Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1991
09/04/1991EP0444751A2 Polysiloxane modified thermoset compositions
09/04/1991EP0444695A2 Semiconductor device having multilayered wiring structure and method of manufacturing the same
09/04/1991EP0444615A1 Dynamic random access memory having bit lines buried in semiconductor substrate
09/04/1991EP0444580A2 Liquid crystal device and display apparatus
09/04/1991EP0444469A2 High density internconnect
09/04/1991EP0444216A1 Via-forming ceramics composition
09/04/1991CN1054334A Semiconductor device comprising support and method of manufacturing such semiconductor device
09/03/1991US5046161 Flip chip type semiconductor device
09/03/1991US5046160 Masterslice integrated circuit device having an improved wiring structure
09/03/1991US5046141 Low conductivity mounting stud and a method and apparatus for fastening an electronic component using the same
09/03/1991US5045972 High thermal conductivity metal matrix composite
09/03/1991US5045970 Joined substrates having planar electrical interconnection of hybrid circuits
09/03/1991US5045922 Installation structure of integrated circuit devices
09/03/1991US5045921 Pad array carrier IC device using flexible tape
09/03/1991US5045919 Plastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing step
09/03/1991US5045918 Semiconductor device with reduced packaging stress
09/03/1991US5045917 Multi-level semiconductor structure and process of fabricating thereof
09/03/1991US5045916 Bipolar transistor on substrate
09/03/1991US5045915 Low impedance wiring
09/03/1991US5045914 Plastic pad array electronic AC device
09/03/1991US5045913 Bit stack compatible input/output circuits
09/03/1991US5045642 Printed wiring boards with superposed copper foils cores
09/03/1991US5045639 Pin grid array package
09/03/1991US5045514 Sol-gel method for making composite mullite/cordierite ceramics
09/03/1991US5045504 Multilayer; tetraethioxy, then polysiloxane
09/03/1991US5045503 Microwave monolithic integrated circuit with heat radiating electrode
09/03/1991US5045501 Method of forming an integrated circuit structure with multiple common planes
09/03/1991US5045151 Micromachined bonding surfaces and method of forming the same
09/03/1991US5044912 Mold assembly having positioning means
09/03/1991US5044810 IC socket having cover with locking member
09/03/1991CA1288526C Test circuit for measuring specific contact resistivity of self-aligned contacts in integrated circuits
09/03/1991CA1288238C Thick film conductor composition
08/1991
08/28/1991EP0443842A1 Improvements in silver-glass pastes
08/28/1991EP0443841A2 Silver-filled die attach compositions and use of same
08/28/1991EP0443578A1 Multilayer ceramic wiring substrate and pin connecting structure
08/28/1991EP0443508A1 Leadframe for packages of integrated power devices
08/28/1991EP0443439A2 One-transistor-storage cell device and method for making the same
08/28/1991EP0443401A2 Ceramic filled fluoropolymer composite material
08/28/1991EP0443352A2 Polyimides end-capped with diaryl substituted acetylene
08/28/1991EP0443275A1 Electrical edge contact member and a method of manufacturing same
08/28/1991EP0443253A1 Self-aligned contact technology
08/28/1991EP0443044A1 Lead frame for semiconductor device and semiconductor device using the lead frame
08/28/1991EP0424481A4 A heat dissipating device for laser diodes
08/28/1991CN1054147A Thin film electrical component
08/28/1991CN1054055A Metaphosphate glass composition
08/27/1991US5043859 Half bridge device package, packaged devices and circuits
08/27/1991US5043845 High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
08/27/1991US5043797 Cooling header connection for a thyristor stack
08/27/1991US5043796 Isolating multiple device mount with stress relief
08/27/1991US5043795 Semiconductor device
08/27/1991US5043794 Integrated circuit package and compact assemblies thereof
08/27/1991US5043793 Semiconductor device with stress relief coating at the periphery of the device
08/27/1991US5043792 Integrated circuit having wiring strips for propagating in-phase signals
08/27/1991US5043791 Electrical device having improved lead frame and thermally stable connection arrangement and method
08/27/1991US5043790 For semiconductors or transistors
08/27/1991US5043773 Of titanium, vanadium, niobium, tantalum, zironium, hafnium, tungsten and molybdenum carbides; crystal structure
08/27/1991US5043657 Marking techniques for identifying integrated circuit parts at the time of testing
08/27/1991US5043535 Hermetic cerglass and cermet electronic packages
08/27/1991US5043534 Metal electronic package having improved resistance to electromagnetic interference
08/27/1991US5043533 Chip package capacitor cover
08/27/1991US5043302 Glassy binder system for ceramic substrates, thick films and the like
08/27/1991US5043297 Wiring method of on-chip modification for an LSI
08/27/1991US5043295 Method of forming an IC chip with self-aligned thin film resistors
08/27/1991US5043223 Multilayer ceramic substrate and method for making the same
08/27/1991US5043222 Metal sealing glass composite with matched coefficients of thermal expansion
08/27/1991US5043211 Epoxy resin composition and a resin-sealed semiconductor device
08/27/1991US5043195 Fluoroaliphaticsulfonamide polyether and lithium perfluorosulfonate salt
08/27/1991US5043139 Amalgam preform, method of forming the preform and method of bonding therewith
08/27/1991US5042399 Hearth arrangement for melting furnace
08/27/1991US5042386 Destructive device for metal oxide-semiconductors
08/23/1991CA2036771A1 Multilayer ceramic wiring substrate and pin connecting structure
08/22/1991WO1991012630A1 Spin-on glass processing technique for the fabrication of semiconductor devices
08/22/1991DE4004997A1 Design and production of armature connectors - using parallel U=shaped elements with etched notch to improve performance
08/22/1991DE4004457A1 Heat sink for electronic circuit board component - has wires between thermal contact plate and circuit board housing
08/21/1991EP0442752A1 Highly purified metal material and sputtering target using the same
08/21/1991EP0442674A2 Thin film electrical component with polymer substrate
08/21/1991EP0442568A2 Epoxy resin compositions for encapsulating semiconductive elements
08/21/1991EP0442491A2 Semiconductor device having a wiring pattern in which a plurality of lines are arranged in close proximity to one another
08/21/1991EP0442363A1 Fluorinated polymeric composition, fabrication and use thereof
08/21/1991EP0442304A2 Polycrystalline CVD diamond substrate for single crystal epitaxial growth of semiconductors
08/21/1991EP0267216B1 Improvements in or relating to integrated circuits
08/21/1991CA2036169A1 Lamination of integrated circuit packages
08/20/1991WO1990010327A1 A heat dissipating device for laser diodes
08/20/1991US5041943 Hermetically sealed printed circuit board
08/20/1991US5041903 Vertical semiconductor interconnection method and structure
08/20/1991US5041902 Molded electronic package with compression structures
08/20/1991US5041901 Lead frame and semiconductor device using the same
08/20/1991US5041899 Integrated circuit device having an improved package structure
08/20/1991US5041898 Interconnection layer formed on embedded dielectric and method for manufacturing the same
08/20/1991US5041897 Semiconductor device
08/20/1991US5041700 Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure
08/20/1991US5041474 Epoxy resin compositions for sealing semiconductor devices
08/20/1991US5041470 Flame retardant photocurable adhesive for wires and circuit boards
08/20/1991US5041396 Reusable package for holding a semiconductor chip and method for reusing the package
08/20/1991US5041395 Forming a micromodule
08/20/1991US5041342 Metal intermediate layer, metallizing layer and metal member
08/20/1991US5041319 Static protective laminated material
08/20/1991US5041254 Brominated phenolic resins
08/20/1991US5040381 Apparatus for cooling circuits
08/20/1991CA1287929C Electronic package with heat spreader member
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