| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/10/1991 | DE3934224A1 Microwave integrator with HF circuit part - has circuit component on opposite substrate surface for DC supply |
| 01/09/1991 | EP0407170A2 Charge pump |
| 01/09/1991 | EP0407156A2 Circuit module |
| 01/09/1991 | EP0407133A2 Semiconductor device and method of manufacturing such semiconductor device |
| 01/09/1991 | EP0407107A2 Low reflection input configuration for integrated circuit packages |
| 01/09/1991 | EP0407103A2 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
| 01/09/1991 | EP0406995A1 TiN Thin film formation method |
| 01/09/1991 | EP0406911A1 Process for preparation of polysilsesquioxane |
| 01/09/1991 | EP0406373A1 Tape automated bonded lead package and reusable transport tape for use therewith |
| 01/09/1991 | EP0177042B1 Electronic circuit device and method of producing the same |
| 01/08/1991 | US4984132 Multilayer wiring substrate |
| 01/08/1991 | US4984066 Cooling of large semi-conductor devices |
| 01/08/1991 | US4984065 Hybrid resin-sealed semiconductor device |
| 01/08/1991 | US4984064 Semiconductor device |
| 01/08/1991 | US4984063 Semiconductor device |
| 01/08/1991 | US4984062 Packaged semiconductor device |
| 01/08/1991 | US4984061 Semiconductor device in which wiring layer is formed below bonding pad |
| 01/08/1991 | US4984060 Semiconductor device wirings with hillocks |
| 01/08/1991 | US4984059 Semiconductor device and a method for fabricating the same |
| 01/08/1991 | US4984058 Semiconductor integrated circuit device |
| 01/08/1991 | US4984056 Semiconductor integrated circuit device |
| 01/08/1991 | US4984055 Semiconductor device having a plurality of conductive layers and manufacturing method therefor |
| 01/08/1991 | US4984054 Electric fuse for a redundancy circuit |
| 01/08/1991 | US4984051 Semiconductor device having directly connected source terminal |
| 01/08/1991 | US4984050 Gate-array type intergated circuit semiconductor device |
| 01/08/1991 | US4983547 Then covering with aluminum or alloy, heat treatment to precipitate silicon into aluminum film |
| 01/08/1991 | US4983544 Silicide bridge contact process |
| 01/08/1991 | US4983251 Method of manufacturing semiconductor devices |
| 01/08/1991 | US4982783 Self-tightening heat sink |
| 01/08/1991 | US4982494 Methods of making a low capacitance integrated circuit package |
| 01/08/1991 | CA1278882C Integrated circuit package |
| 01/08/1991 | CA1278878C Cooling method and apparatus for an integrated circuit casing |
| 01/02/1991 | EP0405947A2 Method of manufacturing thick-film devices |
| 01/02/1991 | EP0405877A2 Thermally optimized interdigitated transistor |
| 01/02/1991 | EP0405871A2 Balanced capacitance lead frame for integrated circuits |
| 01/02/1991 | EP0405865A2 Method of connecting opposed pairs of contacts of detector and readout microchips in a hybrid detector array assembly |
| 01/02/1991 | EP0405849A2 Severable conductive path in an integrated-circuit device |
| 01/02/1991 | EP0405755A2 Pin grid array packaging structure |
| 01/02/1991 | EP0405660A2 A method of manufacturing a semiconductor device |
| 01/02/1991 | EP0405659A2 A method of manufacturing a semiconductor device |
| 01/02/1991 | EP0405586A1 Semiconductor device and method of burning in the same |
| 01/02/1991 | EP0405501A2 Semiconductor device |
| 01/02/1991 | EP0405458A2 Ultraviolet-erasable type non-volatile semiconductor memory device having multilayered wiring structure |
| 01/02/1991 | EP0405330A2 Flagless leadframe, package and method |
| 01/02/1991 | EP0404986A1 Identification circuit for integrated semiconductor circuits |
| 01/02/1991 | EP0404985A1 Identification circuit for integrated semiconductor circuits |
| 01/02/1991 | EP0404760A1 Semiconductor component with two connections and process and device for manufacturing it. |
| 01/02/1991 | EP0247140B1 Sputtering method for reducing hillocking in aluminum layers formed on substrates |
| 01/02/1991 | CA1278618C Plastic encapsulated integrated circuit package with electrostatic shield |
| 01/01/1991 | US4982311 Package for very large scale integrated circuit |
| 01/01/1991 | US4982274 Heat pipe type cooling apparatus for semiconductor |
| 01/01/1991 | US4982269 Blanar-type microwave integrated circuit with at least one mesa component, method of fabrication thereof |
| 01/01/1991 | US4982268 Semiconductor device package assembly hairing non-symmetrical semiconductor chip mounting within conductible lead pattern |
| 01/01/1991 | US4982267 Integrated semiconductor package |
| 01/01/1991 | US4982266 Integrated circuit with metal interconnecting layers above and below active circuitry |
| 01/01/1991 | US4982265 Semiconductor integrated circuit device and method of manufacturing the same |
| 01/01/1991 | US4982264 High density integrated circuit package |
| 01/01/1991 | US4982250 Semiconductors |
| 01/01/1991 | US4982247 Semi-conductor device |
| 01/01/1991 | US4981818 Supported on silicon carbide interlayer |
| 01/01/1991 | US4981817 Tab method for implementing dynamic chip burn-in |
| 01/01/1991 | US4981816 MO/TI Contact to silicon |
| 01/01/1991 | US4981776 Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink |
| 01/01/1991 | US4981530 Planarizing ladder-type silsesquioxane polymer insulation layer |
| 01/01/1991 | US4981529 Semiconductor substrate provided with marks for alignment even under a resist film |
| 12/29/1990 | CA2016850A1 Method of packaging and powering integrated circuit chips and the chip assembly formed thereby |
| 12/27/1990 | WO1990016080A1 Chip carrier with terminating resistive elements |
| 12/27/1990 | WO1990016079A2 Low impedance packaging |
| 12/27/1990 | EP0404372A2 Method for forming polycrystalline silicon contacts |
| 12/27/1990 | EP0404277A1 Method of inserting a chip carrier contact into a housing |
| 12/27/1990 | EP0403992A2 Chip carrier package and method of manufacture |
| 12/27/1990 | EP0403817A2 Dielectric structures with material resistant to etching and method of fabrication thereof |
| 12/27/1990 | EP0403783A2 High strength low stress encapsulation of interconnected semiconductor devices |
| 12/27/1990 | EP0403781A2 Apparatus for temperature control of electronic devices |
| 12/27/1990 | EP0403571A1 Method of forming a semi-custom integrated circuit |
| 12/27/1990 | EP0311674B1 Cavity-up-cavity-down multichip integrated circuit package |
| 12/27/1990 | CA1278392C Apparatus for and method of positioning and synchronizing a writing laser beam |
| 12/27/1990 | CA1278368C Method and device for improving the sensitivity and the signal-to-noise ratio and piezoelectric transducers comprising a mulitiplicity of parallel mounted sensors |
| 12/27/1990 | CA1278273C Forming polycide structure comprised of polysilicon, silicon, and metal silicide lavers |
| 12/25/1990 | US4980802 Flexible printed circuit |
| 12/25/1990 | US4980754 Package for superconducting devices |
| 12/25/1990 | US4980753 Low-cost high-performance semiconductor chip package |
| 12/25/1990 | US4980752 Transition metal clad interconnect for integrated circuits |
| 12/25/1990 | US4980751 Electrical multilayer contact for microelectronic structure |
| 12/25/1990 | US4980748 Semiconductor device made with a trenching process |
| 12/25/1990 | US4980586 Digital integrated circuit propagation delay regulator |
| 12/25/1990 | US4980316 Method for producing a resist structure on a semiconductor |
| 12/25/1990 | US4980308 Method of making a thin film transistor |
| 12/25/1990 | US4980239 Having sufficient adhesion strength |
| 12/25/1990 | US4980219 Sprocket holes at predetermined intervals in side edge areas |
| 12/25/1990 | US4980034 Alternating dielectric and metal |
| 12/25/1990 | US4980020 Local interconnect etch technique |
| 12/25/1990 | US4979663 Outer lead tape automated bonding system |
| 12/25/1990 | US4979615 Integrated circuit device container having unitary closing means |
| 12/20/1990 | DE3919249A1 Two-layer tape-automated-bonding film carrier prodn. - without use of environmentally polluting solvents |
| 12/19/1990 | EP0403343A1 Hybrid circuit functioning under high voltage |
| 12/19/1990 | EP0403208A1 Heat sinking substrate |
| 12/19/1990 | EP0403113A2 Field effect semiconductor devices and methods of fabrication thereof |
| 12/19/1990 | EP0403080A2 Bonding devices |
| 12/19/1990 | EP0402936A2 Electrode structure for III-V compound semiconductor element and method of manufacturing the same |