Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/1991
02/27/1991EP0204767B1 Method for fabricating modules comprising stacked circuit-carrying layers
02/26/1991US4996630 Hybrid module electronics package
02/26/1991US4996589 Semiconductor module and cooling device of the same
02/26/1991US4996588 Device for interconnection and protection of a bare microwave component chip
02/26/1991US4996587 Integrated semiconductor chip package
02/26/1991US4996586 Crimp-type semiconductor device having non-alloy structure
02/26/1991US4996585 Electronic package
02/26/1991US4996584 Thin-film electrical connections for integrated circuits
02/26/1991US4996583 Stack type semiconductor package
02/26/1991US4996582 Field effect transistor for microstrip mounting and microstrip-mounted transistor assembly
02/26/1991US4996580 Bipolar semiconductor device
02/26/1991US4996411 Method of manufacturing a card having electronic memory and a card obtained by performing said method
02/26/1991US4996171 Silver-filled glass
02/26/1991US4996170 Molding process for encapsulating semiconductor devices using a thixotropic compound
02/26/1991US4996115 High electrical and thermal conductivity copper/INVAR" copper laminate, prevent high temperature failure in electronic devices
02/26/1991US4995941 Method of manufacture interconnect device
02/26/1991US4995551 Bonding electrical leads to pads on electrical components
02/26/1991US4995546 Device mounting
02/26/1991US4995451 Pinfins increase surface area, minimization of superheating
02/26/1991US4995236 Cryostatic device for a radiation detector
02/26/1991US4995149 Method for hermetically sealing electronic devices
02/24/1991WO1991002647A1 Capacitor laminate for printed circuit board
02/21/1991WO1991002378A1 Leadframe system with multi-tier leads
02/21/1991WO1991002205A1 High heat flux compact heat exchanger having a permeable heat transfer element
02/21/1991DE4011957A1 Semiconductor module with number of semiconductor devices - has devices field screen insulated and separated and formed on common semiconductor substrate
02/21/1991DE3924823A1 Semiconductor module with several semiconductors on basic substrate - has cover substrate for all semiconductors with conductive track configuration with terminal face(s)
02/20/1991EP0413565A1 Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor
02/20/1991EP0413564A2 Formation of polymeric metal oxide materials
02/20/1991EP0413542A2 Direct mount semiconductor package
02/20/1991EP0413498A2 Heat transfer member for semiconductor element
02/20/1991EP0413451A2 Packaging semiconductor chips
02/20/1991EP0413348A2 Semiconductor integrated circuit
02/20/1991EP0413335A2 Method of mutually connecting electrode terminals
02/20/1991EP0258312B1 Mounting arrangement for solid state devices
02/20/1991CN1011749B Method of manufacturing semiconductor device having interconnections located both above semiconductor region and above isolation region adjoining it
02/19/1991US4994936 Molded integrated circuit package incorporating decoupling capacitor
02/19/1991US4994903 Circuit substrate and circuit using the substrate
02/19/1991US4994902 Semiconductor devices and electronic system incorporating them
02/19/1991US4994897 Multi-level semiconductor package
02/19/1991US4994896 Semiconductor device
02/19/1991US4994895 Hybrid integrated circuit package structure
02/19/1991US4994894 Semiconductor device having an improved wiring pattern
02/19/1991US4994890 Rectifier structure with individual links
02/19/1991US4994874 Input protection circuit for semiconductor integrated circuit device
02/19/1991US4994659 IC card
02/19/1991US4994412 Alignment, soldering of leads and bonding pads on electronic devices
02/19/1991US4994411 Process of producing semiconductor device
02/19/1991US4994410 Method for device metallization by forming a contact plug and interconnect using a silicide/nitride process
02/19/1991US4994402 Method of fabricating a coplanar, self-aligned contact structure in a semiconductor device
02/19/1991US4994400 Forming dielectric and conductive sidewalls along opening in composite layer, doping
02/19/1991US4994302 Multilayer ceramics; firing green tape
02/19/1991US4994215 Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits
02/19/1991US4994207 Electroconductivity; shear strength
02/19/1991US4993954 Device for interconnection between and integrated circuit and an electrical circuit
02/19/1991US4993622 Copper doped aluminum bonding pad and copper doped gold wire; hardness, nondeforming
02/19/1991US4993482 Coiled spring heat transfer element
02/19/1991US4993148 Method of manufacturing a circuit board
02/19/1991CA2023359A1 Cooling system for a semiconductor element, semiconductor module including such a system and a thermally conductive member therefor
02/19/1991CA1280475C Transformer structure
02/13/1991EP0412943A1 Method of mounting a heatsink onto a plurality of semiconductor device packages
02/13/1991EP0412772A2 Semiconductor device with a passivation layer
02/13/1991EP0412741A2 Conductive adhesive sheet used in semiconductor device manufacture
02/13/1991EP0412608A1 Semiconductor device
02/13/1991EP0412545A2 IC package and IC card incorporating the same thereinto
02/13/1991EP0412425A1 Flame retardant casting resins as moulding compounds
02/13/1991EP0412405A2 Method and apparatus for improvement of interconnection capacitance
02/13/1991EP0412323A2 A film carrier for use in integrated circuit mounting
02/13/1991EP0412185A1 Metallization for semiconductor devices having a diffusion barrier
02/12/1991US4992987 Battery package for integrated circuits
02/12/1991US4992908 Integrated circuit module
02/12/1991US4992907 Electrostatic discharge protection system
02/12/1991US4992851 Characteristic impedance-correct chip carrier for microwave semiconductor components
02/12/1991US4992848 Self-aligned contact technology
02/12/1991US4992847 Interconnected hybrid integrated circuit
02/12/1991US4992764 High-power FET circuit
02/12/1991US4992628 Ceramic-glass integrated circuit package with ground plane
02/12/1991US4992394 Forming metal silicides; accuracy
02/12/1991US4992391 Multilayer; polysilicon and silicide layers
02/12/1991US4992152 Reducing hillocking in aluminum layers formed on substrates
02/12/1991US4992059 Ultra fine line cable and a method for fabricating the same
02/12/1991US4991666 Terminal pad for fixing a clawed pin to the edge of a hybrid circuit substrate and a connection formed thereby
02/12/1991CA1280220C Moat router for integrated circuits
02/07/1991WO1991001533A1 Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards
02/07/1991WO1990016079A3 Low impedance packaging
02/07/1991DE4024595A1 Protective coating material for semiconductors - contains -polyimide from bis-benzene-di:acid-anhydride-per:fluoro:propane, PMDA-type di:anhydride, silicon-di:amine and ether-di:amine
02/07/1991DE3925604A1 Contacting housing-less semiconductor circuits or substrate - forms depressions in substrate such that circuit surfaces lie in substrate surface plane
02/06/1991EP0411797A1 Self aligned registration marks for integrated circuit fabrication
02/06/1991EP0411639A2 Electronic circuit substrate
02/06/1991EP0411595A2 Process for bonding semiconductor chips to a wafer
02/06/1991EP0411405A2 Encapsulation method, microelectronic devices made therefrom, and heat curable compositions
02/06/1991EP0411286A1 Liquid metal matrix thermal paste
02/06/1991EP0411119A1 Semiconductor module, its cooling system and computer using the cooling system
02/06/1991EP0411015A1 Pre-formed chip carrier cavity package
02/06/1991EP0186585B1 Die bonding process
02/06/1991CN1011563B Circuit arrangement having plurality of electrical elements to be cooled
02/05/1991US4991002 Modular power device assembly
02/05/1991US4991001 IC packing device with impedance adjusting insulative layer
02/05/1991US4991000 Vertically interconnected integrated circuit chip system
02/05/1991US4990999 Semiconductor memory device using high-density and high-speed MOS elements
02/05/1991US4990998 Semiconductor device to prevent out-diffusion of impurities from one conductor layer to another
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