Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1991
11/26/1991US5068708 Ground plane for plastic encapsulated integrated circuit die packages
11/26/1991US5068706 Semiconductor device with fuse function
11/26/1991US5068698 MOS semiconductor device having high-capacity stacked capacitor
11/26/1991US5068603 Structure and method for producing mask-programmed integrated circuits which are pin compatible substitutes for memory-configured logic arrays
11/26/1991US5068547 Process monitor circuit
11/26/1991US5068267 Encapsulation of a semiconductor with epoxy resin, a rubber modified phenolic resin a curing agent and silica
11/26/1991US5068206 Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
11/26/1991US5068201 Method for forming a high valued resistive load element and low resistance interconnect for integrated circuits
11/26/1991US5068156 A ceramic substrate as a support, a heat dissipating member with a different coefficient of expansion and a flexible metal foil
11/26/1991US5067233 Method of forming an integrated circuit module
11/26/1991CA1292502C Packaged solid state primary surge protector
11/21/1991EP0457593A2 Lead frame and assembly process
11/21/1991EP0457592A2 Process for manufacturing a multi-layer lead frame
11/21/1991EP0457583A2 Multilayer interconnection substrate
11/21/1991EP0457468A2 Integrated electronic assembly comprising a transmission line
11/21/1991EP0457463A2 Methods of reducing anti-fuse resistance during programming
11/21/1991EP0457449A1 Semiconductor device having via hole and method of producing the same
11/21/1991EP0457313A1 Assembly group, in particular for data technology
11/21/1991EP0457260A1 Semiconductor device having a ceramic package
11/21/1991EP0457131A1 Method of manufacturing semiconductor memory device having stacked capacitor cells
11/21/1991EP0457013A2 Ferroelectric capacitor test structure for chip die
11/21/1991EP0456963A1 Superconducting multilayer ceramic substrate
11/21/1991EP0456791A1 Methods of plating into holes and products produced thereby
11/20/1991CN1056378A Regeneration power supplying method for ic
11/20/1991CN1014796B Epoxy resin composition
11/19/1991US5067047 Circuit pack with inboard jet cooling
11/19/1991US5067008 Ic package and ic card incorporating the same thereinto
11/19/1991US5067007 Semiconductor device having leads for mounting to a surface of a printed circuit board
11/19/1991US5067006 Semiconductor device
11/19/1991US5067005 Semiconductor device
11/19/1991US5067004 Module for interconnecting integrated circuits
11/19/1991US5067003 Semicustom-made semiconductor integrated circuit having interface circuit selectively coupled to different voltage source
11/19/1991US5066998 Severable conductive path in an integrated-circuit device
11/19/1991US5066997 Semiconductor device
11/19/1991US5066991 Semiconductor diode and method
11/19/1991US5066908 Method for electrically detecting positional deviation of contact hole in semiconductor device
11/19/1991US5066831 Universal semiconductor chip package
11/19/1991US5066621 Lead-vanadium-tellurium oxide and optional oxides, bonding semiconductor chips to ceramic substrates, silver flake or powder
11/19/1991US5066614 Semiconductors
11/19/1991US5066613 Process for making semiconductor-on-insulator device interconnects
11/19/1991US5066612 Method of forming wiring of a semiconductor device
11/19/1991US5066605 Process of producing monolithically integrated multifunction circuit arrangements
11/19/1991US5066368 Process for producing black integrally colored anodized aluminum components
11/19/1991US5065504 Method of forming flexible metal leads on integrated circuits
11/19/1991CA1292327C Resistive field shields for high voltage devices
11/19/1991CA1292326C Alignment of leads for ceramic integrated circuit packages
11/15/1991CA2042467A1 Method of making heterojunction bipolar transistor
11/14/1991WO1991017576A1 High density local interconnect in a semiconductor circuit using metal silicide
11/14/1991WO1991017568A1 A multi-layer package incorporating a recessed cavity for a semiconductor chip
11/14/1991DE4113961A1 Semiconductor device with redundant switching circuit - comprising insulating layer formed on substrate with conducting and wiring layers, and test electrode
11/14/1991DE4111383A1 Semiconductor element - has multiple segment contact fingers coupled to ballast resistor
11/13/1991EP0456508A2 Immersion cooling coolant and electronic device using this coolant
11/13/1991EP0456428A2 Electronic system having component parts bonded by a thermally conductive adhesive
11/13/1991EP0456423A2 Circuit pack with inboard jet cooling
11/13/1991EP0456256A2 Method of manufacturing nonvolatile semiconductor memory device
11/13/1991EP0456240A2 Semiconductor device having ventilative insulating films
11/13/1991EP0456208A1 Laser-broken fuse
11/13/1991EP0456202A2 Particle monitor system and method
11/13/1991EP0456066A2 Semiconductor chip mounted inside a device hole of a film carrier
11/13/1991EP0455891A1 Cone electrical contact
11/13/1991EP0455714A1 A method of manufacturing a substrate for placement of electrical and/or electronic components.
11/13/1991CN1056130A Anti-corrosive kovar alloy
11/12/1991US5065281 Molded integrated circuit package incorporating heat sink
11/12/1991US5065280 Flex interconnect module
11/12/1991US5065279 Integral protective enclosure for tab or similar delicate assembly mounted locally on a flexible printed circuit board
11/12/1991US5065228 Thin, flexible circuits
11/12/1991US5065227 Integrated circuit packaging using flexible substrate
11/12/1991US5065225 Tunneling diffusion barrier for local interconnect and polysilicon high impedance device
11/12/1991US5065224 Low noise integrated circuit and leadframe
11/12/1991US5065223 Packaged semiconductor device
11/12/1991US5065222 Semiconductor device having two-layered passivation film
11/12/1991US5065216 Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production
11/12/1991US5065202 Amorphous silicon thin film transistor array substrate and method for producing the same
11/12/1991US5065124 DC-40 GHz module interface
11/12/1991US5064968 Domed lid for integrated circuit package
11/12/1991US5064881 Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
11/12/1991US5064782 Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing
11/12/1991US5064776 Method of forming buried contact between polysilicon gate and diffusion area
11/12/1991US5064706 Carrier tape including molten resin flow path element for resin packaged semiconductor devices
11/12/1991US5064685 Electrical conductor deposition method
11/12/1991US5064378 Mounting of DRAMs of different sizes and pinouts within limited footprint
11/12/1991US5064063 Tube assembly for pin grid array modules
11/12/1991CA2039058A1 Circuit pack with inboard jet cooling
11/08/1991CA2041807A1 Thermally conductive adhesive
11/07/1991DE4041444C1 Synthetic resin bolts for fixing semiconductor elements - made in pin shape of material which pulls together and thickens on heating
11/06/1991EP0455571A2 Low thermal coefficients of expansion(TCE) polyimides
11/06/1991EP0455414A1 Integrated circuits having antifuses
11/06/1991EP0455341A2 Semiconductor contact via structure and method
11/06/1991EP0455339A2 Polycrystalline silicon contact structure
11/06/1991EP0455322A1 Semiconductor device
11/06/1991EP0455245A2 IC lead frame appropriate for multi-chip package
11/06/1991EP0455229A2 Ceramic substrate used for fabricating electric or electronic circuit
11/06/1991EP0455032A2 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
11/06/1991EP0455031A2 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions
11/06/1991EP0454734A1 Devitrifying glass formulations for low expansion printed-circuit substrates and inks
11/05/1991US5063476 Apparatus for controlled air-impingement module cooling
11/05/1991US5063436 Pressure-contacted semiconductor component
11/05/1991US5063435 Semiconductor device
11/05/1991US5063434 Plastic molded type power semiconductor device
11/05/1991US5063433 Semiconductor device having multi-layered wiring structure
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