Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1991
07/03/1991EP0435584A1 Multi-level circuit structure
07/03/1991EP0435530A2 Hermetic high density interconnected electronic system or other body
07/03/1991EP0435474A2 Composite graphite heat pipe apparatus and method
07/03/1991EP0435473A2 Evaporator having etched fiber nucleation sites and method of fabricating same
07/03/1991EP0435469A2 Method for laser link blowing in integrated circuit fabrication
07/03/1991EP0435427A2 Electronic device sealing resin compositions and sealed electronic devices
07/03/1991EP0435353A2 Semiconductor device and a method of fabricating the same
07/03/1991EP0435187A2 Method of fabricating a semiconductor device
07/03/1991EP0435155A1 Radiating fin having improved life and thermal conductivity
07/03/1991EP0435105A1 Method of manufacturing a Schottky diode device
07/03/1991EP0435093A2 Thin, molded, surface mount electronic device
07/03/1991EP0435047A2 Electrostatic discharge protection for integrated circuits
07/03/1991EP0435009A2 Semiconductor package connecting method, semiconductor package connecting wires and semiconductor devices
07/03/1991EP0434963A2 Compensation circuit for very vast current variations
07/03/1991EP0434946A2 Ink jet printhead having ionic passivation of electrical circuitry
07/03/1991EP0434873A1 A tape-like carrier for mounting an integrated circuit
07/03/1991CN1052750A Silicon ic back silver sputtering metallization
07/03/1991CN1052706A Copper etch process using halides
07/02/1991US5029335 Heat dissipating device for laser diodes
07/02/1991US5029325 TAB tape translator for use with semiconductor devices
07/02/1991US5029324 Semiconductor device having a semiconductive protection layer
07/02/1991US5029279 Standard cells with flip-flops located in a single region and having minimal-length clock lines
07/02/1991US5029277 Optically compensated bipolar transistor
07/02/1991US5029242 Glass-ceramic structure and method for making same
07/02/1991US5029127 Bipolar SRAM having word lines as vertically stacked pairs of conductive lines parallelly formed with holding current lines
07/02/1991US5028989 Semiconductor cooling module
07/02/1991US5028988 Method and apparatus for low temperature integrated circuit chip testing and operation
07/02/1991US5028987 High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip
07/02/1991US5028986 Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
07/02/1991US5028984 Zinc oxide; integrated circuit adhesivess
07/02/1991US5028983 Multilevel integrated circuit packaging structures
07/02/1991US5028982 Semiconductor device
07/02/1991US5028981 Semiconductor device and manufacturing method therefor
07/02/1991US5028975 Semiconductor devices and a process for producing the same
07/02/1991US5028741 High frequency, power semiconductor device
07/02/1991US5028668 Encapsulation of Electronics
07/02/1991US5028650 Boron nitride sheets
07/02/1991US5028555 Self-aligned semiconductor devices
07/02/1991US5028551 Electrode interconnection material, semiconductor device using this material and driving circuit substrate for display device
07/02/1991US5028473 Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
07/02/1991US5028454 Electroless plating of portions of semiconductor devices and the like
07/02/1991US5027997 Silicon chip metallization system
07/02/1991US5027995 Process for bonding semiconductor chips to substrates
07/02/1991US5027866 Forming press for semiconductor package leads
07/02/1991CA1285663C Buried contact structure for reducing resistance in integrated circuits
07/02/1991CA1285662C Chip carrier and header assembly and terminals therefor
07/02/1991CA1285616C Test adapter for integrated circuit carrier
07/02/1991CA1285612C Low resistance electrical interconnection for synchronous rectifiers
06/1991
06/29/1991CA2026801A1 Electronic device sealing resin compositions and sealed electronic devices
06/28/1991CA2032962A1 Resin material for inserting lead frame and molded component thereof
06/28/1991CA2031111A1 Semiconductor package connecting method, semiconductor package connecting wires and semiconductor devices
06/27/1991WO1991009423A1 Improved reduced capacitance chip carrier
06/27/1991WO1991009422A1 Method of making crack-free insulating films with sog interlayer
06/27/1991WO1991009421A1 Packaged diode for high temperature operation
06/27/1991WO1991009419A1 Flip chip technology using electrically conductive polymers and dielectrics
06/27/1991WO1991009087A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith
06/27/1991WO1991009081A1 Crosslinkable fluorinated polymer compositions
06/27/1991WO1991009071A1 Electronic articles containing a fluorinated poly(arylene ether) dielectric
06/27/1991DE3942843A1 Encapsulated monolithic integrated circuit - uses low resistance connections between lead frame and chip
06/27/1991DE3940933A1 Press deformation of soldered base plate - esp. to form convexly curved semiconductor module base plate
06/26/1991EP0434543A2 High-density memory array packaging
06/26/1991EP0434414A1 IC carrier
06/26/1991EP0434392A1 Semiconductor device having improved adhesive structure and method of producing the same
06/26/1991EP0434312A2 Bonding a conductor to a substrate
06/26/1991EP0434311A1 An epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
06/26/1991EP0434298A1 Thermally enhanced electronic component package
06/26/1991EP0434264A2 Package for power semiconductor components
06/26/1991EP0434141A1 Method for encoding identification information on circuit dice using step and repeat lithography
06/26/1991EP0434138A1 Method of forming an aluminum conductor with highly oriented grain structure
06/26/1991EP0434045A2 Method of forming conductive material selectively
06/26/1991EP0433996A1 Anisotropic conductive film and process for producing same
06/26/1991EP0433983A2 Copper etch process using halides
06/26/1991EP0433743A1 Plastic casing for electronic components
06/26/1991EP0433695A2 Integrated circuit device and method to prevent cracking during surface mount
06/26/1991EP0433650A1 Semiconductor device having bipolar-MOS composite element pellet suitable for pressure contacted structure
06/26/1991EP0228431B1 Device for hardening, by means of inserts, an electrical component to protect it against radiations
06/25/1991US5027322 Circuit configuration for identification of integrated semiconductor circuitries
06/25/1991US5027192 Fast power semiconductor circuit
06/25/1991US5027191 Cavity-down chip carrier with pad grid array
06/25/1991US5027189 Integrated circuit solder die-attach design and method
06/25/1991US5027188 Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
06/25/1991US5027175 Integrated circuit semiconductor device having improved wiring structure
06/25/1991US5027174 Semiconductor integrated circuit device with improved resistance against electrostatic noise
06/25/1991US5026748 Matrix filled with three-dimensional arrangement of carbon fibers, thermoplastic, thermosetting or elastomeric resins; bonding electronic components
06/25/1991US5026669 Method of eliminating burrs on a lead frame with a thin metal coating
06/25/1991US5026667 Encapsulation with polyimidesiloxane copolymer
06/25/1991US5026664 Method of providing a semiconductor IC device with an additional conduction path
06/25/1991US5026656 MOS transistor with improved radiation hardness
06/25/1991US5026435 Transformation of austenitic phase into work-induced martensitic phase; high strength, platability, solderability
06/25/1991US5025741 Prevention silicon atoms from separating
06/20/1991DE4038177A1 Semiconductor structure with metal corrosion prevention - by insulation layer between metallisation and barrier layer
06/20/1991DE3941814A1 Carrier plate for power semiconductor components - has metal plate provided with ceramics disc divided into pieces between metallised areas
06/20/1991CA2006174A1 Method of making crack-free insulating films with sog interlayer
06/19/1991EP0433174A1 Integrated circuit with complete protection against ultraviolet rays
06/19/1991EP0432867A2 Method of preparing a heat-conductive composite material
06/19/1991EP0432825A1 Interconnection lead having individual spiral lead design
06/19/1991EP0432796A2 Semiconductor device
06/19/1991EP0432361A2 Strain relief flip-chip integrated circuit assembly with test fixturing
06/19/1991EP0432259A1 Electronic systems disposed in a high force environment
06/19/1991EP0246270B1 Multilayer ceramic laser package
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