Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1990
12/19/1990EP0402793A2 Hybrid integrated circuit device
12/19/1990EP0402756A2 Process of forming bump on electrode of semiconductor chip and apparatus used therefor
12/19/1990EP0402614A1 Circuit module with convection cooling by a coolant flowing between a heat producing component and the face of a piston
12/19/1990EP0402592A2 Master slice semiconductor device and method of forming it
12/19/1990EP0402368A1 Cvd process for depositing a layer on an electrically conductive thin-layer structure.
12/19/1990EP0236493B1 Microelectronic package
12/19/1990CN2067865U Ic chip type base for moisture-sensitive element
12/19/1990CN1047939A Method for improving adhesion of plastic encapsulant to copper containing leadframes
12/19/1990CN1010908B Mfg. process for common-grounded packaging semiconductor device
12/18/1990US4979019 Printed circuit board with inorganic insulating matrix
12/18/1990US4979018 Semiconductor device with parallel multiplier using at least three wiring layers
12/18/1990US4979017 Semiconductor element string structure
12/18/1990US4979016 Split lead package
12/18/1990US4979015 Insulated substrate for flip-chip integrated circuit device
12/18/1990US4978830 Laser trimming system for semiconductor integrated circuit chip packages
12/18/1990US4978638 Method for attaching heat sink to plastic packaged electronic component
12/18/1990US4978637 Patterning multilayers of a metal conductor and polycrystal-line silicon; simplification
12/18/1990US4978636 Method of making a semiconductor diode
12/18/1990US4978420 Single chamber via etch through a dual-layer dielectric
12/18/1990US4978419 Process for defining vias through silicon nitride and polyamide
12/18/1990US4978052 Semiconductor die attach system
12/18/1990US4977748 Vacuum container for cryogenically cooled electron device packaging
12/18/1990CA1278105C Staggered radial-fin heat sink device for integrated circuit package
12/16/1990CA2018847A1 Hybrid circuit working under high voltage
12/13/1990WO1990015517A1 Improved electrical connectors and ic chip tester embodying same
12/13/1990WO1990015439A1 Packaged electronic circuit with a chip on a gridded area of conductive pads
12/13/1990WO1990015438A1 Beam lead and semiconductor device structure and method for fabricating integrated structure
12/13/1990WO1990015437A1 Improved thermal performance package for integrated circuit chip
12/13/1990WO1990012769A3 Heat-sink structures with increased heat dissipation capacity and methods for the production of such structures
12/12/1990EP0402230A1 Process and device for marking and cleaving mono-crystalline semiconductor wafers
12/12/1990EP0402188A1 Low capacity chip component, in particular PIN chip diode
12/12/1990EP0402061A2 Metallization process
12/12/1990EP0401935A1 Package made from liquid-crystalline polymer composition
12/12/1990EP0401848A2 Tape carrier and test method therefor
12/12/1990EP0401746A2 Method for encapsulating an electronic device and apparatus for carrying out this method
12/12/1990EP0401743A1 Electrically insulated heat pipe type cooling apparatus for semiconductor
12/12/1990EP0401688A2 Method of forming electrical contact between interconnection layers located at different layer levels
12/12/1990EP0401341A1 Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits.
12/12/1990EP0401211A1 Semiconductor component, manufacturing process, device and assembly station.
12/11/1990US4977444 Semiconductor cooling apparatus
12/11/1990US4977443 Cooling with liquid refrigerant
12/11/1990US4977442 Lead frame and method of producing electronic components using such improved lead frame
12/11/1990US4977441 Semiconductor device and tape carrier
12/11/1990US4977440 Low electrical resistance contactors between treminals
12/11/1990US4977439 Buried multilevel interconnect system
12/11/1990US4977108 Method of making self-aligned, planarized contacts for semiconductor devices
12/11/1990US4977107 Etching cavity into semiconductor substrate, doping
12/11/1990US4977105 Method for manufacturing interconnection structure in semiconductor device
12/11/1990US4977024 Magnesia granule coated with silica or forsterite
12/11/1990US4977009 Corrosion resistance
12/11/1990US4976839 Reactive sputtering in mixed gas including oxygen
12/11/1990US4976814 Method of making a ceramic semiconductor package having crack arrestor patterns
12/11/1990US4976809 Depositing thin film of aluminum in array of holes etched in dielectric layer, scanning with laser to melt and orient crystal structure, aligning mask, etching excess
12/11/1990CA1277781C Electrical interconnection comprising anisotropically conductive medium
12/11/1990CA1277779C Method for production of compound semiconductor devices
12/11/1990CA1277777C Cooling structure for integrated circuits
12/06/1990DE3917742A1 Nail-head contact system for semiconductor arrangement - has passivation surrounding contacting point including edges
12/06/1990DE3917707A1 Electronic chip module - with contacting provided by thickened chip connection regions opposite reed contacts
12/05/1990EP0401017A2 Method of producing a post molded cavity package with internal dam bar for integrated circuit
12/05/1990EP0400877A2 Contact metallization of semiconductor integrated circuit devices
12/05/1990EP0400821A2 Local interconnect for integrated circuits
12/05/1990EP0400566A2 Adhesive tapes and semiconductor devices
12/05/1990EP0400324A2 Semiconductor package
12/05/1990EP0400178A1 Semiconductor device with a passivation layer
12/05/1990EP0400177A1 Bonding of a semiconductor component with a metal carrier
12/05/1990EP0400173A1 Method for manufacturing at least one interconnect crossover
12/05/1990EP0400071A1 Laminar polymeric sheet
12/05/1990EP0400070A1 Laser-machining polymers
12/04/1990US4975875 Static random access memory with tri-layer conductor construction over access transistors
12/04/1990US4975765 Highly integrated circuit and method for the production thereof
12/04/1990US4975763 Edge-mounted, surface-mount package for semiconductor integrated circuit devices
12/04/1990US4975762 Alpha-particle-emitting ceramic composite cover
12/04/1990US4975761 High performance plastic encapsulated package for integrated circuit die
12/04/1990US4975760 Electrode interconnection material, semiconductor device using this material and driving circuit substrate for display device
12/04/1990US4975753 Semiconductor memory device having an aluminum-based metallization film and a refractory metal silicide-based metallization film
12/04/1990US4975659 Amplifier package using vertical power transistors with ungrounded common terminals
12/04/1990US4975544 Connecting structure for connecting conductors in an electronic apparatus
12/04/1990US4975500 Adducts of metabrominated phenols and polyfunctional epoxides
12/04/1990US4975389 Aluminum metallization for semiconductor devices
12/04/1990US4975386 Metallization, etching, alloying; heat resistant structure
12/04/1990US4974769 Method of joining composite structures
12/04/1990CA1277441C Jumper chip for semiconductor devices
12/04/1990CA1277436C Semiconductor integrated circuit packages
12/04/1990CA1277435C Chip contacts without oxide discontinuities
12/04/1990CA1277434C Module for packaging semiconductor integrated circuit chips on a base substrate
12/04/1990CA1277107C Germanosilicate spin-on glasses
11/1990
11/29/1990WO1990014626A1 Systems with data-token/one-wire-bus
11/29/1990DE3916899A1 Diverting mounting support for electronic components - has base of thermally-conducting plastics material accepting thick film circuit
11/29/1990DE3915998A1 Electronic component with integrated circuit - has voltage supply strip lines coupled each to capacitor electrode
11/28/1990EP0399881A2 Semiconductor device having two conductor layers and production method thereof
11/28/1990EP0399868A2 Manufacturing process of a chip card and card obtained by this process
11/28/1990EP0399721A1 Electrical conductors and methods of making them
11/28/1990EP0399661A2 Integrated circuit lead assembly structure
11/28/1990EP0399447A2 Plastic molded type semiconductor device
11/28/1990EP0399300A2 Semiconductor device and electronic apparatus using semiconductor device
11/28/1990EP0399299A2 Electrically conductive polymeric materials and uses thereof
11/28/1990EP0399265A2 Substrate used for fabrication of thick film circuit
11/28/1990EP0399161A2 Multi-level circuit card structure
11/28/1990EP0236352B1 Multi-cell transistor
11/28/1990EP0159928B1 Semiconductor integrated circuit device having fuse-type information storing circuit
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