Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1991
08/20/1991CA1287926C Connection transfer contact for fixing a sprong pin on the edge of a hybrid circuit substrate
08/17/1991CA2036414A1 Epoxy resin compositions for encapsulating semi conductive elements
08/14/1991EP0441653A2 Improvements in process for planarizing an integrated circuit structure using low melting inorganic material
08/14/1991EP0441572A2 Power semiconductor device with heat dissipating property
08/14/1991EP0441392A2 MOS type semiconductor integrated circuit
08/14/1991EP0441180A1 Integrated circuits containing microwave circuits
08/14/1991EP0441164A2 Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate
08/14/1991EP0440791A1 Structure of superconductor wiring and process for its production
08/14/1991EP0440615A1 Uses of uniaxially electrically conductive articles
08/14/1991DE4004151A1 Integrated circuit conductor system - has shaped connector contg. conductors in pattern, corresp. to terminal spots
08/14/1991CN1053863A Bit stack compatible input/output circuits
08/14/1991CA2034361A1 Polycrystalline cvd diamond substrate for single crystal epitaxial growth of semiconductors
08/13/1991US5040187 Monolithic laser diode array
08/13/1991US5040097 Central electric unit for a motor vehicle
08/13/1991US5040096 High force clip
08/13/1991US5040053 Cryogenically cooled integrated circuit apparatus
08/13/1991US5040052 Electronic
08/13/1991US5040051 Hydrostatic clamp and method for compression type power semiconductors
08/13/1991US5040050 Hybrid circuit comprising a cascade connection of parallel-transistor stages
08/13/1991US5040049 Aluminum layer, contact layer of hafnium, titanium or zirconium
08/13/1991US5040048 Metal interconnection layer having reduced hillock formation
08/13/1991US5040047 Enhanced fluorescence polymers and interconnect structures using them
08/13/1991US5040045 High voltage MOS transistor having shielded crossover path for a high voltage connection bus
08/13/1991US5039628 Flip substrate for chip mount
08/13/1991US5039358 Amorphous, hydrogenated carbon electroactive passivation layer
08/13/1991US5039335 Composite material for a circuit system and method of making
08/13/1991US5038858 Finned heat sink and method of manufacture
08/13/1991US5038571 Production and use of coolant in cryogenic devices
08/13/1991US5038453 Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
08/13/1991CA1287695C Protective carrier for semiconductor packages
08/13/1991CA1287694C Composite dielectric structure for optimizing electrical performance in highperformance chip support packages
08/13/1991CA1287693C Tape automated bonding package
08/13/1991CA1287640C Phenol ethers containing epoxide groups
08/08/1991WO1991011897A1 Mounting for electronic components which need to be cooled
08/08/1991WO1991011833A1 Chip interconnect with high density of vias
08/08/1991WO1991011825A1 Method and structures for making integrated circuits
08/08/1991WO1991011823A1 Lead and socket structures with reduced self-inductance
08/08/1991WO1991011821A1 Tape for tab
08/08/1991DE4102718A1 Integrated circuit with supply line layout - has separate lines for functional unit, for feeding to second line and for coupling second line to unit line
08/08/1991DE4010644A1 Encapsulating housing for integrated circuit component - has supply and signal lines formed on substrate, with ends in housing
08/08/1991CA2074529A1 Chip interconnect with high density of vias
08/07/1991EP0440344A1 High frequency device
08/07/1991EP0440332A2 Bit stack compatible input/output circuits
08/07/1991EP0440154A1 Two step process for forming an oxide layer over a stepped surface of a semiconductor wafer
08/07/1991EP0439919A1 Circuit packaging
08/07/1991EP0439825A2 Semiconductor package having leads that break-away from supports
08/07/1991EP0439752A2 Integrated circuit packaging structure
08/07/1991EP0439750A2 Semiconductor superconductor integrated circuit technology
08/07/1991EP0439656A1 Chip support for a microwave semiconductor device
08/07/1991EP0439653A1 High frequency SMD-transistor with two emitter terminals
08/07/1991EP0439652A1 High frequency SMD-transistor with two emitter terminals
08/07/1991CN1013463B Arrangement for deactivating integrated circuits
08/07/1991CA2035857A1 Leadframe
08/06/1991US5038251 Electronic apparatus and a method for manufacturing the same
08/06/1991US5038248 Automatic ESD protection device for semiconductor packages
08/06/1991US5038201 Wafer scale integrated circuit apparatus
08/06/1991US5038200 Resin insulated type semiconductor device
08/06/1991US5038199 Connection terminal of semiconductor device
08/06/1991US5038198 Modular semiconductor power device
08/06/1991US5038197 Hermetically sealed die package with floating source
08/06/1991US5038196 Bonding chip to frame using rubber
08/06/1991US5038195 protective nickel alloy coating to copper leads
08/06/1991US5038194 Semiconductor device
08/06/1991US5037898 Polysiloxane-polylactone block copolymer modified thermostat compositions
08/06/1991US5037876 Matrix of heat resistant polymer intercalated with diamond or amorphous, hydrogenated carbon solid filler; thermoconductiv-ity, oxygen etchability
08/06/1991US5037782 Method of making a semiconductor device including via holes
08/06/1991US5037771 Method for implementing grid-based crosscheck test structures and the structures resulting therefrom
08/06/1991US5037308 Programmable integrated input/output connector module and spring clip connector mechanism
08/06/1991US5037023 Method and apparatus for wire bonding
08/06/1991CA1287413C Cavity-up-cavity-down multichip integrated circuit package
08/01/1991DE4034674A1 Halbleiterbauelement Semiconductor device
08/01/1991DE4002060A1 Halterung fuer zu kuehlende elektronische bauelemente Support for electronic components to kuehlende
08/01/1991CA2035218A1 Chip carrier for microwave semiconductor component
08/01/1991CA2035215A1 High-frequency smd transistor having two emitter terminals
08/01/1991CA2035214A1 High-frequency smd transistor having two emitter terminals
07/1991
07/31/1991EP0439298A2 Cryogenically coolable data processor logic unit
07/31/1991EP0439230A2 Active bypass for inhibiting high-frequency supply voltage variations in integrated circuits
07/31/1991EP0439227A1 Semiconductor device comprising a support, method of manufacturing it, and method of manufacturing the support
07/31/1991EP0439171A2 Epoxy resin composition and semiconductor device encapsulated therewith
07/31/1991EP0439137A2 Substrate for packaging a semiconductor device, packaging structure and method
07/31/1991EP0439134A2 Substrate for packaging a semiconductor device, packaging structure and method
07/31/1991EP0439128A2 Housing for semiconductor device and method of manufacturing
07/31/1991EP0439003A1 Crimp-type semiconductor device having non-alloy structure
07/31/1991EP0438905A2 IC package having replaceable backup battery
07/31/1991EP0438882A2 Enhanced fluorescence polymers and interconnect structures using them
07/31/1991EP0438854A2 A press
07/31/1991EP0438853A1 Forming press for semiconductor package leads
07/31/1991EP0438742A1 Method of fabricating a semiconductor device of thin package type
07/31/1991EP0438693A2 Method of manufacturing semiconductor device
07/31/1991EP0438524A1 Flame retardant epoxy molding compound, method and enscapsulated device
07/31/1991EP0438444A1 Aluminum alloy semiconductor packages.
07/30/1991US5036384 Cooling system for IC package
07/30/1991US5036383 Semiconductor device having an improved bonding pad
07/30/1991US5036382 Semiconductor device having a multi-level wiring structure
07/30/1991US5036380 Burn-in pads for tab interconnects
07/30/1991US5036163 Universal semiconductor chip package
07/30/1991US5036024 Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation
07/30/1991US5035835 Modulatory molecular element
07/25/1991WO1991011824A1 Three-dimensional electronic unit and method of construction
07/25/1991WO1991011025A1 A method for manufacturing of mineature impedance matched interconnection patterns
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