Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1991
04/16/1991US5008582 Electronic device having a cooling element
04/16/1991US5008492 High current feedthrough package
04/16/1991US5008216 Void-free deposition
04/16/1991US5008213 Hybrid wafer scale microcircuit integration
04/16/1991US5008209 Anisotropic etching
04/16/1991US5007843 High-density contact area electrical connectors
04/16/1991US5007841 Integrated-circuit chip interconnection system
04/16/1991US5007577 Multiple-core complex material and method of manufacturing the same
04/16/1991CA1283227C Method for mounting an integrated circuit on a support, device using said method and its application to an electronic microcircuit card
04/16/1991CA1283225C Cooling system for three-dimensional ic package
04/14/1991CA2027509A1 Application specific tape automated bonding
04/14/1991CA2027430A1 Electronics protective packaging film
04/10/1991EP0421735A2 Method of Manufacturing a Semiconductor Device
04/10/1991EP0421694A1 Electronic package including hermetic feedthrough and method and apparatus for production thereof
04/10/1991EP0421680A1 Aluminium nitride circuit board
04/10/1991EP0421599A2 Integral protective enclosure for TAB device mounted on a flexible printed circuit board
04/10/1991EP0421579A2 Plastic encapsulated integrated circuit die packages and method of making same
04/10/1991EP0421344A1 Crimp-type power semiconductor device
04/10/1991EP0421343A2 Semiconductor element package and semiconductor element package mounting distributing circuit basic plate
04/10/1991EP0421230A2 Cationically curable oxyalkylene ethers, process for their preparation and their use as casting mass, coatings or as reactive diluents for epoxy resins
04/10/1991EP0421203A1 An integrated circuit structure with a boron phosphorus silicate glass composite layer on semiconductor wafer and improved method for forming same
04/10/1991EP0421193A1 Heat-conducting composite
04/10/1991EP0421006A1 Semiconductor packaging
04/10/1991EP0421005A2 Process of assembling an electronic package
04/10/1991EP0183722B1 High density ic module assembly
04/09/1991US5006963 Selectable chip carrier
04/09/1991US5006925 Three dimensional microelectric packaging
04/09/1991US5006924 Heat sink for utilization with high density integrated circuit substrates
04/09/1991US5006923 Stackable multilayer substrate for mounting integrated circuits
04/09/1991US5006922 Packaged semiconductor device having a low cost ceramic PGA package
04/09/1991US5006921 Power semiconductor switching apparatus with heat sinks
04/09/1991US5006919 Integrated circuit package
04/09/1991US5006918 Integrated circuit
04/09/1991US5006820 Low reflection input configuration for integrated circuit packages
04/09/1991US5006796 Temperature control instrument for electronic components under test
04/09/1991US5006614 Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer
04/09/1991US5006575 Silver particles, thermoplastic phenoxy resin and heat crosslinkable resin-integrated circuit chips
04/09/1991US5006486 Metallization of semiconductor die
04/09/1991US5006190 Film removal method
04/09/1991US5006167 Gold powder, copper oxide powder, glass-based, lead-free inorganic powder, and resin
04/09/1991US5006143 Method of producing a joined article through bonding with low melting point glass
04/09/1991US5005638 Thermal conduction module with barrel shaped piston for improved heat transfer
04/09/1991CA1282866C Thermal package for electronic components
04/07/1991CA2027070A1 Multilayered leadframe with interdigitated leads
04/04/1991WO1991004650A1 Via-forming ceramics composition
04/04/1991WO1991004575A1 Lead frame for semiconductor device and semiconductor device using the lead frame
04/04/1991WO1991004562A1 Improved composite dielectric
04/04/1991WO1991004498A1 Test circuit
04/03/1991EP0420668A2 Boiling type cooler device for power semiconductor switching elements
04/03/1991EP0420629A1 Light-emitting or receiving device and method for preparing the same
04/03/1991EP0420595A2 Deposited film formation method utilizing selective deposition by use of alkyl aluminum hydride
04/03/1991EP0420529A2 Metallization processing
04/03/1991EP0420514A1 Packaging material containing inherently antistatic polymeric foam and method for use thereof
04/03/1991EP0420405A2 Integrated circuit comprising interconnections
04/03/1991EP0420267A2 Apparatus for producing semiconductor devices
04/03/1991EP0419941A2 Method of producing a plastic packaged semiconductor device
04/03/1991EP0419836A2 3-D integrated circuit assembly employing discrete chips
04/03/1991EP0419804A2 Multilayer structures of different electroactive materials and methods of fabrication thereof
04/03/1991EP0419763A1 A stable interconnection metallization for VLSI devices including copper
04/03/1991EP0419709A1 Housing for a microwave component
04/03/1991CN1050468A Electrode-selecting trabsistor
04/03/1991CA2026452A1 Composite material having good thermal conductivity
04/02/1991US5005071 Semiconductor device
04/02/1991US5005070 Soldering interconnect method and apparatus for semiconductor packages
04/02/1991US5005069 Rectifier and method
04/02/1991US5005068 Semiconductor memory device
04/02/1991US5005067 Semiconductor integrated circuit
04/02/1991US5005056 Amorphous-silicon thin film transistor array substrate
04/02/1991US5004973 Method and apparatus for maintaining electrically operating device temperatures
04/02/1991US5004704 Method for manufacturing a semiconductor device having a phospho silicate glass layer as an interlayer insulating layer
04/02/1991US5004640 Heat treatment, reduction, firing
04/02/1991US5004520 Method of manufacturing film carrier
04/02/1991US5004340 Calibration target for surface analysis scanner systems
04/02/1991CA1282520C Adhesive composition useful for connecting two electrically conductive members
04/02/1991CA1282497C Thick film packages with common wafer aperture placement
04/02/1991CA1282467C Method for packaging a microwave tube modulator
03/1991
03/30/1991CA2026375A1 Light-emitting or receiving device and method for preparing the same
03/28/1991DE3931381A1 Extra interconnect level in silicon integrated circuit - consists of opposite conductivity type from substrate and contacted layers in trenches
03/28/1991DE3931238A1 Multi-chip module - with chips carried in book page fashion by specified plastic coating
03/27/1991EP0419232A2 Field programmable printed circuit board
03/27/1991EP0418896A2 Circuit configuration for the protection of electronic circuits against a voltage surge
03/27/1991EP0418891A2 Moulded plastic power semiconductor device
03/27/1991EP0418888A2 Epoxy resin composition
03/27/1991EP0418802A2 Wiring structure in a wafer-scale integrated circuit
03/27/1991EP0418777A2 Wafer scale semiconductor device
03/27/1991EP0418749A2 Integrated device with improved connections between the pins and the semiconductor material chip
03/27/1991EP0418541A2 Multi-zone planar heater assembly and method of operation
03/27/1991EP0418360A1 Dielectric substrate with reduced and stabilized surface electrical conductivity, process for its manufacture, and use of the substrate
03/27/1991EP0345342A4 Low cost, hermetic pin grid array package
03/27/1991CN1050289A Design system for vlsi chips arranged on carrier and module thus designed
03/26/1991US5003429 Electronic assembly with enhanced heat sinking
03/26/1991US5003376 Cooling of large high power semi-conductors
03/26/1991US5003371 Fuse-melting device
03/26/1991US5003131 Connection structure between ceramic body and outer terminal
03/26/1991US5003062 Dielectric multilayer integrated circuits, silicon dioxide coating over patterned conductive layer, vacuum degassing
03/26/1991US5002902 Multilayer semiconductor with insulator layers, apertures formed by etching
03/26/1991US5002895 Wire bonding method with a frame, for connecting an electronic component for testing and mounting
03/26/1991US5002807 Polysiloxane blends for electronics, two hydrogen atoms and a peroxide compound for curing vinyl groups
03/26/1991US5002367 Multi-level circuits, methods for their fabrication, and display devices incorporating such circuits
03/26/1991US5002123 Low pressure high heat transfer fluid heat exchanger
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