Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1990
11/27/1990US4974057 Semiconductor device package with circuit board and resin
11/27/1990US4974056 Stacked metal silicide gate structure with barrier
11/27/1990US4974055 Self-aligned interconnects for semiconductor devices
11/27/1990US4974053 Semiconductor device for multiple packaging configurations
11/27/1990US4974052 Plastic packaged semiconductor device
11/27/1990US4974051 MOS transistor with improved radiation hardness
11/27/1990US4974049 Semiconductor integrated circuit configured by using polycell technique
11/27/1990US4974048 Integrated circuit having reroutable conductive paths
11/27/1990US4974041 Integrated circuit structure with multiple common planes and method of forming the same
11/27/1990US4973563 Process for preserving the surface of silicon wafers
11/27/1990US4973562 Method of manufacturing a semiconductor device having interconnections located both above a semiconductor region and above an isolation region adjoining it
11/22/1990EP0398628A2 Semiconductor memory device
11/22/1990EP0398605A2 Metal-interconnected integrated circuit chip
11/22/1990EP0398597A2 Improved hybrid package arrangement
11/22/1990EP0398506A2 Electrical socket for tab IC's
11/22/1990EP0398485A1 A method of making a Flip Chip Solder bond structure for devices with gold based metallisation
11/22/1990EP0398108A1 Plastic housing and semiconductor power module having this housing
11/22/1990EP0398088A1 A semiconductor device for detecting or emitting a magnetic line of force or light and a mold for molding a package
11/22/1990EP0397898A1 Bipolar Bump transistor and method for its manufacture
11/22/1990EP0397780A1 Ic with means for reducing esd damage
11/22/1990EP0397747A1 Three-dimensional circuit component assembly and method corresponding thereto
11/22/1990EP0089891B1 Identification of repaired integrated circuits
11/20/1990US4972294 Heat sink clip assembly
11/20/1990US4972253 Programmable ceramic high performance custom package
11/20/1990US4972251 Multilayer glass passivation structure and method for forming the same
11/20/1990US4972250 Multilayer element, passivation covering of sputtered carbon, diamond like carbon, diamonds formed by vapor deposition
11/20/1990US4972237 Metal-semiconductor field effect transistor device
11/20/1990US4972043 For a semiconductor device
11/20/1990US4971931 Diffuser features for spin-coated films
11/20/1990US4971930 EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof
11/20/1990US4971196 Surface package type semiconductor package
11/20/1990US4971144 Liquid ribbon cooler
11/20/1990US4970868 Apparatus for temperature control of electronic devices
11/20/1990US4970780 Printed circuits, coating with an electroconductive curable coating, curing to a rubber, pressing, lamination
11/16/1990WO1990014751A1 Interconnect device and method of manufacture thereof
11/16/1990CA2033060A1 Interconnect device and method of manufacture thereof
11/16/1990CA2016918A1 Transistor provided with a current detecting function
11/15/1990WO1990013991A1 Method of grounding an ultra high density pad array chip carrier
11/15/1990WO1990013914A1 Lead frame for semiconductor devices
11/15/1990WO1990013913A1 Method of making a hermetic seal in a solid-state device
11/14/1990EP0397462A2 Contact structure for semiconductor integrated circuits
11/14/1990EP0397396A2 Resin composition for sealing semiconductors
11/14/1990EP0397395A2 Resin composition for sealing semiconductors
11/14/1990EP0397393A2 Low stress light-emitting diode mounting package
11/14/1990EP0397391A2 Chip package capacitor cover
11/14/1990EP0397320A2 Encapsulated integrated circuit with lead frame
11/14/1990EP0397017A2 Device for protecting semiconductor circuits against transients on the supply line
11/14/1990EP0396806A1 Glass-ceramic structure and method for making same
11/14/1990EP0396641A1 Acceleration-resistant packaging for integrated circuits and process for manufacturing it.
11/14/1990CN2065795U Static electricity proof device for mos ic
11/13/1990US4970579 Integrated circuit package with improved cooling means
11/13/1990US4970578 Selective backside plating of GaAs monolithic microwave integrated circuits
11/13/1990US4970577 Semiconductor chip module
11/13/1990US4970576 Power semiconductor module and method for producing the module
11/13/1990US4970575 Thermal expansion coefficient
11/13/1990US4970574 Gold, tungsten, tungsten-titanium alloy
11/13/1990US4970573 Interconnect structure for a semiconductor device
11/13/1990US4970572 Semiconductor integrated circuit device of multilayer interconnection structure
11/13/1990US4970570 Use of tapered head pin design to improve the stress distribution in the braze joint
11/13/1990US4970569 Nickel based material for a semiconductor apparatus
11/13/1990US4970568 Semiconductor device and a process for producing a semiconductor device
11/13/1990US4970454 Packaged semiconductor device with test circuits for determining fabrication parameters
11/13/1990US4970411 Arrangement for improving the longterm stability of a Hall element
11/13/1990US4970177 Corrosion resistant wiring
11/13/1990US4970175 Method of manufacturing a semiconductor device using SEG and a transitory substrate
11/13/1990US4970107 Composite article comprising a copper element and a process for producing it
11/13/1990US4969828 Electrical socket for TAB IC's
11/13/1990US4969511 Substrate thermal interface employing helium gap
11/13/1990CA1276088C Enhanced adhesion between metals and polymers
11/12/1990CA2016645A1 Resin composition for sealing semiconductors
11/12/1990CA2016626A1 Resin composition for sealing semiconductors
11/08/1990DE3914527A1 Liquid crystal display combined with integrated circuit controller - has electrical conductors and integrated circuit attached to glass encapsulation of liquid crystal
11/08/1990DE3913066A1 Hermetically sealed housing for electronic circuits - has edge sealed by soldered layer that bonds cover to surface of circuit board with screen printed coating
11/08/1990DE3912891A1 IC mount and contacts for credit card - with flush contacts for electronic reader and pref. PVC carrier foil
11/07/1990EP0396522A2 Universal electrical interconnection system and method
11/07/1990EP0396484A2 Solder column connection
11/07/1990EP0396248A2 Electrical pin and method for making same
11/07/1990EP0396203A2 Encapsulating semiconductors
11/07/1990EP0396152A1 Semiconductor device comprising a package
11/07/1990EP0395862A2 Semiconductor device comprising a lead member
11/07/1990EP0395772A1 Semiconductor device metallization process
11/06/1990USH842 Metal conductor structure having low electro-migration at high currents for semiconductor devices
11/06/1990US4969029 Cellular integrated circuit and hierarchial method
11/06/1990US4968645 Method for manufacturing MOS/CMOS monolithic integrated circuits including silicide and polysilicon patterning
11/06/1990US4968643 Aluminum or alloy
11/06/1990US4968637 Titanium-tungsten, semiconductors
11/06/1990US4967832 Cooling method and apparatus for integrated circuit chips
11/01/1990WO1990013143A1 Metallized wafer-shaped substrate chip carriers
11/01/1990WO1990013140A1 Selective tungsten interconnection for yield enhancement
11/01/1990WO1990012769A2 Heat-sink structures with increased heat dissipation capacity and methods for the production of such structures
10/1990
10/31/1990EP0395560A2 Multilayered intermetallic connection for semiconductor devices
10/31/1990EP0395544A1 Insulated metallic substrates and method of making these substrates
10/31/1990EP0395072A2 Bonding pad used in semiconductor device
10/31/1990EP0394878A2 Semiconductor device having multi-layered wiring structure
10/31/1990EP0394767A2 Dielectric for planarization
10/31/1990EP0394757A2 Method for fabrication of active semiconductor structures using basic structures with surface-parallel 2D-charge carrier layer
10/31/1990EP0394722A2 Multilevel metallization for VLSI and method for forming the same
10/31/1990DE3913488A1 Casting compsn. e.g. for encapsulating semiconductor - contg. cyclo-aliphatic and/or novolak epoxide] resin, methyl-nadic anhydride, imidazole and filler
10/31/1990CN2064941U Base plate for semiconductor equipment and integrated circuit
10/30/1990US4967396 Semiconductor integrated circuit device
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