Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1991
09/25/1991EP0448266A2 Surface mountable semiconductor device having self loaded solder joints
09/25/1991EP0448135A2 An output buffer circuit
09/25/1991EP0447922A1 Resin seal type semiconductor device
09/25/1991EP0447884A2 Semiconductor device having a low temperature UV-cured epoxy seal and method for making the same
09/25/1991EP0447835A2 Heat removal apparatus for liquid cooled semiconductor modules
09/25/1991EP0447677A2 Fluxless solder coating and joining process
09/25/1991EP0447463A1 Antistatic sheet material, package and method of making
09/25/1991EP0305398B1 Multiple integrated circuit interconnection arrangement
09/25/1991CN2085565U All collecting super-efficient luminous diode
09/24/1991US5051870 Electronic socket attachment method and identification system
09/24/1991US5051865 Multi-layer semiconductor device
09/24/1991US5051814 Method of providing stress-free thermally-conducting attachment of two bodies
09/24/1991US5051813 Plastic-packaged semiconductor device having lead support and alignment structure
09/24/1991US5051812 Semiconductor device and method for manufacturing the same
09/24/1991US5051810 Semiconductor device operating in high frequency range
09/24/1991US5051807 Integrated semiconductor structure with incorporated alignment markings
09/24/1991US5051374 Method of manufacturing a semiconductor device with identification pattern
09/24/1991US5051275 Silicone resin electronic device encapsulant
09/24/1991US5050296 Affixing pluggable pins to a ceramic substrate
09/24/1991CA1289681C Multipurpose socket
09/24/1991CA1289447C Antistatic sheet material, package, and method of making
09/19/1991WO1991014282A1 Semiconductor device having a plurality of chips
09/19/1991WO1991014015A1 Method and materials for forming multi-layer circuits by an additive process
09/19/1991WO1991013693A1 Marking or erasing on semiconductor chip package
09/19/1991DE4107883A1 Semiconductor device - contains gate electrodes formed on insulation regions between impurity regions
09/19/1991DE4008215A1 Base material for electrical conductor patterns - comprises substrate covered with layer of mesoscopic metal particles on which conductor tracks can be made by irradiation
09/18/1991EP0447170A2 Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
09/18/1991EP0447020A1 Integrated package having a thermoelectric cooler
09/18/1991EP0446937A2 Method of manufacturing a semiconductor device using bonding wires of different material
09/18/1991EP0446868A1 Tape carrier having improved test pads
09/18/1991EP0446666A2 Solder interconnection structure on organic substrates and process for making
09/18/1991EP0446580A1 Solder interconnection structure with encapsulant and composition of the latter
09/18/1991EP0446346A1 Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
09/18/1991EP0397780A4 Ic with means for reducing esd damage
09/17/1991US5050238 Shielded front end receiver circuit with IF amplifier on an IC
09/17/1991US5050114 Simulation of two-phase liquid cooling for thermal prediction of direct liquid cooling schemes
09/17/1991US5050040 Composite material, a heat-dissipating member using the material in a circuit system, the circuit system
09/17/1991US5050039 Multiple circuit chip mounting and cooling arrangement
09/17/1991US5050038 Heat sink device or surface mount type component mounted on a printed circuit board
09/17/1991US5050037 Liquid-cooling module system for electronic circuit components
09/17/1991US5050036 Liquid cooled integrated circuit assembly
09/17/1991US5049982 Article comprising a stacked array of electronic subassemblies
09/17/1991US5049981 Heat sink for electronic circitry
09/17/1991US5049980 Electronic circuit device and method of manufacturing same
09/17/1991US5049979 Combined flat capacitor and tab integrated circuit chip and method
09/17/1991US5049978 Conductively enclosed hybrid integrated circuit assembly using a silicon substrate
09/17/1991US5049977 Plastic molded type semiconductor device
09/17/1991US5049976 Stress reduction package and process
09/17/1991US5049975 Multilayer structure; refractory silicide, nitride
09/17/1991US5049974 Interconnect device and method of manufacture thereof
09/17/1991US5049973 Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
09/17/1991US5049972 Method of manufacturing semiconductor integrated circuit device
09/17/1991US5049969 Customizable semiconductor devices
09/17/1991US5049964 Bipolar transistor and method of manufacturing the same
09/17/1991US5049764 Active bypass for inhibiting high-frequency supply voltage variations in integrated circuits
09/17/1991US5049596 Epoxy resin based powder coating composition with mixed filler including microfine silica
09/17/1991US5049518 Method of making a trench dram cell
09/17/1991US5048742 Solder-desolder modular station
09/17/1991US5048599 Leak tolerant liquid cooling system employing an improved air purging mechanism
09/17/1991US5048598 Reservior tank for a liquid cooling system
09/17/1991US5048412 Apparatus for processing semiconductor packages and the like
09/17/1991US5048408 Bundling device
09/17/1991US5048179 IC chip mounting method
09/17/1991US5048178 Alignment--registration tool for fabricating multi-layer electronic packages
09/17/1991CA2037006A1 Lead frame
09/17/1991CA1289267C Latchup and electrostatic discharge protection structure
09/17/1991CA1289130C Integral heat pipe module
09/17/1991CA1289123C Locking brackets for auxiliary hanger-rods
09/11/1991EP0446125A1 Power semiconductor device
09/11/1991EP0446112A1 Elastomer connector for integrated circuits of analogous devices, and its fabrication method
09/11/1991EP0445968A1 Low-temperature sinterable inorganic composition having low dielectric constant
09/11/1991EP0445937A2 Delay circuit
09/11/1991EP0445759A1 Multilayer structures with layer interconnection
09/11/1991EP0445726A1 Lead frame having at least two islands and resin molded semiconductor device using it
09/11/1991EP0445505A1 Basic cell for a channelless gate array device
09/11/1991EP0445317A1 Semiconductor device with a fusible link and method of making a fusible link on a semiconductor substrate
09/11/1991EP0445309A1 Fluid heat exchanger for an electronic component
09/11/1991CN1013882B Process for producing cermet substrate with glass adhesion component
09/10/1991WO1991013925A1 Method for polymerization of epoxide compounds
09/10/1991US5047837 Semiconductor device with heat transfer cap
09/10/1991US5047836 Temperature compensating contact to avoid misregistration
09/10/1991US5047834 High strength low stress encapsulation of interconnected semiconductor devices
09/10/1991US5047833 Solderable front metal contact for MOS devices
09/10/1991US5047831 Reduced resistance contact region for semiconductor device
09/10/1991US5047829 Monolithic p-i-n diode limiter
09/10/1991US5047819 Amorphous-silicon thin film transistor array substrate
09/10/1991US5047376 Curing combination for cationically polymerizable materials
09/10/1991US5047371 Glass/ceramic sealing system
09/10/1991US5047367 Annealing, semiconductors
09/10/1991US5046657 Tape automated bonding of bumped tape on bumped die
09/10/1991US5046552 Flow-through heat transfer apparatus with movable thermal via
09/10/1991CA1288644C Oxide superconductive material and method of manufacturing the same
09/05/1991WO1991013464A1 Reduced capacitance chip carrier
09/05/1991WO1991013462A2 Methods of forming electronic packages
09/05/1991WO1991013461A1 Method of treating semiconductor substrate surface and device therefor
09/05/1991WO1991013460A1 Diffuser features for spin-coated films
09/05/1991WO1991013459A1 Optically compensated bipolar transistor
09/05/1991CA2076637A1 Methods of forming electronic packages
09/04/1991EP0444820A2 MMIC package and connection
09/04/1991EP0444818A2 Improved integrated circuit package
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