| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/21/2013 | CN103258799A Diode mounting bracket used for helicopter |
| 08/21/2013 | CN103258791A Method and relevant device for achieving metal mutual connection through preparation of micro-protruding-points with superfine spaces |
| 08/21/2013 | CN103258785A Methods for making porous insulating films and semiconductor devices including the same |
| 08/21/2013 | CN103258782A Method for fabrication of semiconductor structure including interposer, and related structure and device |
| 08/21/2013 | CN103258779A Copper interconnection structure and manufacturing method thereof |
| 08/21/2013 | CN103258762A Substrate bonding apparatus and substrate bonding method |
| 08/21/2013 | CN103258750A Semiconductor device and method of manufacturing same |
| 08/21/2013 | CN103258746A 球栅结构 Ball grid structure |
| 08/21/2013 | CN103257527A Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer and semiconductor device |
| 08/21/2013 | CN102456677B Packaging structure for ball grid array and manufacturing method for same |
| 08/21/2013 | CN102332439B Processing technology of copper-based bonding wire with anti-oxidation coating |
| 08/21/2013 | CN102272924B Radiation substrate for power LED and power LED product and manufacturing method thereof |
| 08/21/2013 | CN102237329B Chip structure, chip bonding structure and manufacturing methods for chip structure and chip bonding structure |
| 08/21/2013 | CN102163596B Integrated circuit device and its forming method |
| 08/21/2013 | CN102163592B Semiconductor structure and a method of manufacturing the same, method for preparing baffle with air-gap pattern |
| 08/21/2013 | CN102148201B Semiconductor element, packaging structure and forming method of semiconductor element |
| 08/21/2013 | CN102099908B Getter precursors for hermetically sealed packaging |
| 08/21/2013 | CN102074535B Electronic chip and substrate for providing insulating protection among conductive points |
| 08/21/2013 | CN102067310B Stacking of wafer-level chip scale packages having edge contacts and manufacture method thereof |
| 08/21/2013 | CN101958291B Electronic control unit |
| 08/21/2013 | CN101950728B Metal pillar bump structure and method of forming same |
| 08/21/2013 | CN101906288B Thermal interface material, electronic device with same and preparation method |
| 08/21/2013 | CN101800238B Organic electroluminescence device |
| 08/21/2013 | CN101767765B Micro electromechanical element with protective ring and manufacture method thereof |
| 08/21/2013 | CN101743283B Resin composition and its use |
| 08/21/2013 | CN101689537B Cooling box for components or circuits |
| 08/21/2013 | CN101593764B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/21/2013 | CN101532626B Light-emitting-diode backlight device |
| 08/21/2013 | CN101527131B Apparatus and method for distinguishing panel of display device |
| 08/21/2013 | CN101447441B Integrated circuit package system including die having relieved active region |
| 08/21/2013 | CN101355076B Integrated circuit having a semiconductor substrate with a barrier layer |
| 08/21/2013 | CN101313092B Interconnects and heat dissipators based on nanostructures |
| 08/21/2013 | CN101034736B Light emitting element, light emitting device, and electronic device |
| 08/20/2013 | US8514308 Semiconductor device and method of manufacturing the same, and electronic apparatus |
| 08/20/2013 | US8514203 Flexible calibration device for touch sensor panel calibration |
| 08/20/2013 | US8513823 Semiconductor package having main stamp and sub-stamp |
| 08/20/2013 | US8513821 Overlay mark assistant feature |
| 08/20/2013 | US8513820 Package substrate structure and chip package structure and manufacturing process thereof |
| 08/20/2013 | US8513819 Low loop wire bonding |
| 08/20/2013 | US8513818 Semiconductor device and method for fabricating the same |
| 08/20/2013 | US8513817 Memory module in a package |
| 08/20/2013 | US8513816 Film for flip chip type semiconductor back surface containing thermoconductive filler |
| 08/20/2013 | US8513815 Implementing integrated circuit mixed double density and high performance wire structure |
| 08/20/2013 | US8513814 Buffer pad in solder bump connections and methods of manufacture |
| 08/20/2013 | US8513813 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 08/20/2013 | US8513812 Semiconductor device and method of forming integrated passive device |
| 08/20/2013 | US8513811 Electronic device and method for connecting a die to a connection terminal |
| 08/20/2013 | US8513810 Semiconductor device and method of manufacturing same |
| 08/20/2013 | US8513809 Semiconductor device |
| 08/20/2013 | US8513808 Semiconductor device having trench-isolated element formation region |
| 08/20/2013 | US8513806 Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device |
| 08/20/2013 | US8513805 Manufacturing of a semiconductor device and the manufacturing method |
| 08/20/2013 | US8513804 Nanotube-based electrodes |
| 08/20/2013 | US8513803 Semiconductor device and stacked semiconductor device |
| 08/20/2013 | US8513802 Multi-chip package having semiconductor chips of different thicknesses from each other and related device |
| 08/20/2013 | US8513801 Integrated circuit package system |
| 08/20/2013 | US8513800 Semiconductor device and method for manufacturing the same |
| 08/20/2013 | US8513799 Method of electrically connecting a microelectronic component |
| 08/20/2013 | US8513798 Power semiconductor chip package |
| 08/20/2013 | US8513797 Stacked semiconductor component having through wire interconnect (TWI) with compressed wire |
| 08/20/2013 | US8513796 Package structure, fabricating method thereof, and package-on-package device thereby |
| 08/20/2013 | US8513795 3D IC configuration with contactless communication |
| 08/20/2013 | US8513794 Stacked assembly including plurality of stacked microelectronic elements |
| 08/20/2013 | US8513793 Stacked semiconductor package and method of fabricating the same |
| 08/20/2013 | US8513792 Package-on-package interconnect stiffener |
| 08/20/2013 | US8513791 Compact multi-port CAM cell implemented in 3D vertical integration |
| 08/20/2013 | US8513789 Edge connect wafer level stacking with leads extending along edges |
| 08/20/2013 | US8513788 Integrated circuit packaging system with pad and method of manufacture thereof |
| 08/20/2013 | US8513787 Multi-die semiconductor package with one or more embedded die pads |
| 08/20/2013 | US8513786 Pre-bonded substrate for integrated circuit package and method of making the same |
| 08/20/2013 | US8513785 Method of manufacturing a semiconductor device |
| 08/20/2013 | US8513784 Multi-layer lead frame package and method of fabrication |
| 08/20/2013 | US8513783 Semiconductor device |
| 08/20/2013 | US8513782 Shielding device |
| 08/20/2013 | US8513780 Semiconductor device having inter-level dielectric layer with hole-sealing and method for manufacturing the same |
| 08/20/2013 | US8513778 Semiconductor device |
| 08/20/2013 | US8513777 Method and apparatus for generating reticle data |
| 08/20/2013 | US8513776 Semiconductor device and method capable of scribing chips with high yield |
| 08/20/2013 | US8513770 Anti-fuse and method for forming the same, unit cell of non volatile memory device with the same |
| 08/20/2013 | US8513769 Electrical fuses and resistors having sublithographic dimensions |
| 08/20/2013 | US8513768 Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same |
| 08/20/2013 | US8513767 Package interconnects |
| 08/20/2013 | US8513763 Silicon carbide semiconductor device |
| 08/20/2013 | US8513738 ESD field-effect transistor and integrated diffusion resistor |
| 08/20/2013 | US8513737 ESD protection element |
| 08/20/2013 | US8513707 RF CMOS transistor design |
| 08/20/2013 | US8513696 Lateral thermal dissipation LED and fabrication method thereof |
| 08/20/2013 | US8513672 Wafer precursor prepared for group III nitride epitaxial growth on a composite substrate having diamond and silicon carbide layers, and semiconductor laser formed thereon |
| 08/20/2013 | US8513663 Signal repowering chip for 3-dimensional integrated circuit |
| 08/20/2013 | US8513542 Integrated circuit leaded stacked package system |
| 08/20/2013 | US8513140 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device |
| 08/20/2013 | US8513129 Planarizing etch hardmask to increase pattern density and aspect ratio |
| 08/20/2013 | US8513111 Forming semiconductor structures |
| 08/20/2013 | US8513109 Method of manufacturing an interconnect structure for a semiconductor device |
| 08/20/2013 | US8513061 Method of fabricating a TSV for 3D packaging of semiconductor device |
| 08/20/2013 | US8513058 Semiconductor device and method for producing the same |
| 08/20/2013 | US8512856 Method for producing wiring board and wiring board |
| 08/20/2013 | US8511569 RFID integrated circuit to strap mounting system |
| 08/15/2013 | WO2013119868A1 LIGHT TRANSMITTIVE AlN LAYERS AND ASSOCIATED DEVICES AND METHODS |
| 08/15/2013 | WO2013119643A1 Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module |