Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1990
09/05/1990EP0385090A1 Heat exchanger having piezoelectric fan means
09/05/1990EP0385048A1 Substrate for hybrid integrated circuit and process for producing the same
09/05/1990EP0384939A1 Epoxy resin moulding compositions
09/05/1990EP0349549A4 Support assembly for integrated circuits
09/05/1990EP0233103B1 Cooling devices for semiconductors
09/04/1990US4954878 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
09/04/1990US4954877 Chip carrier
09/04/1990US4954875 Semiconductor wafer array with electrically conductive compliant material
09/04/1990US4954874 Electrode connected through bonding wires to exteriors
09/04/1990US4954871 Semiconductor device with composite electrode
09/04/1990US4954870 Semiconductor device
09/04/1990US4954867 Protective coatings
09/04/1990US4954480 Multi-layer superconducting circuit substrate and process for manufacturing same
09/04/1990US4954313 Method and apparatus for filling high density vias
09/04/1990US4953634 Low pressure high heat transfer fluid heat exchanger
09/04/1990US4953283 Method of handling electronic component chips
09/03/1990CA2009799A1 Heat exchanger having piezoelectric fan means
09/02/1990CA2010331A1 Low stress epoxy encapsulant compositions
08/1990
08/30/1990DE4006282A1 High speed signal transmission line for IC network - uses microstrip conductor path configuration with capacitance zones on either side of transmission line
08/30/1990DE3905875A1 Arrangement for cooling power semiconductors via heat pipes
08/30/1990DE3905657A1 Flexible supporting film
08/29/1990EP0384835A1 Process for manufacturing multilayer metal-ceramic components, and apparatus therefor
08/29/1990EP0384834A1 Process for the metallization of ceramics, and apparatus therefor
08/29/1990EP0384774A2 Semiconductor device encapsulant
08/29/1990EP0384707A2 Semiconductor device encapsulating epoxy resin composition
08/29/1990EP0384704A2 Die attach material and die attach process
08/29/1990EP0384645A1 Brazing material for forming a bond between a semiconductor wafer and a metal contact
08/29/1990EP0384599A1 Integrated circuit test structure and test process
08/29/1990EP0384586A2 High reliability plastic package for integrated circuits
08/29/1990EP0384482A2 Composite semiconductor device
08/29/1990EP0384301A2 Cooling arrangement for a transistor
08/29/1990EP0384036A2 Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste
08/29/1990EP0311641B1 Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
08/29/1990EP0225374B1 Lead frame deflashing
08/28/1990US4953173 Semiconductor device
08/28/1990US4953060 Stackable integrated circuit chip package with improved heat removal
08/28/1990US4953007 Plastic encapsulated integrated circuit package with electrostatic shield
08/28/1990US4953005 Packaging system for stacking integrated circuits
08/28/1990US4953004 Housing for a gate turn-off power thyristor (GTO)
08/28/1990US4953003 Oxidation resistance; titanium, copper and metal multilayers
08/28/1990US4953002 Semiconductor device housing with magnetic field protection
08/28/1990US4953001 Semiconductor device package and packaging method
08/28/1990US4952999 Method and apparatus for reducing die stress
08/28/1990US4952994 Input protection arrangement for VLSI integrated circuit devices
08/28/1990US4952531 Sealing glass for matched sealing of copper and copper alloys
08/28/1990US4952528 Photolithographic method for manufacturing semiconductor wiring patterns
08/28/1990US4951740 For conducting heat away from an electronic device
08/28/1990CA1273439A1 Stacked metal silicide gate structure with barrier
08/22/1990EP0383610A2 Manufacturing method of semiconductor device
08/22/1990EP0383584A2 Organic electro-conductive thin films and process for production thereof
08/22/1990EP0383296A2 Method of producing a semiconductor device package
08/22/1990EP0383025A1 Device for enclosing of electrical or electronical components or component groups and enclosing of electrical or electronical components or component groups
08/22/1990EP0382948A1 Supply pin rearrangement for an integrated circuit
08/22/1990EP0382714A1 Process for manufacturing plastic pin grid arrays and the product produced thereby
08/22/1990CN1044869A Multi-layer superconducting circuit substrate and process for manufacturing same
08/22/1990CA2010440A1 Process and device for metalizing ceramics
08/22/1990CA2010432A1 Process and apparatus for making multilayered cermet components
08/21/1990US4951124 Semiconductor device
08/21/1990US4951123 Integrated circuit chip assembly utilizing selective backside deposition
08/21/1990US4951122 Resin-encapsulated semiconductor device
08/21/1990US4951120 Lead frame and semiconductor device using the same
08/21/1990US4951119 Lead frame for semiconductor devices
08/21/1990US4951116 Read-only memory with identification pattern
08/21/1990US4951101 Diamond shorting contact for semiconductors
08/21/1990US4951011 Impedance matched plug-in package for high speed microwave integrated circuits
08/21/1990US4950866 Method and apparatus of bonding insulated and coated wire
08/21/1990US4950857 Solid state ceramic microwave heating susceptor compositions with metal salt moderators
08/21/1990US4950843 Mounting structure for semiconductor device
08/21/1990US4950623 Method of building solder bumps
08/21/1990US4950427 Transistor device
08/21/1990US4950181 Low thermal conductance electrical connection apparatus
08/21/1990US4949455 I/O pin and method for making same
08/21/1990US4949453 Method of making a chip carrier with terminating resistive elements
08/21/1990CA1273007A1 Gas heat exchanger and method of making
08/16/1990EP0382504A2 Semiconductor integrated circuit having interconnection with improved design flexibility
08/16/1990EP0382445A2 High density bond pad design
08/16/1990EP0382397A1 Cooling head for integrated circuit
08/16/1990EP0382203A2 Ceramic package type semiconductor device and method of assembling the same
08/16/1990EP0382163A1 A reservoir tank for a liquid cooling system
08/16/1990EP0382080A2 Bump structure for reflow bonding of IC devices
08/16/1990EP0381849A1 Fast power semiconductor circuit
08/16/1990EP0381745A1 Low inductance decoupling capacitor
08/16/1990DE3937502A1 Insulating or field-screening structure - for IC semiconductor devices
08/14/1990US4949225 Circuit board for mounting electronic components
08/14/1990US4949224 Structure for mounting a semiconductor device
08/14/1990US4949223 Electronic component encapsulated in a package and electronic apparatus using thereof
08/14/1990US4949220 Hybrid IC with heat sink
08/14/1990US4949219 Module sealing structure
08/14/1990US4949212 Circuit configuration for protecting an integrated circuit
08/14/1990US4949164 Semiconductor cooling apparatus and cooling method thereof
08/14/1990US4949163 Semiconductor integrated circuit device particularly for high speed logic operations
08/14/1990US4949162 Semiconductor integrated circuit with dummy pedestals
08/14/1990US4949161 Interdigitized leadframe strip
08/14/1990US4949160 Semiconductor device
08/14/1990US4949158 Semiconductor device
08/14/1990US4949157 Large scale integrated circuit
08/14/1990US4949155 Tape carrier for semiconductor chips
08/14/1990US4949153 Semiconductor IC device with polysilicon resistor
08/14/1990US4949151 Bipolar transistor having side wall base and collector contacts
08/14/1990US4949150 Programmable bonding pad with sandwiched silicon oxide and silicon nitride layers
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