Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1991
11/05/1991US5063432 Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
11/05/1991US5063177 Method of packaging microwave semiconductor components and integrated circuits
11/05/1991US5063169 Photosensitive resist layer, exposure, development, apertures, inorganic insulating material to cover conductive pillar, etching
11/05/1991US5063121 Sheet with metallized layer containing molybdenum, tungsten, activator metal or their alloys and interface layer of yttria and alumina
11/05/1991US5063102 Ultraviolet, polymethylsiloxane, mercaptan curing agent, photoinitiator; protecting electronic devices against environment by coating or encapsulating with cured composition
11/05/1991US5062891 Glass and ceramics
11/05/1991CA1291700C Resilient electrically and thermally conductive flexible composite
10/1991
10/31/1991WO1991017567A1 Heat sink assembly
10/31/1991WO1991016726A1 Multilayer circuit board for mounting ic and manufacture thereof
10/31/1991WO1991016725A1 Multilayer thin film wiring process featuring self-alignment of vias
10/31/1991WO1991016656A1 Semiconductor device provided with circuit cell and array, and data input-output device
10/31/1991WO1991016370A1 Crosslinkable fluorinated aromatic ether compositions
10/31/1991DE4014008A1 Highly integrated circuit repair procedure
10/30/1991WO1991016369A1 Fluorinated poly(arylene ethers)
10/30/1991EP0454603A2 High conduction flexible fin cooling module
10/30/1991EP0454447A2 Semiconductor device assembly
10/30/1991EP0454440A1 Method of encapsulating a semiconductor device
10/30/1991EP0454384A2 Electrical via structure and method of forming the same
10/30/1991EP0454328A1 Package for housing electronic component
10/30/1991EP0454150A1 Plastic moulded semiconductor device
10/30/1991EP0454053A2 Method of bending outer leads of a semiconductor device
10/30/1991EP0454005A2 Die attach adhesive composition
10/30/1991EP0453858A1 Process for brazing metallized components to ceramic substrates
10/30/1991EP0453787A2 Semiconductor device having an insulating film
10/30/1991EP0453786A2 Convection transfer system
10/30/1991EP0453764A1 Thermal joint
10/30/1991EP0453763A1 Compliant fluidic cooling hat
10/30/1991EP0453675A1 Independent cooling chamber for multichip unit
10/30/1991EP0372017A4 Epoxy resin compositions for sealing semiconductor devices
10/30/1991CN1055751A Composition of low-strees epoxy sealant
10/29/1991US5061990 Semiconductor device and the manufacture thereof
10/29/1991US5061988 Integrated circuit chip interconnect
10/29/1991US5061987 Silicon substrate multichip assembly
10/29/1991US5061986 Self-aligned extended base contact for a bipolar transistor having reduced cell size and improved electrical characteristics
10/29/1991US5061985 Semiconductor integrated circuit device and process for producing the same
10/29/1991US5061984 Substrate and device comprising interconnection structures
10/29/1991US5061983 Semiconductor device having a metal silicide layer connecting two semiconductors
10/29/1991US5061980 Semiconductor integrated circuit device
10/29/1991US5061978 Semiconductor photosensing device with light shield
10/29/1991US5061863 Transistor provided with a current detecting function
10/29/1991US5061822 Radial solution to chip carrier pitch deviation
10/29/1991US5061779 Liquid epoxy polymer composition and use thereof based on cycloaliphatic amine cured difunctional/polyfunctional resin blends
10/29/1991US5061686 Superconducting power distribution structure for integrated circuits
10/29/1991US5061657 Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer
10/29/1991US5061552 Multi-layer ceramic substrate assembly and a process for manufacturing same
10/29/1991US5061549 Heat activated to bond printed circuit to support; of a thermoplastic resin and a thermoconductive inorganic particulate filler
10/29/1991US5061548 Silane coating; hydrophobic, improved tensile and peel strength, dimensional stability
10/29/1991US5061547 Structure of conductive layers in multilayer substrates for minimizing blisters and delaminations
10/29/1991US5061191 Canted coil spring interposing connector
10/29/1991US5060843 Process of forming bump on electrode of semiconductor chip and apparatus used therefor
10/29/1991CA1291579C Method of isolating functional regions of an integrated circuit
10/27/1991CA2041295A1 Die attach adhesive composition
10/26/1991CA2015542A1 Independent cooling chamber for multichip unit
10/24/1991DE4013256C1 Solder paste for sticking electrical components on substrates - comprises mixt. of silver powder and low melting glass powder
10/23/1991EP0453424A1 An integrated circuit with screen arrangement and a method for its manufacture
10/23/1991EP0453029A1 Technique for manufacturing interconnections for a semiconductor device
10/23/1991EP0452945A1 Dielectric ceramics
10/23/1991EP0452903A2 Lead frame for semiconductor device
10/23/1991EP0452752A2 Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
10/23/1991EP0452664A1 Electronic circuit cooling module
10/23/1991EP0452634A1 Lead frame for semiconductor device
10/23/1991EP0452506A1 METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
10/22/1991US5060189 Semiconductor device with reduced crosstalk between lines
10/22/1991US5060117 Tape of connections for assembly-line mounting of surface-mounted components
10/22/1991US5060116 Electronics system with direct write engineering change capability
10/22/1991US5060114 Conformable pad with thermally conductive additive for heat dissipation
10/22/1991US5060052 TAB bonded semiconductor device having off-chip power and ground distribution
10/22/1991US5060051 Semiconductor device having improved electrode pad structure
10/22/1991US5060050 Semiconductor integrated circuit device
10/22/1991US5060049 Multiple resistivity wiring apparatus
10/22/1991US5060048 Semiconductor component having at least one power mosfet
10/22/1991US5060045 Semiconductor integrated circuit device and method of manufacturing the same
10/22/1991US5060043 Semiconductor wafer with notches
10/22/1991US5059899 Semiconductor dies and wafers and methods for making
10/22/1991US5059770 Multi-zone planar heater assembly and method of operation
10/22/1991US5059677 Polyimide resin and insulating film for electric and electronic devices
10/22/1991US5059558 Use of venting slots to improve hermetic seal for semiconductor dice housed in ceramic packages
10/22/1991US5059557 Method of electrically connecting integrated circuits by edge-insertion in grooved support members
10/22/1991US5059555 Method to fabricate vertical fuse devices and Schottky diodes using thin sacrificial layer
10/22/1991US5059554 Method for forming polycrystalline silicon contacts
10/22/1991US5059553 Metal bump for a thermal compression bond and method for making same
10/21/1991WO1991016727A1 Electronics system with direct write engineering change capability
10/17/1991WO1991015873A1 Economical housing for electronic power components for fixing on a heat sink and process for its manufacture
10/17/1991WO1991013462A3 Methods of forming electronic packages
10/16/1991EP0452104A2 Programmable wiring
10/16/1991EP0452091A2 Electrically programmable antifuse element and method of forming it
10/16/1991EP0452090A2 Method of forming an antifuse element with substantially reduced capacitance
10/16/1991EP0452054A1 HEMT structure with passivated structure
10/16/1991EP0451856A1 Solid-state image sensing device
10/16/1991EP0451644A1 An improved metallization system for reduced corrosion susceptibility
10/16/1991EP0451632A2 Semiconductor structure and method of its manufacture
10/16/1991CN2086937U Bolt-type internally pressure-welded crystal thyratron
10/16/1991CN1014380B Method of fabricating semiconductor device with reduced packaging stress
10/15/1991US5057969 Thin film electronic device
10/15/1991US5057909 Electronic device and heat sink assembly
10/15/1991US5057908 High power semiconductor device with integral heat sink
10/15/1991US5057907 Method and structure for forming vertical semiconductor interconnection
10/15/1991US5057906 Plastic molded type semiconductor device
10/15/1991US5057905 Container package for semiconductor element
10/15/1991US5057904 Socket unit for package having pins and pads
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