Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1991
12/17/1991US5072787 Radiator for cooling
12/17/1991US5072520 Method of manufacturing an interconnect device having coplanar contact bumps
12/12/1991WO1991019320A1 Lead frame and semiconductor package using it
12/12/1991WO1991019319A1 Method of producing microbump circuits for flip chip mounting
12/12/1991WO1991019317A1 Sog with moisture resistant protective capping layer
12/12/1991WO1991019067A1 Electronic key integrated circuit
12/11/1991EP0461099A1 Non-volatile semiconductor memory cell
12/11/1991EP0460857A2 Method for producing a semiconductor device with a high density wiring structure
12/11/1991EP0460822A1 Integrated circuit packaging using flexible substrate
12/11/1991EP0460802A2 Electronic device package with battery
12/11/1991EP0460801A2 Zero power IC module
12/11/1991EP0460785A1 Semiconductor device having a heat sink
12/11/1991EP0460668A2 IC module and a junction structure thereof
12/11/1991EP0460531A1 Contact metallisation on semiconductor material
12/11/1991EP0460429A2 Method of making heterojunction bipolar transistor
12/11/1991EP0460391A2 Affixing pluggable pins to a ceramic substrate
12/11/1991EP0460389A1 Enhanced multichip module cooling with thermal optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
12/11/1991CN1056954A Electrode for semiconductor element and semiconductor device having electrode and process for producing same
12/11/1991CN1056953A Device separation structure and semiconductor device improved in wiring structure
12/10/1991US5072425 Semiconductor memory device for decreasing occupancy area by providing sense amplifier driving lines over sense amplifiers and memory cells
12/10/1991US5072331 Secure circuit structure
12/10/1991US5072289 Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
12/10/1991US5072283 Pre-formed chip carrier cavity package
12/10/1991US5072282 Multi-layer wirings on a semiconductor device and fabrication method
12/10/1991US5072281 Interconnection lead having individual spiral lead design
12/10/1991US5072280 Resin sealed semiconductor device
12/10/1991US5072279 Electrical interconnection having angular lead design
12/10/1991US5072274 Semiconductor integrated circuit having interconnection with improved design flexibility
12/10/1991US5071793 Low dielectric inorganic composition for multilayer ceramic package
12/10/1991US5071790 Multilayer; forming doped glass, oxynitride, metal electrode
12/10/1991US5071789 Reduction of refractory halide
12/10/1991US5071787 Semiconductor device utilizing a face-down bonding and a method for manufacturing the same
12/10/1991US5071714 Sputtering aluminum with copper; lower resistivity; superior electromigration
12/10/1991US5071712 Electrical contactors on four sides
12/10/1991US5071619 Fine gold alloy wire for bonding of a semiconductor device
12/10/1991US5071518 Method of making an electrical multilayer interconnect
12/10/1991US5071359 Array connector
12/10/1991US5070936 High intensity heat exchanger system
12/10/1991US5070701 Cooling apparatus
12/10/1991US5070602 Method of making a circuit assembly
12/10/1991CA1293066C System for detachably mounting semi-conductors on conductor substrates
12/09/1991WO1991018957A1 Reworkable adhesive for electronic applications
12/09/1991CA2083514A1 Reworkable adhesive for electronic applications
12/06/1991EP0471003A4 Method of grounding an ultra high density pad array chip carrier.
12/05/1991DE4117761A1 Semiconductor chip with film carrier - has lead wires between chip terminals and external electrodes applied to surface of film
12/05/1991DE4117145A1 Chip mounting method on substrate - by heating adhesive layer to receiver chips from carrier
12/05/1991DE4017752A1 Circuit board - is of format to receive electronic HF transistor stage
12/05/1991DE4017749A1 Low flow resistance liq. cooling body - esp. for cooling semiconductor device includes electrically insulating, thermal conductive material with cooling channels etc.
12/05/1991DE4017697A1 Mfg. electronic component with chip on thermal conductor - positioned in through-hole in base for use as surface mounted power device on metal core circuit board
12/04/1991EP0459773A2 Semiconductor device and method for producing the same
12/04/1991EP0459772A2 Method of forming the wiring of a semiconductor circuit
12/04/1991EP0459690A1 Integrated circuit interconnection
12/04/1991EP0459614A2 Epoxy resin composition
12/04/1991EP0459591A2 Epoxy resin composition
12/04/1991EP0459502A2 Semiconductor integrated circuit device
12/04/1991EP0459493A2 A semiconductor device using a lead frame and its manufacturing method
12/04/1991EP0459442A1 Electronic component including a lead frame with built-in capacitor
12/04/1991EP0459439A2 Semiconductor package having improved mechanical stability for holding interconnection leads and improved capability of hermetic sealing
12/04/1991EP0459283A1 Semiconductor component mounted on a ceramic substrate
12/04/1991EP0459179A1 IC-housing made of three coated dielectric plates
12/04/1991CN1056770A Semiconductor integrated circuit chip having identification circuit therein
12/03/1991US5070393 Aluminum nitride substrate for formation of thin-film conductor layer and semiconductor device using the substrate
12/03/1991US5070392 Integrated circuit having laser-alterable metallization layer
12/03/1991US5070391 Semiconductor contact via structure and method
12/03/1991US5070390 Semiconductor device using a tape carrier
12/03/1991US5070388 Trench-resident interconnect structure
12/03/1991US5070387 Semiconductor device comprising unidimensional doping conductors and method of manufacturing such a semiconductor device
12/03/1991US5070386 Phosphorus silicon nitride layer and phosphorus silicate glass layer permits hydrogen gas to diffuse out
12/03/1991US5070384 Electrically programmable antifuse element incorporating a dielectric and amorphous silicon interlayer
12/03/1991US5070383 Programmable memory matrix employing voltage-variable resistors
12/03/1991US5070376 Semiconductor device
12/03/1991US5070317 Miniature inductor for integrated circuits and devices
12/03/1991US5070182 Cyclobutanetetracarboxylic acid monomer
12/03/1991US5070047 Dielectric compositions
12/03/1991US5070041 Method of removing flash from a semiconductor leadframe using coated leadframe and solvent
12/03/1991US5070040 Thermoconductive thin film of synthetic diamond
12/03/1991US5070039 Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
12/03/1991US5070038 Titanium silicide
12/03/1991US5070037 Planarized surface, polyimide dielectric and photoresist
12/03/1991US5070036 Process for contacting and interconnecting semiconductor devices within an integrated circuit
12/03/1991US5069748 Molybdenum film over titanium film
12/03/1991US5069626 Plated plastic castellated interconnect for electrical components
12/01/1991CA2043422A1 Epoxy resin composition
12/01/1991CA2040628A1 Epoxy resin composition
11/1991
11/28/1991WO1991018417A1 Integrated circuit power device with automatic removal of defective devices
11/28/1991WO1991018416A1 Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction
11/28/1991WO1991018415A1 Circuit board for mounting ic and mounting method thereof
11/28/1991DE4116711A1 IC chip bonding system - uses conductive areas and recesses formed in opposing surfaces of IC chip and carrier substrate
11/28/1991DE4115421A1 Automated bonding system for IC chip - uses signal conductor paths and earthing plane on opposite sides of dielectric film
11/28/1991DE4026326A1 Integrated circuit chip having identification circuit - has voltage limiter and option unit determining identification by existence of current path, between power and input terminals
11/27/1991EP0458469A1 Composite lead frame and semiconductor device using the same
11/27/1991EP0458423A2 Packaging of semiconductor elements
11/27/1991EP0458381A2 A semiconductor device comprising a high voltage MOS transistor having shielded crossover path for a high voltage connection bus
11/27/1991EP0457985A1 Microwave semiconductor device
11/26/1991US5068764 Electronic device package mounting assembly
11/26/1991US5068715 High-power, high-performance integrated circuit chip package
11/26/1991US5068714 Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
11/26/1991US5068712 Semiconductor device
11/26/1991US5068711 Semiconductor device having a planarized surface
11/26/1991US5068709 Semiconductor device having a backplate electrode
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