Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1990
07/17/1990US4942454 Resin sealed semiconductor device
07/17/1990US4942453 IC package
07/17/1990US4942452 Lead frame and semiconductor device
07/17/1990US4942358 Integrated circuit option identification circuit and method
07/17/1990US4942317 Master slice type semiconductor integrated circuit having 2 or more I/O cells per connection pad
07/17/1990US4942308 Power transistor monolithic integrated structure
07/17/1990US4942207 Process for the preparation of modified resin useful as a low-stress semiconductor encapsulant and composition formed therefrom
07/17/1990US4942140 Method of packaging semiconductor device
07/17/1990US4942139 Method of fabricating a brazed glass pre-passivated chip rectifier
07/17/1990US4942138 Radiation the wiring electrodes with electron beams from two directions, integrated circuits
07/17/1990US4942076 Gallium arsenide and alumina, sintering tungsten and aluminum, hermetic sealing, drilling holes
07/17/1990US4941582 Hermetically sealed ceramic package
07/17/1990US4941530 Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
07/17/1990US4941257 Method for fixing an electronic component and its contacts to a support
07/17/1990US4941255 Method for precision multichip assembly
07/12/1990WO1990007793A1 Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
07/11/1990EP0377245A1 Semiconductor device and method of manufacturing a semiconductor device
07/11/1990EP0377137A1 Method for selective deposition of refractory metals on silicon substrates
07/11/1990EP0377101A1 A reference mark structure for guiding the alignment of unfinished semiconductor integrated circuits topographies to successive masks
07/11/1990EP0130207B1 Semiconductor chip package
07/11/1990CN1043828A Method for manufacture of semiconductor device
07/10/1990US4941067 Thermal shunt for electronic circuits
07/10/1990US4941034 Integrated semiconductor circuit
07/10/1990US4941033 Semiconductor integrated circuit device
07/10/1990US4941028 Structure for protecting thin dielectrics during processing
07/10/1990US4941024 Semiconductor apparatus
07/10/1990US4940855 Hermetically tight glass-metal housing for semiconductor components and method for producing same
07/10/1990US4940673 PN junction passivation using methylated silyloxy groups
07/10/1990US4940085 Fluid heat exchanger for an electronic component
07/04/1990EP0376924A2 Gold compression bonding
07/04/1990EP0376645A2 Ceramic package for memory semiconductor
07/04/1990EP0376541A2 Removing meltable material
07/04/1990EP0376479A1 Method for manufacturing a semiconductor device having a phospho silicate glass layer as an interlayer insulating layer
07/04/1990EP0376478A2 System for mounting and cooling power semiconductor devices
07/04/1990EP0376387A1 Device including a heat sample carrier
07/04/1990EP0376370A1 Moulding composition, method of encapsulating an electronic component and an encapsulated electronic component
07/04/1990EP0376365A1 Semiconductor module
07/04/1990EP0376291A2 Semiconductor integrated circuit
07/04/1990EP0376100A2 Method and lead frame for mounting a semiconductor
07/04/1990EP0376062A1 Electronic module with an integrated circuit for a portable object of small dimensions, such as a card or a key, and process for manufacturing such a module
07/04/1990EP0376045A2 Method and apparatus for processing a fine pattern
07/04/1990EP0375915A2 A contact chain structure for troubleshooting EPROM memory circuits
07/04/1990EP0375908A2 Method and structure for implementing dynamic chip burn-in
07/04/1990EP0375869A2 Monolithic semiconductor chip interconnection technique and arragement
07/04/1990EP0375851A2 Encapsulated electrical or electronic device
07/04/1990EP0375777A1 Semiconductor packaging module and heat-conducting block structure used therefor
07/03/1990US4939793 Integrated circuit assembly with optically coupled components
07/03/1990US4939621 Devices for regulating the temperature of an element by blowing a gas at appropriate temperature
07/03/1990US4939619 Packaged solid-state surge protector
07/03/1990US4939592 Contact photoelectric conversion device
07/03/1990US4939570 High power, pluggable tape automated bonding package
07/03/1990US4939568 Three-dimensional integrated circuit and manufacturing method thereof
07/03/1990US4939567 Trench interconnect for CMOS diffusion regions
07/03/1990US4939316 Aluminum alloy semiconductor packages
07/03/1990US4939022 Silver films with palladium and silica and/or alumina; semiconductors,integrated circuits; hybrids
07/03/1990US4939021 Multilayer ceramic copper circuit board
07/03/1990US4939014 Composite polymer/desiccant coatings for IC encapsulation
07/03/1990US4938923 Gold wire for the bonding of a semiconductor device
07/03/1990US4938280 Liquid-cooled, flat plate heat exchanger
07/03/1990US4938279 Flexible membrane heat sink
07/03/1990CA1271270A1 Method of manufacturing a semiconductor device, in which a metallization with a thick connection electrode is provided on a semiconductor body
07/03/1990CA1271268A1 Method of making a flexible microcircuit
07/03/1990CA1271267A1 Vlsi coaxial wiring structure
06/1990
06/28/1990WO1990007256A1 Heat sink assembly for densely packed transistors
06/28/1990DE3943013A1 Diodenvorrichtung fuer hochfrequenzanwendungen Diode device for high frequency applications
06/28/1990DE3908676A1 Process for forming low-resistance contacts on at least two n<+>-/p<+>-type pre-ohmic zones of a large-scale integrated semiconductor circuit
06/27/1990EP0375519A1 Connecting strips for the in-line assembling of SMD components
06/27/1990EP0375461A2 Semiconductor device being packaged
06/27/1990EP0375255A2 Method for reducing mobile ion contamination in semiconductor integrated circuits
06/27/1990EP0375217A1 Semiconductor package having an outwardly arced die cavity
06/27/1990EP0374971A2 Three-dimensionally stacked LSI
06/27/1990EP0374904A2 Bi-level card edge connector
06/27/1990EP0374842A2 Semiconductor integrated circuit device of standard cell system
06/27/1990EP0374825A1 Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite
06/27/1990EP0374690A1 Programmable fusible link structure allowing for plasma metal etching.
06/27/1990EP0374505A2 Metallizing process
06/27/1990EP0374479A1 Method and assembly for adjustably mounting a heat exchanger for an electronic component
06/27/1990EP0374466A1 In-line process monitors for thin film wiring
06/27/1990EP0374452A2 Hybrid circuits and thick film dielectrics used therein
06/27/1990EP0111181B1 Semiconductor component with a contact hole
06/27/1990CN1043407A Carrier substrate and method for preparing same
06/27/1990CN1008578B Buried interconnect for silicon
06/27/1990CN1008577B Bonding of microelectronic circuits
06/26/1990US4937707 Flexible carrier for an electronic device
06/26/1990US4937659 Interconnection system for integrated circuit chips
06/26/1990US4937658 Interconnection system for integrated circuit chips
06/26/1990US4937656 Semiconductor device
06/26/1990US4937655 Film segment having integrated circuit chip bonded thereto and fixture therefor
06/26/1990US4937653 Semiconductor integrated circuit chip-to-chip interconnection scheme
06/26/1990US4937649 Semiconductor integrated circuit having a capacitor for stabilizing a voltage at a power supplying wiring
06/26/1990US4937646 MOSFET with temperature protection
06/26/1990US4937203 Providing temporary connections for high speed testing
06/26/1990US4936950 Method of forming a configuration of interconnections on a semiconductor device having a high integration density
06/26/1990US4936930 Method for improved alignment for semiconductor devices with buried layers
06/26/1990EP0366711A4 Semiconductor casing.
06/23/1990CA2000680A1 Hybrid circuits and thick film dielectrics used therein
06/22/1990CA2003403A1 Method and apparatus for adjustably mounting a heat exchanger for an electronic component
06/21/1990CA2005038A1 Bi-level card edge connector and method of making same
06/20/1990EP0374001A1 Hardening process against ionizing radiation for active electronic components, and large hardened components
06/20/1990EP0373360A2 Method and structure for providing improved insulation in VLSI and ULSI circuits
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