Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1991
03/26/1991CA1282189C Use of adherent layer for filling contact holes for semiconductor devices
03/26/1991CA1282188C Multilayer metallization method for integrated circuits
03/22/1991CA2025707A1 Epoxy resin composition
03/21/1991WO1991003843A1 Semiconducteur component
03/21/1991WO1991003413A1 Package for an integrated circuit structure
03/20/1991EP0417992A2 A stackable multilayer substrate for mounting integrated circuits
03/20/1991EP0417887A2 IC card
03/20/1991EP0417787A2 Multimold semiconductor device and the manufacturing method therefor
03/20/1991EP0417646A2 MOS type semiconductor device with a multilayer gate electrode and method for manufacturing the same
03/20/1991EP0417484A2 Semiconductor memory device and process for making the same
03/20/1991EP0417345A1 Design method for VLSI chips arranged on a carrier and module thus designed
03/20/1991EP0417299A1 Electrically insulated heat pipe-type semiconductor cooling device
03/20/1991EP0261123B1 Integrated flow meter and method for producing it
03/20/1991CN2073621U Socket of red copper of ironed
03/20/1991CN1012125B Method for producing clean, highly conductive surface for mating composite articles
03/20/1991CA2024848A1 Design system for vlsi chips arranged on a carrier and module thus designed
03/19/1991US5001601 Modular cooling fixture for power transistors
03/19/1991US5001548 Multi-chip module cooling
03/19/1991US5001547 Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink
03/19/1991US5001546 Integrated circuits, composites of iron-nickel alloy, cladding bonded to surface to form electroconductive and thermal conductive layer
03/19/1991US5001545 Formed top contact for non-flat semiconductor devices
03/19/1991US5001542 Epoxy resin adhesives, particles with a coating of curing agent with a film, pressure deformable electroconductive particles
03/19/1991US5001541 Advanced electromigration resistant interconnect structure and process
03/19/1991US5001537 Semiconductor device for electrical overstress protection
03/19/1991US5001527 Multilayer semiconductor of polycrystalline silicon and metal silicide, insulating oxide film on electrode, capacitors for c omputers
03/19/1991US5001299 Explosively formed electronic packages
03/19/1991US5001108 Semiconductor device having a superconductive wiring
03/19/1991US5001080 Multilayer semiconductor forming connector wires, forming resist layers, etching with ion beams
03/19/1991US5001079 Method of manufacturing a semiconductor device by forming insulating side walls with voids below overhangs
03/19/1991US5001076 Process for fabricating III-V devices using a composite dielectric layer
03/19/1991US5000818 Method of fabricating a high performance interconnect system for an integrated circuit
03/19/1991US5000689 Connector for integrated circuit packages
03/19/1991US5000256 Heat transfer bag with thermal via
03/19/1991US5000254 Dynamic heat sink
03/19/1991CA1281840C Insulating film for semiconductor, production of the same and liquid composition for producing the same
03/16/1991WO1991004233A1 Sealing glass compositions
03/16/1991CA2066265A1 Sealing glass compositions
03/14/1991DE3929701A1 Pluggable module with circuit board - has cooler with pin(s), orthogonally slidable w.r.t. circuit board, with transverse threshold bore
03/13/1991EP0416903A2 Method of fabricating a programmable interconnect structure
03/13/1991EP0416898A2 Thick film substrate with highly thermally conductive metal base
03/13/1991EP0416847A2 Methods of joining components
03/13/1991EP0416726A2 Plastic encapsulated package for integrated circuit die
03/13/1991EP0416573A1 Resin sealing type semiconductor device having outer leads designed for multi-fonctions
03/13/1991EP0416456A1 Master slice integrated circuit power supply system
03/13/1991EP0416287A2 Improved method for forming local interconnects using selective anisotropy
03/13/1991EP0416133A1 Resin-coated bonding wire, method of producing the same and semiconductor device
03/13/1991EP0252094B1 Stripline mount for semiconductor lasers
03/13/1991CN2073169U Grid protector of power mos device
03/13/1991CN2073168U Protector with ion sensing field-effect device
03/13/1991CN2073167U Electric power transistor
03/12/1991US4999742 Electronic module for a small portable object such as a card or a key incorporating an integrated circuit
03/12/1991US4999740 Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof
03/12/1991US4999700 Package to board variable pitch tab
03/12/1991US4999699 Solder interconnection structure and process for making
03/12/1991US4999698 Interconnection arrangement for a gate array
03/12/1991US4999684 Symmetrical blocking high voltage breakdown semiconducotr device
03/12/1991US4999319 Semiconductor chips being fixed to the face in a groove, connectors, pellets
03/12/1991US4999318 Method for forming metal layer interconnects using stepped via walls
03/12/1991US4999317 Metallization processing
03/12/1991US4999160 Aluminum alloy containing copper, silicon and titanium for VLSI devices
03/12/1991US4998888 Integrated circuit package with battery housing
03/12/1991US4998885 Elastomeric area array interposer
03/12/1991CA1281436C Tape intended as circuits for electronic modules
03/12/1991CA1281435C Outer lead tape automated bonding system
03/12/1991CA1281191C Cryostat cooling system
03/07/1991DE3937810C1 Carrier plate with soft-soldered circuit substrate - has spacing wires of approximately same coefft. of thermal expansion as solder to limit loading of substrate
03/07/1991DE3931570C1 Cooling water circuit for DC circuit of rectifier - has coolants distributor of copper pipe coupled to water supply pipe via two insulating intermediate pieces
03/07/1991DE3929161A1 Halbleiterbauelement Semiconductor device
03/06/1991EP0415663A1 Tape assembly
03/06/1991EP0415659A2 Process for making a two-layer film carrier
03/06/1991EP0415644A2 Superconducting interconnection apparatus
03/06/1991EP0415544A2 Demountable tape-automated bonding system
03/06/1991EP0415537A2 Wiring contact portion of a semiconductor device and method for manufacturing the same
03/06/1991EP0415528A2 Method of fabricating a coplanar, self-aligned contact structure in a semiconductor device
03/06/1991EP0415526A2 Semiconductor device having wiring layers
03/06/1991EP0415318A2 Semiconductor device
03/06/1991EP0415106A2 Lead frames for semiconductor device
03/06/1991EP0415059A2 Housing for semiconductor component
03/06/1991EP0414852A1 Method for improving the adhesion of a plastic encapsulant to copper containing leadframes
03/05/1991US4998160 Substrate power supply contact for power integrated circuits
03/05/1991US4998159 Ceramic laminated circuit substrate
03/05/1991US4998157 Metal silicide and nitride layers and an aluminum or alloy layer; semiconductors
03/05/1991US4998002 Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
03/05/1991US4997798 Process for producing aluminum nitride sintered body with high thermal conductivity
03/05/1991US4997783 Forming buried, isolated n-layer on p-substraet, epitaxial growth of silicon trenching
03/05/1991US4997698 Multilayer element for electronics formed by applying a coating of a glass/ceramic and polymer with heat treatment to remove the binder and sinter the glass
03/05/1991US4997517 Metal foil
03/05/1991US4997482 Ceramics
03/05/1991US4997393 Housing assembly for plug-in electrical element having blade-type terminals
03/05/1991US4996766 Bi-level card edge connector and method of making the same
03/05/1991CA1281115C Multilayer ceramic laser package
03/01/1991CA2023678A1 Semiconductor device
02/1991
02/28/1991DE3927755A1 Heat sink for solid state components - holds surface of element against adaptor conducting heat to sink plate
02/27/1991EP0414647A2 Method for the fabrication of a lead frame
02/27/1991EP0414594A1 Method of repairing a device comprising integrated circuits on a carrier substrate
02/27/1991EP0414412A2 Semiconductor integrated circuit device having wiring layers
02/27/1991EP0414361A2 Semiconductor antifuse structure and method
02/27/1991EP0414257A2 Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin
02/27/1991EP0414204A2 Multilayer interconnection substrate and semiconductor integrated circuit device using the same
02/27/1991EP0414140A2 Light transmission paste and metallic copper deposition method using same
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