Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1990
08/14/1990US4949149 Semicustom chip whose logic cells have narrow tops and wide bottoms
08/14/1990US4949148 Self-aligning integrated circuit assembly
08/14/1990US4948756 Forming two openings by etching polysilicon layer and dielectric
08/14/1990US4948754 Semiconductor substrate, electrode pads, passivation films
08/14/1990US4948459 Method of enabling electrical connection to a substructure forming part of an electronic device
08/14/1990CA1272770A1 Surface-mounted electrical device
08/10/1990CA2009723A1 High density bond pad design
08/09/1990WO1990009037A1 Electrically insulated heat pipe-type semiconductor cooling device
08/09/1990WO1990008935A1 Electric insulation type heat pipe cooler
08/09/1990DE4002538A1 Polymer-encapsulated integrated circuit - has conductors radiating outwards with their outer ends held during prodn. process on supporting edge members of heat-resistant material
08/09/1990DE4002435A1 Cellular power semiconductor device - has draught-board type array of N and P=type cells connected resp. to two areas by pair of conductive sheets
08/08/1990EP0381411A2 Methods of joining components
08/08/1990EP0381383A2 Semiconductor device having insulating substrate adhered to conductive substrate
08/08/1990EP0381242A1 Substrate used for fabrication of thick film circuit
08/08/1990EP0381111A2 Electroactive-passivation film
08/08/1990EP0381110A1 Protection layer for electroactive passivation layers
08/08/1990EP0381109A2 Moisture barrier for organic dielectrics
08/08/1990EP0381054A2 Semiconductor device package
08/08/1990EP0380964A2 Method of making a semiconductor device having a contact member
08/08/1990EP0380914A2 Antenna system
08/08/1990EP0380906A2 Tape bonded semiconductor device
08/08/1990EP0380799A1 Pressure contact semiconductor component
08/08/1990EP0380570A1 Heat dissipating interconnect tape for use in tape automated bonding
08/08/1990EP0380519A1 Ic chips with self-aligned thin film resistors
08/07/1990WO1990009035A1 Chip carrier
08/07/1990US4947237 Lead frame assembly for integrated circuits having improved heat sinking capabilities and method
08/07/1990US4947236 Semiconductor device
08/07/1990US4947235 Integrated circuit shield
08/07/1990US4947229 Semiconductor integrated circuit
08/07/1990US4947228 Integrated circuit power supply contact
08/07/1990US4947114 Method of marking semiconductor chips and markable semiconductor chip
08/07/1990US4947020 Trimming element for microelectric circuit
08/07/1990US4946733 Ink bonded to substrate by curable resin
08/07/1990US4946518 Oxidation of copper-cleaning of nickel
08/07/1990US4946376 Deposition of silver, vanadium layers on silicon wafers
08/07/1990US4946090 Seals between ceramic articles or between ceramic articles and metal articles
08/07/1990US4945954 Method and apparatus for aligning mating form tools
08/07/1990CA2026214A1 Chip carrier
08/06/1990WO1990009036A1 Method of producing heat pipe-type semiconductor cooling device
08/06/1990CA2008738A1 Cooling head for integrated circuit
08/03/1990CA2007661A1 Method and apparatus for filling high density vias
08/01/1990EP0380327A2 Structure of semiconductor device with funnel-shaped inter-level connection
08/01/1990EP0380289A2 A process of manufacturing a multi-layer ceramic substrate assembly
08/01/1990EP0380176A1 method for producing a solderable finish on metal frames for semiconductors
08/01/1990EP0379878A1 Substrate power supply contact for power integrated circuits
08/01/1990EP0379773A1 Thermally conductive electrically resistive diamond filled epoxy adhesive
08/01/1990EP0379734A1 Semiconductor device package
08/01/1990EP0379624A1 Arrangement of a semiconductor component suited for surface mounting and process for mounting it on a circuit board
08/01/1990EP0379616A1 Semiconductor componant comprising superimposed semiconductor bodies
07/1990
07/31/1990WO1990009089A1 A method of manufacturing a substrate for placement of electrical and/or electronic components
07/31/1990US4945401 Heat dissipator for semiconductor unit
07/31/1990US4945399 Electronic package with integrated distributed decoupling capacitors
07/31/1990US4945398 Overcurrent preventive diode
07/31/1990US4945204 Method of laser-marking semiconductor devices
07/31/1990US4945069 Forming organic polymer filled cavity; masking, etching; integrated circuits
07/31/1990US4944850 Tape automated bonded (tab) circuit and method for making the same
07/31/1990US4944797 Entrainment in carrier gas, melting, resolidification
07/31/1990US4944344 Hermetically sealed modular electronic cold plate utilizing reflux cooling
07/31/1990CA1272306A1 Support assembly for integrated circuits
07/31/1990CA1272259A1 Electrical termination structure
07/27/1990CA2008553A1 Arrangement of a semiconductor component suitable for surface mounting and a method for the surface mounting thereof on carrier plates
07/26/1990WO1990008400A1 Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling
07/26/1990WO1990008110A1 Devitrifying glass formulations for low expansion printed-circuit substrates and inks
07/26/1990DE3901402A1 Method for the manufacture of a chip card
07/25/1990EP0379404A2 A multilayer hybrid circuit
07/25/1990EP0379199A1 ESD protection structure
07/25/1990EP0379172A2 Epoxy resin composition and semiconductor sealing material comprising same
07/25/1990EP0379170A2 Semiconductor device comprising wiring layers
07/25/1990EP0378809A2 Semiconductor device having a multilayer interconnection structure
07/25/1990EP0378784A2 Semiconductor integrated-circuit device comprising wiring layers
07/25/1990EP0378613A1 Wafer scale integrated circuits
07/25/1990EP0123689B1 Microcircuit package and sealing method
07/25/1990CN1008900B Process and apparatus for production of clad sheets
07/24/1990US4943846 Pin grid array having seperate posts and socket contacts
07/24/1990US4943845 Thick film packages with common wafer aperture placement
07/24/1990US4943844 High-density package
07/24/1990US4943843 Semiconductor device
07/24/1990US4943842 Semiconductor device with fuse function
07/24/1990US4943841 Wiring structure for semiconductor integrated circuit device
07/24/1990US4943539 Process for making a multilayer metallization structure
07/24/1990US4943538 Programmable low impedance anti-fuse element
07/24/1990US4943470 Crystalline glass, thick film pastes, metallic conductive layers
07/24/1990US4943464 Electronic component support for memory card and product obtained thereby
07/24/1990CA1272000A1 Encapsulation of electronic components
07/20/1990CA2008025A1 Electrostatic discharge (esd) protective structure
07/19/1990DE3900512A1 Semiconductor component for a switched-mode power supply
07/19/1990CA2174678A1 Epoxy resin composition and semiconductor sealing material comprising same
07/18/1990EP0378306A2 Secure integrated circuit chip with conductive field
07/18/1990EP0378256A1 Method of hermetically sealing a container
07/18/1990EP0378211A2 Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus
07/18/1990EP0378209A2 Hybrid resin-sealed semiconductor device
07/18/1990EP0378016A1 Device for the connection of components and functional module using the same
07/18/1990EP0377932A2 Package of semiconductor integrated circuits
07/18/1990CN1044014A Semiconductor device and method of manufacturing semiconductor device
07/18/1990CN1044013A Technology for raising power transistor intermittent life
07/17/1990USRE33268 Chip carrier socket having improved contact terminals
07/17/1990US4942497 Cooling structure for heat generating electronic components mounted on a substrate
07/17/1990US4942495 Electrostatic protection device for electronic cards
07/17/1990US4942456 Plastic packaged device having a hollow portion enclosing a chip element
07/17/1990US4942455 Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame
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