Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1990
10/30/1990US4967262 Gull-wing zig-zag inline lead package having end-of-package anchoring pins
10/30/1990US4967261 Tape carrier for assembling an IC chip on a substrate
10/30/1990US4967260 Hermetic microminiature packages
10/30/1990US4967259 Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same
10/30/1990US4967258 Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same
10/30/1990US4967201 Multi-layer single substrate microwave transmit/receive module
10/30/1990US4966857 Data carrier having an integrated circuit and a method for producing same
10/30/1990US4966226 Composite graphite heat pipe apparatus and method
10/30/1990US4966142 Indium bonding alloys
10/30/1990CA1275560C Sintered body having high heat-conductivity and method of manufacturing thereof
10/25/1990DE3913123A1 Generation of recombination centres in semiconductor devices - by electron beam irradiation then stabilisation in medium temp. anneal after metallisation
10/25/1990DE3912893A1 Semiconductor module as micro-pack assembly - has rear contact forming substrate terminal on side from circuit board contacts
10/24/1990EP0394054A1 Method of manufacturing siliconboron nitride film having excellent step coverage characteristic
10/24/1990EP0393997A2 Method of providing a variable-pitch leadframe assembly
10/24/1990EP0393765A2 Circuit card assembly cold plate
10/24/1990EP0393757A1 Semiconductor device having semiconductor body embedded in an envelope made of synthetic material
10/24/1990EP0393682A2 Semiconductor integrated circuit device
10/24/1990EP0393635A2 Semiconductor device having multi-level wirings
10/24/1990EP0393584A2 High frequency semiconductor device
10/24/1990EP0393220A1 Integrated circuit package
10/24/1990EP0393162A1 Plasma-nitridated self-aligned tungsten system for vlsi interconnections
10/24/1990CA2015118A1 Isolated metallic substrates and manufacturing method
10/24/1990CA2014911A1 Method of processing siloxane-polyimides for electronic packaging applications
10/23/1990US4965702 Chip carrier package and method of manufacture
10/23/1990US4965700 Thin film package for mixed bonding of chips
10/23/1990US4965699 Circuit card assembly cold plate
10/23/1990US4965660 Integrated circuit package having heat sink bonded with resinous adhesive
10/23/1990US4965659 High thermoconductivity and strength, used in high power transistors or laser diodes
10/23/1990US4965658 System for mounting and cooling power semiconductor devices
10/23/1990US4965657 Resin encapsulated semiconductor device
10/23/1990US4965656 Semiconductor device
10/23/1990US4965654 Semiconductor package with ground plane
10/23/1990US4965653 Semiconductor device and method of mounting the semiconductor device
10/23/1990US4965652 Dielectric isolation for high density semiconductor devices
10/23/1990US4965646 Thin film transistor and crossover structure for liquid crystal displays
10/23/1990US4965642 Semiconductor device having a laser printable envelope
10/23/1990US4965589 Recording head having spaced-apart electrodes
10/23/1990US4965577 Semiconductor integrated circuit device having a wiring layout to avoid intersections between analog signal wiring layers and digital signal wiring layers
10/23/1990US4965526 Hybrid amplifier
10/23/1990US4965226 Passivation, covering, anisotropically etching
10/23/1990US4965213 Doping, masking, siliciding, annealing
10/23/1990US4964458 Flexible finned heat exchanger
10/23/1990US4964198 V-shaped clip for attaching a semiconductor device to a heat sink
10/18/1990WO1990012483A1 High-density, multi-level interconnects, flex circuits, and tape for tab
10/18/1990WO1990012422A1 G-tab manufacturing process and the product produced thereby
10/18/1990WO1990012420A1 Dielectric substrate with reduced and stabilized surface electrical conductivity, process for its manufacture, and use of the substrate
10/18/1990DE3912152A1 Arrangement for cooling tube heat pipe - having metal block with bore, heat absorbing-emitting region, isolation section and connecting means
10/17/1990EP0392539A2 Semiconductor device package and sealing method therefore
10/17/1990EP0392461A2 Thermistor made of diamond
10/17/1990EP0392364A2 Method of manufacturing a semiconductor device
10/17/1990EP0392242A2 Module assembly with intergrated semiconductor chip and chip carrier
10/17/1990EP0392109A2 Heat-conductive composite material
10/17/1990EP0391979A1 Uses of uniaxially electrically conductive articles
10/17/1990EP0391926A1 An arrangement for deactivating integrated circuits electrically
10/17/1990CN1010067B Method for manufacturing radiating device and using it production radiator
10/16/1990US4964019 Multilayer bonding and cooling of integrated circuit devices
10/16/1990US4963976 Integrated electrical conducting, cooling and clamping assembly for power semiconductors
10/16/1990US4963975 Semiconductor device
10/16/1990US4963924 Linewidth loss measurement
10/16/1990US4963893 Thermoconductive resin support with heat resistant layer and protective coating of amorphous silicon material
10/16/1990US4963701 Circuit board
10/16/1990US4963511 Method of reducing tungsten selectivity to a contact sidewall
10/16/1990US4963510 Method and apparatus for providing interconnection between metallization layers on semiconductors devices
10/16/1990US4963500 Determining contaminants by measuring degradation of carrier lifetime
10/16/1990US4963414 Core of rigid graphite crystals bound together by pitch having a metallic sheet adhered to the surface
10/16/1990US4963291 Insulating electromagnetic shielding resin composition
10/16/1990US4963233 Glass conditioning for ceramic package plating
10/16/1990US4963187 Metallizing paste for circuit board having low thermal expansion coefficient
10/16/1990US4963002 Adhesively joining semiconductor chip to substrate
10/16/1990CA1275332C Multilayer contact structure
10/16/1990CA1275331C Recessed semiconductor device
10/16/1990CA1275235C Method of fabricating multilayer structures with nonplanar surfaces
10/11/1990DE4008624A1 Mfg. hybrid semiconductor structure - depositing insulating, photo-hardenable adhesive film of surface(s) of support plate substrate
10/11/1990DE3911657A1 Semiconductor component with metallising on basic body - consists of four different materials for switching active semiconductor regions
10/10/1990EP0391790A1 Method of manufacturing an electronic module
10/10/1990EP0391708A2 Backside metallization scheme for semiconductor devices
10/10/1990EP0391562A2 Semiconductor devices incorporating a tungsten contact and fabrication thereof
10/10/1990EP0391418A1 A diamond for a wire drawing die, dresser or heat-sink, a process for its manufacture, and a wire drawing die made therefrom
10/10/1990EP0391105A2 Circuit board for optimum decoupling of circuits with digital IC's
10/10/1990EP0391057A2 Thermal shunt for electronic circuits
10/10/1990EP0390996A2 IC card module
10/10/1990EP0390891A1 Method of forming holes in ceramic ic packages.
10/09/1990US4962481 EEPROM device with plurality of memory strings made of floating gate transistors connected in series
10/09/1990US4962476 Semiconductor memory device having bit lines less liable to have influences of the adjacent bit lines
10/09/1990US4962444 Cold chassis for cooling electronic circuit components on an electronic board
10/09/1990US4962416 Electronic package with a device positioned above a substrate by suction force between the device and heat sink
10/09/1990US4962415 IC card
10/09/1990US4962414 Method for forming a contact VIA
10/09/1990US4962365 Integrated circuit trench resistor
10/09/1990US4962294 Method and apparatus for causing an open circuit in a conductive line
10/09/1990US4962061 Method for manufacturing a multilayer wiring structure employing metal fillets at step portions
10/09/1990US4962060 Patterned refractory core; sidewall spacers
10/09/1990US4961987 Multilayer printed circuits group 4a, 5a or 6a borides and/or group 4a or 5a nitrides
10/09/1990US4961984 Copper foil wiring, crystallization, annealing, cooling, elongation, hardness
10/09/1990US4961528 Bonding flame spraying aluminum, thermocompression
10/04/1990WO1990011629A1 Memory metal electrical connector
10/04/1990WO1990011617A1 Resin-coated bonding wire, method of producing the same and semiconductor device
10/04/1990DE4009088A1 Multi-fibre output coupler for applying laser beams to workpiece - has X-shaped body to receive fibres and screw spring mechanism in slot to adjust spacing and angle of fibres w.r.t. each other
10/04/1990DE3910699A1 Printed circuit board for integrated circuits
10/03/1990EP0390598A2 Metallized aluminum nitride substrate
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