| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/25/1991 | WO1991011024A1 Air jet impingement on miniature pin-fin heat sinks |
| 07/25/1991 | WO1991011023A1 Method of producing semiconductor devices |
| 07/25/1991 | WO1991010630A1 Method for reducing shrinkage during firing of green ceramic bodies |
| 07/25/1991 | WO1991010627A1 Metaphosphate glass composition |
| 07/25/1991 | WO1991010573A1 Multi-metal layer interconnect tape for tape automated bonding |
| 07/25/1991 | DE4001554A1 Power semiconductor module with plastics casing - has deposition struts for ceramic substrate at points away from edge |
| 07/25/1991 | CA2049979A1 Three-dimensional electronic unit and method of fabricating same |
| 07/24/1991 | EP0438165A2 Semiconductor device parts |
| 07/24/1991 | EP0438127A2 Semiconductor wafer |
| 07/24/1991 | EP0438056A2 High-Frequency circuit package |
| 07/24/1991 | EP0437980A2 Custom tool printed circuit board |
| 07/24/1991 | EP0437746A2 A semiconductor device comprising a plurality of pellets fixed on a lead frame and method |
| 07/24/1991 | EP0437656A1 Composite structure having a specific thermal coefficient of expansion |
| 07/24/1991 | EP0380519A4 Ic chips with self-aligned thin film resistors |
| 07/24/1991 | EP0262193B1 Process for forming a fuse programmable read-only memory device |
| 07/24/1991 | CN2081577U Air seal potting piece of power device |
| 07/24/1991 | CA2034703A1 Substrate for packaging a semiconductor device |
| 07/24/1991 | CA2034700A1 Substrate for packaging a semiconductor device |
| 07/23/1991 | US5034920 Cross point array memory device |
| 07/23/1991 | US5034801 Intergrated circuit element having a planar, solvent-free dielectric layer |
| 07/23/1991 | US5034800 Hollow plastic package for semiconductor devices |
| 07/23/1991 | US5034799 Semiconductor integrated circuit device having a hollow multi-layered lead structure |
| 07/23/1991 | US5034688 Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support |
| 07/23/1991 | US5034568 Package structure for multichip modules |
| 07/23/1991 | US5034357 Heat-conductive aluminum nitride sintered body and method of manufacturing the same |
| 07/23/1991 | US5034350 Semiconductor device package with dies mounted on both sides of the central pad of a metal frame |
| 07/23/1991 | US5034349 Method of making a connector assembly for a semiconductor device |
| 07/23/1991 | US5034348 Process for forming refractory metal silicide layers of different thicknesses in an integrated circuit |
| 07/23/1991 | US5034347 Semiconductors, microwaves |
| 07/23/1991 | US5034346 Method for forming shorting contact for semiconductor which allows for relaxed alignment tolerance |
| 07/23/1991 | US5034340 Amorphous silicon thin film transistor array substrate and method for producing the same |
| 07/23/1991 | US5034245 Multilayer resin on circuit substrate, electrode patterns |
| 07/23/1991 | US5034091 Erosion masking a multilayer element, dielectrics, resists |
| 07/23/1991 | US5034044 Hermetic sealing, silicon glass |
| 07/23/1991 | US5033970 Self-mounted chip carrier |
| 07/23/1991 | US5033666 Electronics |
| 07/23/1991 | US5033615 Wrapped glass cap article |
| 07/23/1991 | CA1286795C Fabrication of interlayer conductive paths in integrated circuits |
| 07/23/1991 | CA1286793C Thermal conductor assembly |
| 07/23/1991 | CA1286791C Sealing and stress relief layers and use thereof |
| 07/19/1991 | WO1991010699A1 Resin for protecting semiconductors |
| 07/19/1991 | CA2050919A1 Resin for protecting semiconductors |
| 07/17/1991 | EP0437306A2 Self-aligning contact and interconnect structure |
| 07/17/1991 | EP0437194A2 Schottky barrier field effect transistor |
| 07/17/1991 | EP0437110A2 Tungsten deposition process for low contact resistivity to silicon |
| 07/17/1991 | EP0436912A1 Integrated circuit solder die-attach design and method |
| 07/17/1991 | EP0436907A2 Resin mold packaged electronic parts |
| 07/17/1991 | EP0436848A2 Matched impedance vertical conductors in multilevel metal dielectric laminated wiring |
| 07/17/1991 | EP0436844A2 High purity hydroxy-terminated phenyl ladder polysiloxane and method for producing the same |
| 07/17/1991 | EP0436652A1 Hybrid microchip bonding article |
| 07/17/1991 | EP0252115B1 Compressive pedestal for microminiature connections |
| 07/17/1991 | EP0214307B1 Semiconducteur circuit device |
| 07/16/1991 | US5032897 Integrated thermoelectric cooling |
| 07/16/1991 | US5032896 3-D integrated circuit assembly employing discrete chips |
| 07/16/1991 | US5032895 Semiconductor device and method of producing the same |
| 07/16/1991 | US5032894 Semiconductor card with electrical contacts on both faces |
| 07/16/1991 | US5032890 Semiconductor integrated circuit with dummy patterns |
| 07/16/1991 | US5032889 Wiring structure in a wafer-scale integrated circuit |
| 07/16/1991 | US5032886 High-frequency power transistor |
| 07/16/1991 | US5032694 Tantalum and oxide, bonding strength |
| 07/16/1991 | US5032691 Electric circuit assembly with voltage isolation |
| 07/16/1991 | US5032543 Encapsulation, dissolving |
| 07/16/1991 | US5032542 Method of mass-producing integrated circuit devices using strip lead frame |
| 07/16/1991 | US5032538 Embedding tungsten in gallium arsenide |
| 07/16/1991 | US5032472 Vapor deposited thin film |
| 07/16/1991 | US5031822 Methods of joining components |
| 07/16/1991 | US5031821 Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method |
| 07/11/1991 | WO1991010260A1 Process enhancement using molybdenum plugs in fabricating integrated circuits |
| 07/11/1991 | WO1991010258A1 Process for determining the position of a pn transition |
| 07/11/1991 | DE4100145A1 Integrated circuit assembly substrate - has metal-ceramic composite material, with metal filling holes in ceramic plate |
| 07/11/1991 | DE4040751A1 GTO thyristor with frusto=conical semiconductor body - has anode emitter zone adjacent smaller main surface, middle zone and cathode base zone |
| 07/10/1991 | EP0436387A2 Single chamber via etch through a dual-layer dielectric |
| 07/10/1991 | EP0436380A2 Monolithic laser diode array and method of fabrication thereof |
| 07/10/1991 | EP0436337A2 Technique for simplified testing of semiconductor circuits |
| 07/10/1991 | EP0436320A2 Laser ablatable polymer dielectrics and methods |
| 07/10/1991 | EP0436282A2 Area-selective metallization process |
| 07/10/1991 | EP0436200A2 Ceramic package |
| 07/10/1991 | EP0436126A2 Resin-encapsulated semiconductor device |
| 07/10/1991 | CN1052967A 半导体存储设备 Semiconductor memory device |
| 07/10/1991 | CN1052966A 半导体存储设备 Semiconductor memory device |
| 07/09/1991 | US5031072 Baseboard for orthogonal chip mount |
| 07/09/1991 | US5031071 Heat spreading device for component leads |
| 07/09/1991 | US5031069 Integration of ceramic capacitor |
| 07/09/1991 | US5031029 Copper device and use thereof with semiconductor devices |
| 07/09/1991 | US5031028 Heat sink assembly |
| 07/09/1991 | US5031025 Hermetic single chip integrated circuit package |
| 07/09/1991 | US5031024 Resin sealing type semiconductor device having outer leads designed for multi-functions |
| 07/09/1991 | US5031023 Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink |
| 07/09/1991 | US5031022 Film carrier for mounting IC chips |
| 07/09/1991 | US5031018 Basic cell of gate array device |
| 07/09/1991 | US5031016 Semiconductor component with turn-off facility |
| 07/09/1991 | US5030796 Reverse-engineering resistant encapsulant for microelectric device |
| 07/09/1991 | US5030588 Nickel-chromium alloy |
| 07/09/1991 | US5030499 Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
| 07/09/1991 | US5029638 High heat flux compact heat exchanger having a permeable heat transfer element |
| 07/09/1991 | US5029635 Device for cooling regions with limited thermal exchange surface, in particular for electronic components |
| 07/09/1991 | CA1286035C Electronic component insertion machine |
| 07/03/1991 | EP0435648A2 Resin material for inserting a lead frame and a molded component thereof |
| 07/03/1991 | EP0435603A2 RF transistor package and mounting pad |
| 07/03/1991 | EP0435586A2 Heat transfer apparatus for an integrated circuit device |