| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/07/1991 | US5014117 High conduction flexible fin cooling module |
| 05/07/1991 | US5014115 Coplanar waveguide semiconductor package |
| 05/07/1991 | US5014114 High speed, high density semiconductor memory package with chip level repairability |
| 05/07/1991 | US5014113 Multiple layer lead frame |
| 05/07/1991 | US5014112 Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame |
| 05/07/1991 | US5014111 Electrical contact bump and a package provided with the same |
| 05/07/1991 | US5014104 Semiconductor integrated circuit having CMOS inverters |
| 05/07/1991 | US5014103 Dynamic random access memory having improved layout and method of arranging memory cell pattern of the dynamic random access memory |
| 05/07/1991 | US5014003 Conductive pattern for electric test of semiconductor chips |
| 05/07/1991 | US5013948 High power rotating rectifier assembly |
| 05/07/1991 | US5013900 Identification card with integrated circuit |
| 05/07/1991 | US5013871 Kit for the assembly of a metal electronic package |
| 05/07/1991 | US5013688 Method of manufacturing a semiconductor using plasma processing |
| 05/07/1991 | US5013687 Integrated Circuit Assembly |
| 05/07/1991 | US5013678 Method of making an integrated circuit comprising load resistors arranged on the field oxide zones which separate the active transistor zones |
| 05/07/1991 | US5013526 Superconducting alloys comprising tungsten, molybdenum, silicon and oxygen |
| 05/07/1991 | US5013360 For semiconductors in ceramic packages |
| 05/07/1991 | US5013347 Packaging integrated circuits |
| 05/07/1991 | US5012858 Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit |
| 05/04/1991 | CA2029244A1 Planarizing surfaces of interconnect substrates by diamond turning |
| 05/02/1991 | WO1991006137A1 Application specific tape automated bonding |
| 05/02/1991 | WO1991006126A1 High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact |
| 05/02/1991 | WO1991006117A1 Three dimensional microcircuit structure and process for fabricating the same from ceramic tape |
| 05/02/1991 | EP0425316A2 Electric connector |
| 05/02/1991 | EP0425294A2 Two-color molded article for use in circuit formation |
| 05/02/1991 | EP0425162A2 Improved aluminum metallization for semiconductor devices |
| 05/02/1991 | EP0425147A2 Metallization processing |
| 05/02/1991 | EP0424858A2 Semiconductor device and soldering method employable in manufacturing the same |
| 05/02/1991 | EP0424805A2 Copolyimide ODPA/BPDA/4,4'-ODA/p-PDA |
| 05/02/1991 | EP0424647A2 Power semiconductor component having carrier plates |
| 05/02/1991 | EP0424530A1 Resin-sealed semiconductor device |
| 05/02/1991 | EP0424522A1 Interconnect device and method of manufacture thereof |
| 05/02/1991 | EP0424513A1 Method of making a hermetic seal in a solid-state device |
| 05/02/1991 | EP0424481A1 A heat dissipating device for laser diodes |
| 05/02/1991 | DE3939527A1 Metal strip with support platelet for integrated circuit chips - has end strap(s) and other strap(s) rougher than terminal fins |
| 05/02/1991 | DE3935792A1 Encapsulated electronic circuit on substrate - has ceramic green sheet foil, forming wall(s) encapsulating housing |
| 05/02/1991 | DE3935662A1 Circuit substrate mounted on carrier - has adhesive pads and space between filled with cooling fluid |
| 05/02/1991 | DE3935610A1 Monolithic semiconductor chip mfd. in micro-mechanical manner - has Peltier element over thin diaphragm, whose cold side lies on substrate island |
| 05/01/1991 | WO1991006978A2 Multi-layer lead frames for integrated circuit packages |
| 05/01/1991 | CN1012494B Multi-layered ceramic coating using estersil and metalic oxide |
| 05/01/1991 | CA2065295A1 Multi-layer lead frames for integrated circuit packages |
| 05/01/1991 | CA2021606A1 Cryogenic semiconductor power devices |
| 04/30/1991 | US5012386 High performance overmolded electronic package |
| 04/30/1991 | US5012325 Thermoelectric cooling via electrical connections |
| 04/30/1991 | US5012324 Flat body, particularly for use as a heat sink for electronic power components |
| 04/30/1991 | US5012323 Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe |
| 04/30/1991 | US5012321 Interconnection device between the cells of a pre-implanted hyperfrequency integrated circuit |
| 04/30/1991 | US5012320 Semiconductor device having high-reliable interconnections with titanium silicide film |
| 04/30/1991 | US5012319 Integrated electronic assembly comprising a transmission line |
| 04/30/1991 | US5012311 Semiconductor thin film device with thick insulator at gate edge |
| 04/30/1991 | US5012213 Providing a PGA package with a low reflection line |
| 04/30/1991 | US5012047 Multilayer wiring substrate |
| 04/30/1991 | US5011872 For heat exchanging adhesives for printed circuits; stability, workability |
| 04/30/1991 | US5011791 Fusible link with built-in redundancy |
| 04/30/1991 | US5011734 Metal overcoating |
| 04/30/1991 | US5011580 Protective coating |
| 04/30/1991 | US5011530 Copper oxide, copper mixture; controlled particle sizes |
| 04/30/1991 | US5010949 Device for fastening together under pressure two pieces, one to the other |
| 04/30/1991 | US5010641 Method of making multilayer printed circuit board |
| 04/27/1991 | CA2027957A1 Copolyimide odpa/bpda/4,4'-oda/p-phenylenediamine |
| 04/25/1991 | DE4032154A1 Integrated circuit with support substrate - has coupling faces of preset geometry, and functional circuit on random substrate location |
| 04/25/1991 | DE4032035A1 High current feedthrough package for microelectronic power circuits - with high thermal conductivity and large contact area feed-through for efficient heat dissipation |
| 04/25/1991 | DE3935272A1 Cooling plate for electronic components - is fitted into frame by projections for positioning w.r.t. PCB |
| 04/24/1991 | EP0424278A1 Process for sealing a semiconductor device |
| 04/24/1991 | EP0424024A1 Ceramic package for a semiconductor device |
| 04/24/1991 | EP0423716A2 Epoxy resin blends and curable compositions containing same |
| 04/24/1991 | EP0344259A4 Method and means of fabricating a semiconductor device package |
| 04/24/1991 | CN1050950A Mos integrated circuit parastat |
| 04/23/1991 | US5010390 Plastic-molded semiconductor device |
| 04/23/1991 | US5010388 Connection structure between components for semiconductor apparatus |
| 04/23/1991 | US5010387 Solder bonding material |
| 04/23/1991 | US5010355 Ink jet printhead having ionic passivation of electrical circuitry |
| 04/23/1991 | US5010038 Method of cooling and powering an integrated circuit chip using a compliant interposing pad |
| 04/23/1991 | US5010024 Passivation for integrated circuit structures |
| 04/23/1991 | US5010019 Method of making a semiconductor device operating in high frequency range |
| 04/23/1991 | US5008997 Semiconductors |
| 04/23/1991 | CA1283270C2 Encapsulation of electronic components |
| 04/20/1991 | CA2027924A1 Epoxy resin blends and curable compositions containing same |
| 04/19/1991 | CA2027031A1 Hermetic substrate coatings in an inert gas atmosphere |
| 04/18/1991 | WO1991005370A1 Hybrid module electronics package |
| 04/18/1991 | WO1991005369A1 Heatsink for semiconductor devices |
| 04/18/1991 | WO1991005368A1 Die attach structure and method |
| 04/18/1991 | WO1991004808A1 Method and apparatus for aligning mating form tools |
| 04/18/1991 | DE3934453A1 Hollowed circuit board for surface-mounted components - permits component replacement by mounting new component over defective component without peripheral damage |
| 04/18/1991 | DE3924439A1 Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente Traegerelement with at least one integrated circuit, in particular for installation in smart cards, as well as processes for preparing these traegerelemente |
| 04/17/1991 | EP0422930A2 Semiconductor integrated circuit devices |
| 04/17/1991 | EP0422928A1 Electronics protective packaging film |
| 04/17/1991 | EP0422558A2 Ceramic substrate used for fabricating electric or electronic circuit |
| 04/17/1991 | EP0422554A1 Cascade assembly of transistors in parallel realised in hybrid circuit technology |
| 04/17/1991 | EP0422127A1 Thick film dielectric compositions |
| 04/16/1991 | US5008855 Method of programming anti-fuse element |
| 04/16/1991 | US5008776 Zero power IC module |
| 04/16/1991 | US5008737 Diamond composite heat sink for use with semiconductor devices |
| 04/16/1991 | US5008735 Silicon, carbide diode, brazing alloy of nickel-god, glass enclosure |
| 04/16/1991 | US5008734 Stadium-stepped package for an integrated circuit with air dielectric |
| 04/16/1991 | US5008733 Semiconductor device |
| 04/16/1991 | US5008731 Integrated semiconductor circuit with decoupled D.C. wiring |
| 04/16/1991 | US5008730 Contact stud structure for semiconductor devices |
| 04/16/1991 | US5008728 Semiconductor integrated circuit device having an improved arrangement of power source lines |
| 04/16/1991 | US5008614 TAB frame and process of testing same |