on a circuit mounting board
06/06/1990EP0371512A2 Conducting material and method of fabrication thereof
06/06/1990EP0371287A1 Planarizing ladder-type silsesquioxane polymer insulation layer
06/05/1990US4932064 Semiconductor device
06/05/1990US4931908 Housing for an electronic circuit
06/05/1990US4931906 Hermetically sealed, surface mountable component and carrier for semiconductor devices
06/05/1990US4931854 Low capacitance integrated circuit package
06/05/1990US4931852 High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package
06/05/1990US4931845 Semiconductor memory device having an ohmic contact between an aluminum-silicon alloy metallization film and a silicon substrate
06/05/1990US4931410 Process for producing semiconductor integrated circuit device having copper interconnections and/or wirings, and device produced
06/05/1990US4931354 Multilayer printed circuit board
06/05/1990US4931353 Structure and method for selectively producing a conductive region on a substrate
06/05/1990US4931128 Electronic parts processing machine
06/05/1990US4931020 IC package positioning device in IC socket for IC carrier
06/05/1990US4930857 Hybrid package arrangement
06/05/1990US4930216 Process for preparing integrated circuit dies for mounting
06/05/1990EP0382714A4 Process for manufacturing plastic pin grid arrays and the product produced thereby.
06/05/1990EP0357606A4 Low stress heat sinking for semiconductors.
06/05/1990EP0340241A4 High density electronic package comprising stacked sub-modules.
06/05/1990CA1269854A1 Open cycle cooling of electrical circuits
05/1990
05/31/1990WO1990005997A1 An improved beam leads for schottky-barrier diodes in a ring quand
05/31/1990WO1990005995A1 Semiconductor device
05/31/1990WO1990005614A1 Connection to a component for use in an electronics assembly
05/31/1990DE3939647A1 Traegersubstrat und verfahren zur herstellung des traegersubstrates Traegersubstrat and method for producing the traegersubstrates
05/31/1990DE3937130A1 Box-type cooler - for power semiconductor modules insulated by layer of specified plastic material
05/30/1990EP0370806A2 Self-tightening heat sink
05/30/1990EP0370769A2 Method of manufacturing a multiple-core complex material
05/30/1990EP0370745A2 Low-cost high-performance semiconductor chip package
05/30/1990EP0370743A1 Decoupling filter leadframe assembly
05/30/1990EP0370742A1 Stacked leadframe assembly
05/30/1990EP0370741A1 Solder bonding material
05/30/1990EP0370738A1 Solder bumped leadframe
05/30/1990EP0370598A1 Wafer scale integrated circuit apparatus
05/30/1990EP0370438A1 Method for preparing a flexible electrical connector
05/30/1990EP0370412A1 Process for terminal contacting of semiconductor elements
05/30/1990EP0370387A2 Superconducting material
05/30/1990EP0370227A2 Metallized substrate for electronic device
05/30/1990EP0264364B1 Electric switchgear
05/30/1990CN2057779U Selected region transistor
05/29/1990US4930002 Multi-chip module structure
05/29/1990US4930001 Alloy bonded indium bumps and methods of processing same
05/29/1990US4930000 Terminal assembly for an integrated semiconductor circuit
05/29/1990US4929856 Heavy-duty circuit breaker
05/29/1990US4929516 Multilayer, metallic buffers, stress relieving
05/29/1990CA2004075A1 High density semiconductor structure and method of making the same
05/29/1990CA2004073A1 Method of forming a nonsilicon semiconductor on insulator structure
05/29/1990CA1269763A1 Integrated circuit package having coaxial pins
05/29/1990CA1269517A1 Chip carrier extraction tool
05/23/1990EP0369842A1 Method for the production of a large-scale integrated circuit such as an EPROM
05/23/1990EP0369828A2 Active matrix liquid crystal display panel with an electrostatic protection circuit
05/23/1990EP0369827A1 Production and use of coolant in cryogenic devices
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