Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1991
06/19/1991CN1052396A Method for manufacture of semiconductor device
06/18/1991US5025347 Thermal expansion
06/18/1991US5025307 Modular semiconductor device
06/18/1991US5025306 Assembly of semiconductor chips
06/18/1991US5025305 Semiconductor device for detecting or emitting a magnetic line of force or light
06/18/1991US5025304 Buried metal layer insulated with metal oxides
06/18/1991US5025300 Integrated circuits having improved fusible links
06/18/1991US5025299 Cellular power semiconductor device
06/18/1991US5025296 Center tapped FET
06/18/1991US5025133 Semiconductor wafer heating device
06/18/1991US5025114 Multi-layer lead frames for integrated circuit packages
06/18/1991US5024953 Method for producing opto-electric transducing element
06/18/1991US5024922 Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake
06/18/1991US5024883 Glass matrix with ceramic and metallic particles dispersed therein for enhanced flow characteristics; semiconductor casings
06/18/1991US5024871 Ceramic filled fluoropolymetric composite material
06/18/1991US5024264 Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit
06/18/1991US5023993 Method for manufacturing a high-performance package for monolithic microwave integrated circuits
06/13/1991WO1991008620A1 Simulcast communication system
06/13/1991WO1991008588A1 High power, high density interconnect method and apparatus for integrated circuits
06/13/1991WO1991008586A1 Methods of plating into holes and products produced thereby
06/13/1991WO1991008585A1 Method and device for semiconductor fabrication fault analasys
06/13/1991WO1991006978A3 Multi-layer lead frames for integrated circuit packages
06/13/1991DE4039009A1 High density connector for IC chip carrier
06/13/1991DE3940892A1 Electrical rectifier array with semiconductor rectifiers - uses symmetrical sus bar arrangement to evenly divide current to individual rectifiers
06/13/1991DE3940289A1 Cooler for electrotechnical devices - allows self ventilation by air flow through ridges on reverse of back plate
06/12/1991EP0432057A1 Integrated circuit comprising memories and method for its fabrication
06/12/1991EP0432049A1 MOS blow-out fuse with programmable tunnel oxide
06/12/1991EP0432044A1 III-V-Compound power transistor in silicon substrate and method of fabrication
06/12/1991EP0431971A2 Photosensitive composition and resin-encapsulated semiconductor device
06/12/1991EP0431725A2 Direct bonded metal-substrate structures
06/12/1991EP0431721A2 Reaction barrier for a multilayer structure in an integrated circuit
06/12/1991EP0431606A2 Surface structure of ceramics substrate and method of manufacturing the same
06/12/1991EP0431586A2 High-power semiconductor device
06/12/1991EP0431490A1 Semiconductor integrated circuit device having pads at periphery of semiconductor chip
06/12/1991EP0431420A2 High current rectifier
06/12/1991EP0431261A1 Integrated circuit package with cap and device of the same material
06/12/1991EP0431205A1 Multifunction ground plane
06/12/1991EP0431106A1 Packaged electronic circuit with a chip on a gridded area of conductive pads.
06/12/1991EP0385979A4 High-density electronic modules, process and product
06/12/1991EP0177559B1 Integrated-circuit leadframe adapted for a simultaneous bonding operation
06/12/1991CN1052221A Light-emitting or receiving device and method for preparing same
06/11/1991US5023751 Method of producing a tape for providing electronic modules, and tape obtained by this method
06/11/1991US5023703 Semiconductor device
06/11/1991US5023702 Semiconductor device, method of manufacturing the same, and apparatus for carrying out the method
06/11/1991US5023701 Gate array structure and process to allow optioning at second metal mask only
06/11/1991US5023700 Minutely patterned structure
06/11/1991US5023699 Resin molded type semiconductor device having a conductor film
06/11/1991US5023698 Semiconductor device
06/11/1991US5023695 Flat cooling structure of integrated circuit
06/11/1991US5023689 Complementary integrated circuit device equipped with latch-up preventing means
06/11/1991US5023676 Compound semiconductor MESFET device with passivation film
06/11/1991US5023634 Antenna system
06/11/1991US5023407 Printed circuit board with a uniform conductive layer formed by equalization of metals therein
06/11/1991US5023398 Aluminum alloy semiconductor packages
06/11/1991US5023204 Method of manufacturing semiconductor device using silicone protective layer
06/11/1991US5023202 Rigid strip carrier for integrated circuits
06/11/1991US5023189 Method of thermal balancing RF power transistor array
06/11/1991US5022976 Semiconductor circuits; corrosion resistance
06/11/1991US5022969 Process for encasing an electronic component
06/11/1991US5022960 Integrating substrate and metal layers, exposing predetermined part of metal layer by laser machining
06/11/1991US5022829 Vacuum apparatus
06/11/1991US5022580 Vernier structure for flip chip bonded devices
06/11/1991US5022462 Flexible finned heat exchanger
06/11/1991US5022144 Method of manufacture power hybrid microcircuit
06/05/1991EP0430864A2 Method of making electrical interconnections on a universal substrate and device therefor
06/05/1991EP0430702A2 Line material, electronic device using the line material and liquid crystal display
06/05/1991EP0430476A1 Improved silicone-polyimide material for electronic devices
06/05/1991EP0430458A2 Semiconductor chip packages
06/05/1991EP0430430A2 Polyimide
06/05/1991EP0430429A2 A process for fabricating a semiconductor device
06/05/1991EP0430403A2 Method for fabricating interlevel contacts
06/05/1991EP0430345A1 Diode devices and active matrix addressed display devices incorporating such
06/05/1991EP0430273A2 Radiation curable organosiloxane gel compositions
06/05/1991EP0430255A2 Conductive adhesive and article made therewith
06/05/1991EP0430243A2 Carrier plate for semiconductor components
06/05/1991EP0430239A1 Resin molded semiconductor device having tab kept at desired electric potential
06/05/1991EP0430204A1 Plastic mould type semiconductor device
06/05/1991EP0430157A2 Composite circuit board and manufacturing method of the same
06/05/1991EP0429759A1 Three dimensional microelectronic packaging
06/05/1991EP0429697A1 Semiconductor wafer with doped kerf-regions
06/04/1991US5021925 Electrical isolator device
06/04/1991US5021924 Semiconductor cooling device
06/04/1991US5021869 Monolithic semiconductor chip interconnection technique and arrangement
06/04/1991US5021868 IC carrier
06/04/1991US5021867 Dielectric films of titanium oxide and molybdenum oxide
06/04/1991US5021866 An insulating film
06/04/1991US5021865 Lead frame for semiconductor device
06/04/1991US5021864 Die-mounting paddle for mechanical stress reduction in plastic IC packages
06/04/1991US5021861 Integrated circuit power device with automatic removal of defective devices and method of fabricating same
06/04/1991US5021855 Multilayer
06/04/1991US5021840 Schottky or PN diode with composite sidewall
06/04/1991US5021759 Package for very high frequency integrated circuits
06/04/1991US5021362 Laser link blowing in integrateed circuit fabrication
06/04/1991US5021300 Solder back contact
06/04/1991US5021287 Performs lamination without deformation; used for integrated circuits, printed circuit boards
06/04/1991US5021129 Multilayer structures of different electroactive materials and methods of fabrication thereof
06/04/1991US5021105 Copper alloy for electronic instruments
06/04/1991US5020586 Air-cooled heat exchanger for electronic circuit modules
06/04/1991CA1284692C Multilayer interconnection system for multichip high performance semiconductor packaging
06/01/1991CA2011477A1 Process for producing electrical connections on a universal substrate and apparatus for the same
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