Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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10/03/1990 | EP0390542A2 IC carrier |
10/03/1990 | EP0390274A1 Semiconductor device comprising unidimensional doping conductors and method of manufacturing such a semiconductor device |
10/03/1990 | EP0390038A2 Fine Pattern forming method |
10/03/1990 | EP0389826A1 Arrangement of semiconductor devices and method of and apparatus for mounting semiconductor devices |
10/03/1990 | EP0389678A1 Method of making a surface mountable electronic device |
10/03/1990 | EP0191037B1 Semiconductor-on-insulator (soi) devices and soi ic fabrication method |
10/03/1990 | CN1009886B Protecting device of semiconductor detector |
10/02/1990 | USH832 Planar monolithic self-oscillating mixer |
10/02/1990 | US4961125 Apparatus and method of attaching an electronic device package and a heat sink to a circuit board |
10/02/1990 | US4961107 Electrically isolated heatsink for single-in-line package |
10/02/1990 | US4961106 Metal packages having improved thermal dissipation |
10/02/1990 | US4961105 Reinforcing layer with metal-silicon alloy |
10/02/1990 | US4961104 Multi-level wiring structure of semiconductor device |
10/02/1990 | US4960751 Heat, oxidation resistance film with maximum performance |
10/02/1990 | US4960729 Amorphous silicon layer contacting patterned metal layers at an aperture |
10/02/1990 | US4960725 Semiconductor device and manufacturing process for providing device regions on the semiconductor device and isolation regions to isolate the device regions from each other. |
10/02/1990 | US4960613 Decomposition of catalyst source to provide layer of electro-less plating catalyst on buffer layer; depositing plating metal in uniform pattern |
10/02/1990 | US4959900 Mounting of electronic microcomponents on a support |
10/02/1990 | CA1274880A1 Method of fabricating a freestanding semiconductor connection |
09/30/1990 | CA2013229A1 Ic carrier |
09/29/1990 | CA2003628A1 Method of making a surface mountable electronic device |
09/27/1990 | DE4007895A1 Verfahren zum reduzieren der hot-electron-degradation in halbleiterbauelementen A method for reducing the hot-electron-degradation in semiconductor devices |
09/27/1990 | DE3909244A1 Method for producing customer-specific printed circuits |
09/27/1990 | DE3908794A1 Monolithically integrated circuit arrangement |
09/26/1990 | EP0389195A2 A process of forming a patterned polyimide film and articles including such a film |
09/26/1990 | EP0389171A2 Mobile ion getterer for metal conductors |
09/26/1990 | EP0389170A2 Method for fabricating electronic devices |
09/26/1990 | EP0389169A2 Ceramic multilayer package |
09/26/1990 | EP0389040A1 Substrate comprising interconnection structures |
09/26/1990 | EP0389039A1 Carrier body with elevated contact portions, a method of manufacturing such a carrier body and a display device comprising such a carrier body |
09/26/1990 | EP0388933A2 Alloy bonded indium bumps and methods of processing same |
09/26/1990 | EP0388862A2 Fabrication method of a semiconductor device having a planarized surface |
09/26/1990 | EP0222795B1 Polycide process in semiconductor fabrication |
09/25/1990 | US4959751 Ceramic hybrid integrated circuit having surface mount device solder stress reduction |
09/25/1990 | US4959745 Capacitor and method for producing the same |
09/25/1990 | US4959708 MOS integrated circuit with vertical shield |
09/25/1990 | US4959706 Integrated circuit having an improved bond pad |
09/25/1990 | US4959704 Semiconductor integrated circuit device |
09/25/1990 | US4959507 Rough surfaced copper sheet bonded to ceramic |
09/25/1990 | US4959329 Semiconductor device |
09/25/1990 | US4959278 Indium undercoat |
09/25/1990 | CA1274461A1 Laminated sheet material for packaging electronic components |
09/20/1990 | WO1990010951A1 Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof |
09/20/1990 | WO1990010731A1 Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
09/20/1990 | DE3908996A1 Liquid heat sink and method for fabricating it |
09/20/1990 | DE3908083A1 Silicon semiconductor component |
09/19/1990 | EP0388341A2 Method and apparatus for causing an open circuit in a conductive line |
09/19/1990 | EP0388312A2 Chip carrier with improved flexing characteristic |
09/19/1990 | EP0388311A2 Chip Carrier |
09/19/1990 | EP0388217A1 Circuit protection apparatus |
09/19/1990 | EP0388179A2 Semiconductor device having multilayer wiring and the method of making it |
09/19/1990 | EP0388157A1 Ceramic lid for sealing semiconductor element and method of sealing a semiconductor element in a ceramic package |
09/19/1990 | EP0388075A2 Contacts for semiconductor devices |
09/19/1990 | EP0388011A2 Method of manufacturing a semiconductor device. |
09/19/1990 | EP0388009A1 Method for forming via holes in polymer materials |
09/19/1990 | EP0387955A1 Package for hyperfrequency integrated circuit |
09/19/1990 | EP0387887A2 Semiconductor device suitable for cutting or joining inter connection layer by charged particles and method of manufacturing the same |
09/19/1990 | EP0387835A2 Semiconductor device and method of manufacturing the same |
09/19/1990 | EP0387554A2 Liquid epoxy polymer composition and use thereof |
09/19/1990 | EP0314707A4 Wire bonds and electrical contacts of an integrated circuit device |
09/19/1990 | CN2062499U Silicon plane low temp. coefficient regulator tube |
09/19/1990 | CN1045486A Supply pin rearrangement for ic |
09/18/1990 | US4958258 Modular hybrid microelectronic structures with high density of integration |
09/18/1990 | US4958222 Semiconductor integrated circuit device |
09/18/1990 | US4958216 Package for housing semiconductor elements |
09/18/1990 | US4958215 Press-contact flat type semiconductor device |
09/18/1990 | US4958214 Protective carrier for semiconductor packages |
09/18/1990 | US4958210 High voltage integrated circuits |
09/18/1990 | US4958200 Overcurrent protection circuit for semiconductor device |
09/18/1990 | US4958092 Integrated circuit device having row structure with clock driver at end of each row |
09/18/1990 | US4957960 For electronic devices; curable silicone resin and as an ion scavenger compound a calixarene or oxacalixarene compound, a silacrown or polyalkylene ether derivative |
09/18/1990 | US4957899 Method of patterning superconducting oxide thin films |
09/18/1990 | US4957882 Method for manufacturing semiconductor device |
09/18/1990 | US4957876 Resin sealed semiconductor device and a method for making the same |
09/18/1990 | US4957590 Method for forming local interconnects using selective anisotropy |
09/17/1990 | CA2012338A1 Chip carrier |
09/17/1990 | CA2012337A1 Chip carrier |
09/14/1990 | CA2006229A1 Method and apparatus for causing an open circuit in a conductive line |
09/12/1990 | EP0387098A2 Process for making a multilevel interconnection structure |
09/12/1990 | EP0387066A1 Process for connecting circuits and adhesive film used therefor |
09/12/1990 | EP0386709A2 Noble metal-free chip conductor bridge and method for its production |
09/12/1990 | EP0386473A2 Drop-covering mass for electric and electronic devices |
09/12/1990 | EP0386103A1 Cooling body for an electric circuit card and method to arrange such a cooling body in an electronic unit |
09/12/1990 | EP0385979A1 High-density electronic modules, process and product. |
09/12/1990 | EP0252814B1 Process for the programmable laser linking of two superposed conductors of an integrated-circuit interconnection network, and resulting integrated circuit |
09/12/1990 | CN2062116U Large power semiconductor cooling device |
09/11/1990 | US4956749 Interconnect structure for integrated circuits |
09/11/1990 | US4956697 Microwave monolithic integrated circuit with heat radiating electrode |
09/11/1990 | US4956696 Compression loaded semiconductor device |
09/11/1990 | US4956695 Three-dimensional packaging of focal plane assemblies using ceramic spacers |
09/11/1990 | US4956694 Integrated circuit chip stacking |
09/11/1990 | US4955131 Method of building a variety of complex high performance IC devices |
09/07/1990 | WO1990010308A1 Explosively formed electronic packages and method of manufacture |
09/06/1990 | CA2011164A1 Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof |
09/05/1990 | EP0385787A2 Method of producing connection electrodes |
09/05/1990 | EP0385736A2 Epoxy encapsulant compositions and low stress additives therefor |
09/05/1990 | EP0385702A2 Method for electrically detecting positional deviation of contact hole in semiconductor device |
09/05/1990 | EP0385605A2 Integrated circuit/heat sink interface device |
09/05/1990 | EP0385578A1 Connector for integrated circuit packages |
09/05/1990 | EP0385149A2 Photocurable adhesive composition and use thereof |