Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2013
08/22/2013US20130214416 Interconnect structures and methods of manufacturing of interconnect structures
08/22/2013US20130214415 Metal Layer Air Gap Formation
08/22/2013US20130214414 Interconnect structures and methods of manufacturing of interconnect structures
08/22/2013US20130214413 Conductive line structures and methods of forming the same
08/22/2013US20130214412 Method of forming thin film interconnect and thin film interconnect
08/22/2013US20130214411 Metal interconnect of semiconductor device and method of manufacturing the same
08/22/2013US20130214410 Organic interface substrate having interposer with through-semiconductor vias
08/22/2013US20130214409 Semiconductor Device and Method of Forming Bond-on-Lead Interconnection for Mounting Semiconductor Die in FO-WLCSP
08/22/2013US20130214408 Interposer Having Conductive Posts
08/22/2013US20130214407 Semiconductor packaging method and structure thereof
08/22/2013US20130214406 Flexible Heat Sink With Lateral Compliance
08/22/2013US20130214404 Semiconductor module
08/22/2013US20130214403 Forming in-situ micro-feature structures with coreless packages
08/22/2013US20130214402 Semiconductor package and method for manufacturing the same
08/22/2013US20130214400 Micro-electro mechanical systems (mems) structures and methods of forming the same
08/22/2013US20130214399 DC/DC Converter Power Module Package Incorporating a Stacked Controller and Construction Methodology
08/22/2013US20130214398 Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die
08/22/2013US20130214397 Multilayer wiring board and electronic device
08/22/2013US20130214396 Semiconductor packages
08/22/2013US20130214390 Tsv substrate structure and the stacked assembly thereof
08/22/2013US20130214389 Integrated circuit
08/22/2013US20130214388 Semiconductor Wafer Adapted to Support Transparency in Partial Wafer Processing
08/22/2013US20130214387 Chip structure with a passive device and method for forming the same
08/22/2013US20130214385 Package-in-Package Using Through-Hole Via Die on Saw Streets
08/22/2013US20130214379 Photosensitive resin composition, photosensitive resin composition film, and semiconductor device using the photosensitive resin composition or photosensitive resin composition film
08/22/2013US20130214376 Apparatus combining bypass diode and wire
08/22/2013US20130214375 Pad and circuit layout for semiconductor devices
08/22/2013US20130214274 Integrated Circuit and Manufacturing Method
08/22/2013US20130214032 Method of manufacturing led light bar
08/22/2013DE112011102446T5 3D-Durchkontaktierungskondensator mit einer potentialfreien leitfähigen Platte für eine verbesserte Zuverlässigkeit 3D Durchkontaktierungskondensator with a floating conductive plate for improved reliability
08/22/2013DE112006004099B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
08/22/2013DE102013101327A1 Verfahren zur Herstellung eines Halbleiter-Bauelements A process for producing a semiconductor device
08/22/2013DE102012222871A1 Leistungsmodul und Klimagerät Power module and air conditioner
08/22/2013DE102012202708A1 Vorrichtung zur Kühlung von elektrischen Bauteilen Device for cooling electrical components
08/22/2013DE102012202521A1 Verzweigte Polysiloxane und deren Verwendung Branched polysiloxanes and their use
08/22/2013DE102012202281A1 Semiconductor device includes semiconductor chip that includes upper and lower contact plates which are integrally connected to upper chip metallization and lower chip metallization by upper and lower connecting layers
08/22/2013DE102012102611A1 Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates A metal-ceramic substrate and method for manufacturing a metal-ceramic substrate
08/22/2013DE102012101186A1 Wärmetauscherstruktur Heat exchanger structure
08/22/2013DE102012003607A1 Method for manufacturing hydrogen sensor and integrated circuit used in fuel cell system, involves coating hydrogen sensor surface with hydrophobic polymer layer such that polymer portion is removed from area of aluminum bonding pad
08/22/2013DE102010000407B4 Halbleiter-Package mit einem aus Metallschichten bestehenden Band und Verfahren zum Herstellen eines derartigen Halbleiter-Package The semiconductor package with a band consisting of metal layers and method for manufacturing such a semiconductor package
08/22/2013DE102008033651B4 Verfahren zur Herstellung eines Leistungshalbleitermoduls Method for producing a power semiconductor module
08/22/2013DE102007012336B4 Eingangsschutzschaltung Input protection circuit
08/22/2013DE102006060429B4 Elektrisches Bauelement mit Leadframe-Strukturen Electrical component with leadframe structures
08/22/2013DE102004042149B4 Halbleitervorrichtung und Schaltungen mit der Halbleitervorrichtung sowie mit einer Treibeschaltung für die Halbleitervorrichtung Semiconductor device and circuits with the semiconductor device and with a drive circuit for the semiconductor device
08/22/2013DE102004012013B4 Waferanordnung Wafer assembly
08/21/2013EP2629320A2 Mask structure and method for defect-free heteroepitaxial deposition
08/21/2013EP2629084A1 Integrated circuit and manufacturing method
08/21/2013EP2628770A1 Curable polyorganosiloxane composition
08/21/2013EP2628192A1 Light emitting device with reduced epi stress
08/21/2013EP2628186A2 Vertical semiconductor device with thinned substrate
08/21/2013EP2628180A2 Shield-modulated tunable inductor device
08/21/2013EP2628179A1 Method and apparatus for improving substrate warpage
08/21/2013EP2628178A2 Thick-wire bond arrangement and method for producing
08/21/2013EP2628177A1 Heat sink and led cooling system
08/21/2013EP2628176A2 Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
08/21/2013EP2628173A2 Semiconductor module and method of manufacturing a semiconductor module
08/21/2013EP2381478B1 Method of manufacturing an integrated circuit device
08/21/2013CN203151919U Structure of radiating patch
08/21/2013CN203151855U Wire plug seat, integrated circuit socket, integrated circuit, discrete component pin framework and PCB all with antistatic function
08/21/2013CN203150544U A (n-x)th generation DRAM developed on the basis on an nth generation DRAM
08/21/2013CN203150539U 30-row lead frame
08/21/2013CN203150538U 半导体封装构造 Semiconductor package
08/21/2013CN203150537U Lead frame
08/21/2013CN203150536U A graphite film with high thermal conductivity
08/21/2013CN203150535U Chip-on-board encapsulated element conversion bracket with light-guiding fibers
08/21/2013CN203150534U Packaging device containing silicon wafer coated with glass layer
08/21/2013CN103262675A Set-top box having dissipating thermal loads
08/21/2013CN103262671A Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
08/21/2013CN103262239A Semiconductor device with stacked power converter
08/21/2013CN103262238A Circuit device
08/21/2013CN103262237A Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristic
08/21/2013CN103262236A Lead-free structures in a semiconductor device
08/21/2013CN103262235A Method for manufacturing electronic component
08/21/2013CN103262232A Through silicon via with improved reliability
08/21/2013CN103262228A IC device having electromigration resistant feed line structures
08/21/2013CN103262101A Systems and methods for integrating radio-frequency identification circuitry into flexible circuits
08/21/2013CN103260384A Motor controller cooling structure
08/21/2013CN103258839A Vehicle, display device and manufacturing method for semiconductor device
08/21/2013CN103258832A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/21/2013CN103258821A Enhancement type Flash chip with hard reset function and chip encapsulating method
08/21/2013CN103258820A Reinforced SPI port Flash chip and chip packing method
08/21/2013CN103258818A System and method for fine pitch POP structure
08/21/2013CN103258817A Semiconductor packaging structure and manufacturing method thereof
08/21/2013CN103258816A Semiconductor lightning stroke protection device
08/21/2013CN103258815A Bidirectional and symmetrical high-speed overvoltage protective device
08/21/2013CN103258814A LDMOS SCR for protection against integrated circuit chip ESD
08/21/2013CN103258813A Testing structure and forming method of part depletion type SOI MOSFET
08/21/2013CN103258812A Semiconductor device
08/21/2013CN103258811A ITF capacitance parameter extracting structure and method
08/21/2013CN103258810A Method for reducing over electroplating on surface of wafer after through silicon via (TSV) is electroplated with copper
08/21/2013CN103258809A Copper metal connection line of three-five compound semiconductor assembly
08/21/2013CN103258808A Integrated circuit
08/21/2013CN103258807A Circuit substrate, semiconductor encapsulation structure and manufacture process of circuit substrate
08/21/2013CN103258806A Semiconductor package structure with bridging structure and manufacturing method thereof
08/21/2013CN103258805A Semiconductor device chip scale package structure
08/21/2013CN103258804A Self-filleting chip bonding paste
08/21/2013CN103258803A Semiconductor device and method for manufacturing same
08/21/2013CN103258802A Graphite structure, and electronic device using same
08/21/2013CN103258801A Clamping connection type cooling fins
08/21/2013CN103258800A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
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