Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1991
05/30/1991WO1991008587A1 Metal pin grid array package including dieletric polymer sealant
05/30/1991WO1991007777A1 High density multichip package
05/30/1991WO1991007775A1 Hybrid circuit structure and methods of fabrication
05/30/1991WO1991007520A1 Method and apparatus for thin film formation, device, electro-magnetic apparatus, data recording/reproduction apparatus, signal processor, and method of producing molten crystal
05/30/1991CA2067384A1 Metal pin grid array package
05/29/1991EP0429188A2 Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
05/29/1991EP0429037A1 Shield for radio-frequency circuit
05/29/1991EP0428916A1 Compression contacted semiconductor device and method for making of the same
05/29/1991EP0428880A1 Ceramic compositions and their use
05/29/1991EP0428838A1 A method and apparatus for reel to reel manufacturing of high performance multilayer circuit interconnect units
05/29/1991EP0428681A1 Improved electrical connectors and ic chip tester embodying same
05/28/1991US5019997 Adaptive lithography accommodation of tolerances in chip positioning in high density interconnection structures
05/28/1991US5019946 High density interconnect with high volumetric efficiency
05/28/1991US5019945 Backplane interconnection system
05/28/1991US5019942 Insulating apparatus for electronic device assemblies
05/28/1991US5019940 Mounting apparatus for electronic device packages
05/28/1991US5019893 Single package, multiple, electrically isolated power semiconductor devices
05/28/1991US5019892 Chip carrier with accumulator
05/28/1991US5019891 Semiconductor device and method of fabricating the same
05/28/1991US5019883 Input protective apparatus of semiconductor device
05/28/1991US5019880 Heat sink apparatus
05/28/1991US5019675 Ink jet printer
05/28/1991US5019673 Flip-chip package for integrated circuits
05/28/1991US5019554 Structure of superconductive wiring having SiAlON buffer layer thereunder
05/28/1991US5019535 Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
05/28/1991US5019532 Multilayer oxide; reducing capacitance between polysilicon and diffusion segments
05/28/1991US5019531 Process for selectively growing thin metallic film of copper or gold
05/28/1991US5019523 Bipolar transistor
05/28/1991US5019461 Resistive overlayer for thin film devices
05/28/1991US5019419 Polysiloxane
05/28/1991US5019209 Method of manufacturing and using a carrier tape for bonding IC devices
05/28/1991CA1284536C Member for semiconductor apparatus
05/28/1991CA1284523C Uniaxially electrically conductive articles with porous insulating substrate
05/22/1991EP0428458A1 Multilayer material containing soft graphite, said material being mechanically, electrically and thermally reinforced by a metal and method of producing it
05/22/1991EP0428044A2 High power semiconductor device having a housing
05/21/1991US5018051 IC card having circuit modules for mounting electronic components
05/21/1991US5018005 Thin, molded, surface mount electronic device
05/21/1991US5018004 Semi-conductor device
05/21/1991US5018003 Lead frame and semiconductor device
05/21/1991US5018002 High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip
05/21/1991US5018001 Aluminum line with crystal grains
05/21/1991US5017985 Input protection arrangement for VLSI integrated circuit devices
05/21/1991US5017816 Adaptive gate discharge circuit for power FETS
05/21/1991US5017512 Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same
05/21/1991US5017510 Method of making a scalable fuse link element
05/21/1991US5017434 Integrated circuits
05/21/1991US5017244 Process for improving the electrical conductivity of a copper-nickel-iron alloy
05/21/1991CA1284391C2 Semiconductor structure with silicide base tap
05/16/1991WO1991007776A1 A method for housing a tape-bonded electronic device and the package employed
05/16/1991WO1991006977A1 Flexible circuit board for mounting ic and method of producing the same
05/16/1991WO1991006974A1 Improvements to devices for adjusting the temperature of an item by blowing a gas at the desired temperature
05/16/1991WO1991006958A1 A method and a means for cooling electronic components
05/16/1991DE4035991A1 Reduced effect of contact-window mis-alignment in integrated circuits - using spacer technique inside the contact window to restrict interaction of interconnect layer with diffusion to a smaller area
05/16/1991DE4031051A1 Nodule with semiconductor switch(es) and energising circuit - has metal support body with two assembly surfaces, potentially mutually separated
05/16/1991CA2066704A1 Method for housing a tape-bonded electronic device and the package employed
05/15/1991EP0427395A1 Hermetic substrate coatings in an inert gas atmosphere
05/15/1991EP0427384A2 Method of connecting TAB tape to semiconductor chip
05/15/1991EP0427328A2 Method of manufacturing integrated circuits as well as integrated circuit
05/15/1991EP0427265A2 Electronic part mounting board and method of manufacturing the same
05/15/1991EP0427230A2 Hearth arrangement for melting furnace
05/15/1991EP0427226A2 Wiring pattern of semiconductor integrated circuit device
05/15/1991EP0427151A2 Gull-wing zig-zag inline-lead package having end-of-package anchoring pins
05/15/1991EP0427086A2 Adaptive gate discharge circuit for power FETS
05/15/1991EP0427085A1 Enable circuit with embedded thermal turn-off
05/15/1991EP0426992A1 Fabrication method for an integrated MOS semiconductor device
05/15/1991EP0426800A1 Heat-sink structures with increased heat dissipation capacity and methods for the production of such structures
05/15/1991EP0426722A1 Electrical device
05/15/1991CN1051460A 互连结构 Interconnect structure
05/14/1991US5016138 Three dimensional integrated circuit package
05/14/1991US5016090 Cross-hatch flow distribution and applications thereof
05/14/1991US5016089 Substrate for hybrid IC, hybrid IC using the substrate and its applications
05/14/1991US5016087 Integrated circuit package
05/14/1991US5016085 Hermetic package for integrated circuit chips
05/14/1991US5016084 Semiconductor device
05/14/1991US5016083 Submount for semiconductor laser device
05/14/1991US5016082 Integrated circuit interconnect design
05/14/1991US5016081 Mobile ion getterer for metal conductors
05/14/1991US5015858 Thermally isolated focal plane readout
05/14/1991US5015803 Thermal performance package for integrated circuit chip
05/14/1991US5015675 Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators
05/14/1991US5015674 Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide
05/14/1991US5015604 Fabrication method using oxidation to control size of fusible link
05/14/1991US5015600 Method for making integrated circuits
05/14/1991US5015207 Multi-path feed-thru lead and method for formation thereof
05/14/1991US5014777 Cooling structure
05/14/1991CA1284232C Low dose emitter vertical fuse
05/08/1991EP0426609A2 Ceramic insulating substrate and process for producing the same
05/08/1991EP0426496A2 Planarizing surfaces of interconnect substrates by diamond turning
05/08/1991EP0426371A1 Cryogenic semiconductor power devices
05/08/1991EP0426284A1 RF transistor package with nickel oxide barrier
05/08/1991EP0426246A1 Interconnection structure
05/08/1991EP0426151A2 Method of manufacturing a multi-layered wiring structure of semiconductor integrated circuit device
05/08/1991EP0425796A2 Apparatus for and method using the apparatus for the encapsulation of electronic modules
05/08/1991EP0425776A1 Package for a solid-state imaging device
05/08/1991EP0425775A1 Semiconductor package with ground plane
05/08/1991EP0425691A1 Lead frame for semiconductor devices
05/08/1991EP0425607A1 High-density, multi-level interconnects, flex circuits, and tape for tab
05/08/1991DE3936488A1 Flexible base material for prodn. of electrical circuits etc. - by coating copper foil with filled polyamide-acid or polyimide base-coat, with similar unfilled top-coat, and stoving combination
05/08/1991CN1012602B Tab bonded semiconductor chip package method
05/07/1991US5014159 Semiconductor package
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