| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/05/1991 | US4990997 Crystal grain diffusion barrier structure for a semiconductor device |
| 02/05/1991 | US4990996 Bonding pad scheme |
| 02/05/1991 | US4990995 Low reflectance conductor in an integrated circuit |
| 02/05/1991 | US4990993 Hermetic sealing; waterproof, corrosion resistant |
| 02/05/1991 | US4990992 Semiconductor integrated circuit device |
| 02/05/1991 | US4990987 Over-temperature sensor and protector for semiconductor devices |
| 02/05/1991 | US4990720 Circuit assembly and method with direct bonded terminal pin |
| 02/05/1991 | US4990489 Read only memory device including a superconductive electrode |
| 02/05/1991 | US4990462 Using flotation liquid |
| 02/05/1991 | US4990365 Vapor depositing in alternating electromagnetic field |
| 02/05/1991 | US4989318 Process of assembling terminal structure |
| 02/05/1991 | US4989317 Method for making tab circuit electrical connector supporting multiple components thereon |
| 02/05/1991 | CA1279935C Semiconductor devices having superconducting interconnects |
| 02/05/1991 | CA1279843C Metal parts, such as sealing lids, with electroplated nickel and gold coatings |
| 02/05/1991 | CA1279753C Screenable paste for use as a barrier layer on a substrate during maskless cladding |
| 01/30/1991 | EP0410631A2 Article comprising a stacked array of electronic subassemblies |
| 01/30/1991 | EP0410164A2 Floating orthogonal line structure for X-Y wiring planes |
| 01/30/1991 | EP0410116A2 Method of manufacturing a wire-bonded semiconductor device |
| 01/30/1991 | EP0403571A4 Gate array structure and process to allow optioning at second metal mask only |
| 01/30/1991 | EP0381745A4 Low inductance decoupling capacitor |
| 01/30/1991 | EP0176557B1 Impedance-matched leads |
| 01/29/1991 | US4989117 Molded integrated circuit package incorporating thin decoupling capacitor |
| 01/29/1991 | US4989070 Modular heat sink structure |
| 01/29/1991 | US4989069 Semiconductor package having leads that break-away from supports |
| 01/29/1991 | US4989068 Semiconductor device and method of manufacturing the same |
| 01/29/1991 | US4989066 Semiconductor package |
| 01/29/1991 | US4989064 Insulating and protective layers |
| 01/29/1991 | US4989063 Hybrid wafer scale microcircuit integration |
| 01/29/1991 | US4989062 Semiconductor integrated circuit device having multilayer power supply lines |
| 01/29/1991 | US4989057 ESD protection for SOI circuits |
| 01/29/1991 | US4988636 Method of making bit stack compatible input/output circuits |
| 01/29/1991 | US4988514 Preparation of lower alkyl polysilsesquioxane and formation of insulating layer of silylated polymer on electronic circuit board |
| 01/29/1991 | US4988412 Selective electrolytic desposition on conductive and non-conductive substrates |
| 01/29/1991 | US4988403 Method of forming patterned silicone rubber layer |
| 01/29/1991 | US4987677 Heat treatment; copper with specific surface roughness |
| 01/29/1991 | CA1279733C Outer tape automated bonding semiconductor package |
| 01/24/1991 | WO1991001045A1 Improvements in mounting of the lids of capsules for solid state integrated circuits |
| 01/24/1991 | WO1991001043A1 Uv-cured adhesive for semiconductor-chip assembly |
| 01/24/1991 | WO1991000683A2 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 01/24/1991 | DE4022398A1 Thermal stabilisation of titanium-silicide film in IC - by formation of oxide-film on top by thermal oxidn. preventing redistribution during heat treatment |
| 01/24/1991 | DE3923023A1 Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren UV curable adhesive for a semiconductor-chip assembly process |
| 01/23/1991 | EP0409426A2 Power semiconductor package |
| 01/23/1991 | EP0409391A2 Spacer tape for IC package |
| 01/23/1991 | EP0409290A2 Wafer scale package system and header and method of manufacture thereof |
| 01/23/1991 | EP0409257A2 Low-melting point glass sealed semiconductor device and method of manufacturing the same |
| 01/23/1991 | EP0409256A2 Semiconductor IC device and method for manufacturing the same |
| 01/23/1991 | EP0409196A2 Plastic molded type semiconductor device |
| 01/23/1991 | EP0409173A2 Semiconductor ic device having an improved interconnection structure |
| 01/23/1991 | EP0409004A2 Low-melting point glass sealed semiconductor device and method of manufacturing the same |
| 01/23/1991 | EP0408904A2 Surface mounting semiconductor device and method |
| 01/23/1991 | EP0408779A1 High density semiconductor memory module |
| 01/23/1991 | EP0408768A1 Chip carrier |
| 01/23/1991 | EP0197089B1 Wafer-scale-integrated assembly |
| 01/22/1991 | US4987562 Semiconductor layer structure having an aluminum-silicon alloy layer |
| 01/22/1991 | US4987478 Micro individual integrated circuit package |
| 01/22/1991 | US4987477 Solid state imaging device |
| 01/22/1991 | US4987476 Brazed glass pre-passivated chip rectifier |
| 01/22/1991 | US4987475 Alignment of leads for ceramic integrated circuit packages |
| 01/22/1991 | US4987474 Semiconductor device and method of manufacturing the same |
| 01/22/1991 | US4987473 Leadframe system with multi-tier leads |
| 01/22/1991 | US4987326 Semiconductor integrated circuit device having an improved common wiring arrangement |
| 01/22/1991 | US4987101 Very large scale and ultra large scale integration circuits; intralayer insulation |
| 01/22/1991 | US4987100 Flexible carrier for an electronic device |
| 01/22/1991 | US4987090 Static ram cell with trench pull-down transistors and buried-layer ground plate |
| 01/22/1991 | US4986878 Process for improved planarization of the passivation layers for semiconductor devices |
| 01/22/1991 | US4986856 Alloying, hot rolling in nonoxidative atmosphere, stretch processing, annealing |
| 01/22/1991 | US4986849 Surfactant stabilizer |
| 01/16/1991 | EP0408419A1 Use of an electrically programmable MOS cell to implement a fuse |
| 01/16/1991 | EP0408228A2 Ceramic package and component |
| 01/16/1991 | EP0408136A1 Integrated circuit with current detection |
| 01/16/1991 | EP0408101A2 Strip carrier for integrated circuits |
| 01/16/1991 | EP0408060A2 Semiconductor integrated circuit device and logic correcting method of the same |
| 01/16/1991 | EP0408054A2 Ultraviolet erasable non-volatile semiconductor memory apparatus |
| 01/16/1991 | EP0407957A1 Heat sink device for components of the SMD type mounted on a printed curcuit board |
| 01/16/1991 | EP0407933A2 Resin sealed semiconductor device with improved thermal stress resistance |
| 01/16/1991 | EP0407905A2 Flat body, in particular for application as a heat sink for electronic power components |
| 01/16/1991 | EP0407778A2 Hybrid amplifier |
| 01/16/1991 | EP0407620A1 Electric insulation type heat pipe cooler |
| 01/16/1991 | EP0407585A1 Semiconductor device sealed with resin and a method of producing the same |
| 01/15/1991 | US4985807 Encoding device particularly for integrated circuit cards |
| 01/15/1991 | US4985753 Semiconductor package |
| 01/15/1991 | US4985751 Using an epoxy resin |
| 01/15/1991 | US4985750 Semiconductor device using copper metallization |
| 01/15/1991 | US4985749 Substrate for very large scale integrated circuit and apparatus for selective tinning of the substrate leads |
| 01/15/1991 | US4985748 Universal tape for use in tape automated bonding system |
| 01/15/1991 | US4985747 Terminal structure and process of fabricating the same |
| 01/15/1991 | US4985746 Semiconductor device and method of production |
| 01/15/1991 | US4985740 Power field effect devices having low gate sheet resistance and low ohmic contact resistance |
| 01/15/1991 | US4985373 Multiple insulating layer for two-level interconnected metallization in semiconductor integrated circuit structures |
| 01/15/1991 | US4985367 Method of manufacturing a lateral transistor |
| 01/15/1991 | US4985310 Multilayered metallurgical structure for an electronic component |
| 01/15/1991 | US4984358 Method of assembling stacks of integrated circuit dies |
| 01/15/1991 | CA1278912C Overprint copper composition |
| 01/10/1991 | WO1991000619A1 Flying leads for integrated circuits |
| 01/10/1991 | WO1991000618A1 Electronic systems disposed in a high force environment |
| 01/10/1991 | WO1991000617A1 Low inductance encapsulated package including a semiconductor chip |
| 01/10/1991 | WO1991000616A1 Wiring structure of semiconductor chip |
| 01/10/1991 | WO1991000314A1 Conductive polymer and method for manufacturing same |
| 01/10/1991 | DE4019399A1 Plug connector for semiconductor circuit modules |
| 01/10/1991 | DE4018688A1 Protection of data held on shaft card against external reading - has protective layer that can be periodically checked for attempt to read |