Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1991
10/15/1991US5057903 Thermal heat sink encapsulated integrated circuit
10/15/1991US5057902 Self-aligned semiconductor devices
10/15/1991US5057901 Lead frame for semi-conductor device
10/15/1991US5057900 Electronic device and a manufacturing method for the same
10/15/1991US5057899 Semiconductor device with improved wiring contact portion
10/15/1991US5057897 Charge neutralization using silicon-enriched oxide layer
10/15/1991US5057896 Semiconductor device and method of producing same
10/15/1991US5057895 Trench conductor and crossunder architecture
10/15/1991US5057882 Thermally optimized interdigitated transistor
10/15/1991US5057878 Insulator of organic material
10/15/1991US5057877 Superconductor interconnection apparatus
10/15/1991US5057805 Microwave semiconductor device
10/15/1991US5057707 Charge pump including feedback circuitry for eliminating the requirement of a separate oscillator
10/15/1991US5057679 Technique for attaching an electronic module to a card body to form an electronic memory card
10/15/1991US5057461 Method of mounting integrated circuit interconnect leads releasably on film
10/15/1991US5057460 Method of making an electronic module, for insertion into an electronic memory-card body
10/15/1991US5057457 Sealed by inner resin, enclosed by outer resin containing wax
10/15/1991US5057456 Method of manufacturing a tab semiconductor package by securing a thin insulating frame to inner leads of the package
10/15/1991US5057453 Method for making a semiconductor bump electrode with a skirt
10/15/1991US5057451 Isotropic etching of thikc oxide under masking later
10/15/1991US5057376 Heat dissipation of semiconductors; noncracking
10/15/1991US5056216 Method of forming a plurality of solder connections
10/15/1991CA1290676C Method for bonding integrated circuit chips
10/13/1991CA2039205A1 Process for brazing metallized components to ceramic substrates
10/12/1991CA2040181A1 Programmable wiring
10/09/1991EP0450980A1 Improvements in or relating to semi-conductor device packaging
10/09/1991EP0450968A2 Circuit boards
10/09/1991EP0450950A2 A flexible high density interconnect structure and flexibly interconnected system
10/09/1991EP0450948A2 High density interconnect structure with top mounted components
10/09/1991EP0450944A2 An epoxy resin composition for encapsulating a semiconductor device
10/09/1991EP0450832A1 A thyristor stack
10/09/1991EP0450773A2 Ceramic composite for electronic applications
10/09/1991EP0450648A1 Semiconductor device whose output characteristic can be adjusted by functional trimming
10/09/1991EP0450572A2 Sealed self aligned contact process and structure
10/09/1991EP0450558A2 Semiconductor device and method of manufacturing the same
10/09/1991EP0450375A1 Interconnect and method of manufacture for semiconductor devices
10/09/1991EP0450320A1 Semiconductor integrated circuit device for high frequency signal processing
10/09/1991EP0450315A1 Copper device and use thereof
10/09/1991EP0450283A1 SOI layout for low resistance gate
10/09/1991EP0450223A1 Lead frames for semiconductor resin packages
10/09/1991CN1055164A Improvements in silver-glass paste
10/08/1991US5055973 Custom tooled printed circuit board
10/08/1991US5055972 Chip carrier socket
10/08/1991US5055967 Aluminum substrate, amorphous aluminum oxide dielectric
10/08/1991US5055914 Ceramic package type semiconductor device and method of assembling the same
10/08/1991US5055912 Semiconductor device
10/08/1991US5055911 Semiconductor device package utilizing a solder flow prevention wall
10/08/1991US5055909 System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink
10/08/1991US5055908 Improved adhesion of gold contactors
10/08/1991US5055907 Extended integration semiconductor structure with wiring layers
10/08/1991US5055906 Semiconductor device having a composite insulating interlayer
10/08/1991US5055704 Integrated circuit package with battery housing
10/08/1991US5055427 Process of forming self-aligned interconnects for semiconductor devices
10/08/1991US5055425 Stacks of solid copper vias in dielectric
10/08/1991US5055342 Fluorinated polymeric composition, fabrication thereof and use thereof
10/08/1991US5054192 Lead bonding of chips to circuit boards and circuit boards to circuit boards
10/08/1991CA1290437C Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
10/05/1991CA2039669A1 Semiconductor device-encapsulating epoxy resin composition
10/03/1991WO1991015103A1 Electrical isolator device
10/03/1991WO1991015031A1 Process for the production of strip transmission lines, in particular lines for electronic hybrid circuits working in the high-frequency range
10/03/1991WO1991014572A1 Diamond-on-a-substrate for electronic applications
10/02/1991EP0449640A1 Method for mounting electrical components.
10/02/1991EP0449484A1 Semiconductor integrated circuit devices with capacitors
10/02/1991EP0449473A2 Method for hermetically sealing electronic devices
10/02/1991EP0449435A2 Construction for cooling of a RF power transistor
10/02/1991EP0449309A2 Method of making metalic thin film
10/02/1991EP0449292A2 Multilayer printed circuit board and production thereof
10/02/1991EP0449150A2 Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate
10/02/1991EP0448942A1 Semiconductor package
10/02/1991EP0448713A1 Semiconductor device
10/02/1991EP0448702A1 Application specific tape automated bonding.
10/02/1991EP0448686A1 High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact.
10/02/1991DE4020194C1 Heat sink for open chip - has flange in which hook-shaped gripping arms joined to tubular base engage
10/01/1991US5054113 Communication system with bit sampling method in portable receiver for simulcast communication
10/01/1991US5053992 Prevention of inspection of secret data stored in encapsulated integrated circuit chip
10/01/1991US5053923 Electronic control unit with common ground connection to a heat sink
10/01/1991US5053922 Demountable tape-automated bonding system
10/01/1991US5053921 Multilayer interconnect device and method of manufacture thereof
10/01/1991US5053920 Integrated power conversion
10/01/1991US5053856 Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices
10/01/1991US5053855 Plastic molded-type semiconductor device
10/01/1991US5053854 Semiconductor components
10/01/1991US5053853 Modular electronic packaging system
10/01/1991US5053852 Molded hybrid IC package and lead frame therefore
10/01/1991US5053851 Metal bump for a thermal compression bond and method for making same
10/01/1991US5053850 Bonding pad for semiconductor devices
10/01/1991US5053358 Method of manufacturing hermetically sealed compression bonded circuit assemblies
10/01/1991US5053357 Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon
10/01/1991US5052481 High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
10/01/1991US5052472 LSI temperature control system
10/01/1991CA1290078C Cooling structure for heat generating electronic components mounted on a substrate
10/01/1991CA1290074C Electronic package with pliant heat sink
10/01/1991CA1290049C Electronic circuit microelement and base assembly
10/01/1991CA1289990C Die attach pickup tools
09/1991
09/29/1991CA2038715A1 Sealing system for hermetic microchip packages
09/27/1991CA2038998A1 Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate
09/26/1991DE4009225A1 Verfahren zum herstellen von streifenleitern, insbesondere fuer elektronische hybrid-schaltungen im hochfrequenzbereich Method for the manufacture of strip conductors, particularly for electronic hybrid circuits in high frequency range
09/25/1991EP0448471A2 Method of planarizing metal layer
09/25/1991EP0448276A2 Integrated circuit interconnection
09/25/1991EP0448273A1 Integrated circuit electromigration monitor
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