| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/07/1992 | US5079331 Heat-resistant epoxy resin composition based on 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane |
| 01/07/1992 | US5079194 Crystal growth inhibitor for glassy low dielectric inorganic composition |
| 01/07/1992 | US5079188 Applying dielectric, hardening by heat treatment, etching |
| 01/07/1992 | US5079182 Hydrosilation |
| 01/07/1992 | US5079069 Multilayer |
| 01/07/1992 | US5078492 Test wafer for an optical scanner |
| 01/02/1992 | EP0463972A1 Method of making an electric contact on an active element of an MIS integrated circuit |
| 01/02/1992 | EP0463956A1 Method for making one stage of an integrated circuit |
| 01/02/1992 | EP0463847A2 Terminal arrangement for a die on a printed circuit board |
| 01/02/1992 | EP0463826A1 Sealing glass composition and electrically conductive formulation containing same |
| 01/02/1992 | EP0463782A2 Circuit pack cooling using perforations |
| 01/02/1992 | EP0463763A2 Semiconductor package and method with wraparound metallization |
| 01/02/1992 | EP0463758A1 Hollow chip package and method of manufacture |
| 01/02/1992 | EP0463731A1 Electrode for semiconductor device and process for producing the same |
| 01/02/1992 | EP0463685A1 Method of manufacturing a semiconductor device and device for carrying out said method |
| 01/02/1992 | EP0463669A2 A method of manufacturing a semiconductor device |
| 01/02/1992 | EP0463559A2 Packaged semiconductor device and a manufacturing process therefor |
| 01/02/1992 | EP0463500A1 An apparatus for reducing, enlarging and projecting image information |
| 01/02/1992 | EP0463481A1 Cooling arrangement for a squid measurement device |
| 01/02/1992 | EP0463458A1 Method and structure for interconnecting different polysilicon zones on semiconductor substrates for integrated circuits |
| 01/02/1992 | EP0463423A1 Surface treating agent for aluminum line pattern substrate |
| 01/02/1992 | EP0463373A2 Local interconnect using a material comprising tungsten |
| 01/02/1992 | EP0463365A2 Triple level self-aligned metallurgy for semiconductor devices |
| 01/02/1992 | EP0463362A2 Semiconductor device having metallic layers |
| 01/02/1992 | EP0463332A1 Manufacturing method of a multilayer gate electrode containing doped polysilicon and metal-silicide for a MOS-transistor |
| 01/02/1992 | EP0463297A1 Arrangement comprising substrate and component and method of making the same |
| 01/02/1992 | EP0463184A1 Resin for protecting semiconductors |
| 01/02/1992 | DE4020165A1 Resin packaging of board-mounted chip - using elastic mask with centring opening |
| 12/31/1991 | US5077639 Circuit plate for the optimal decoupling of circuits with digital ic's |
| 12/31/1991 | US5077638 Heat sink for an electric circuit board |
| 12/31/1991 | US5077633 Grounding an ultra high density pad array chip carrier |
| 12/31/1991 | US5077601 Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
| 12/31/1991 | US5077599 High wire bonding strength, low ohmic resistance |
| 12/31/1991 | US5077598 Strain relief flip-chip integrated circuit assembly with test fixturing |
| 12/31/1991 | US5077595 Semiconductor device |
| 12/31/1991 | US5077451 Custom tooled printed circuit board |
| 12/31/1991 | US5077382 Copolyimide odpa/bpda/4,4'-oda or p-pda |
| 12/31/1991 | US5077244 Aluminum nitride sintered body and semiconductor substrate thereof |
| 12/31/1991 | US5077115 Matrix; ceramic filler coated with rubbery polymer that bonds to the filler; thin film bonding poly; multilayer printed wiring boards |
| 12/31/1991 | US5076691 Non-reflecting structures for surface scanners |
| 12/31/1991 | US5076485 Bonding electrical leads to pads with particles |
| 12/31/1991 | US5076204 Apparatus for producing semiconductor device |
| 12/31/1991 | US5075962 Method for forming leads |
| 12/31/1991 | US5075941 Press striking of die stamped metal frames for single-in-line packages for re-establishing planarity and parallellism of the opposite faces of the patterned pins to be eventually bent |
| 12/31/1991 | CA1293824C Barrier layer arrangement for conductive layers on silicon substrates |
| 12/30/1991 | CA2046009A1 Air cooled heat exchanger for multi-chip assemblies |
| 12/27/1991 | EP0462840A1 Material for forming coating film |
| 12/27/1991 | EP0462700A2 Process for the selective encapsulation of an electrically conductive structure in a semiconductor device |
| 12/27/1991 | EP0462656A1 A semiconductor device having a conductive track |
| 12/27/1991 | EP0462552A1 Electronic circuit module with power feed spring assembly |
| 12/27/1991 | EP0293435B1 Infrared detector with improved heat dissipation |
| 12/26/1991 | WO1991020098A2 Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the same |
| 12/25/1991 | CN1057282A Thermally conductive adhesive |
| 12/24/1991 | US5075765 Low stress multichip module |
| 12/24/1991 | US5075762 Semiconductor device having an inter-layer insulating film disposed between two wiring layers and method of manufacturing the same |
| 12/24/1991 | US5075761 Transistors, gate electrode on substrate active region having stacked layers of gate insulator, polycrystalline silicon laye r, metal silicide layer, conductive cap, interconnect containi ng material etching at same rate as gate metal silicide |
| 12/24/1991 | US5075760 Semiconductor device package assembly employing flexible tape |
| 12/24/1991 | US5075759 Surface mounting semiconductor device and method |
| 12/24/1991 | US5075758 Semiconductor device |
| 12/24/1991 | US5075753 Semiconductor integrated circuit device |
| 12/24/1991 | US5075641 High frequency oscillator comprising cointegrated thin film resonator and active device |
| 12/24/1991 | US5075357 Containing a dihyroxy benzene compound, a nitrogen-containing aromatic silane coupler and an inorganic filler; waterproofing seals; semiconductors |
| 12/24/1991 | US5075262 Bonding semiconductor to substrate |
| 12/24/1991 | US5075258 Method for plating tab leads in an assembled semiconductor package |
| 12/24/1991 | US5075254 Method and apparatus for reducing die stress |
| 12/24/1991 | US5075253 Method of coplanar integration of semiconductor IC devices |
| 12/24/1991 | US5075252 Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction |
| 12/24/1991 | US5075201 Method for aligning high density infrared detector arrays |
| 12/24/1991 | US5075200 Process of forming superconductive wiring strip |
| 12/24/1991 | US5075174 Parylene coated elastomers |
| 12/24/1991 | US5074969 Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate |
| 12/24/1991 | US5074947 Flip chip technology using electrically conductive polymers and dielectrics |
| 12/24/1991 | US5074922 Method of producing beryllium copper alloy member |
| 12/24/1991 | US5074139 Roll forming of semiconductor component leadframes |
| 12/24/1991 | US5074037 Process for producing electrical connections on a universal substrate |
| 12/24/1991 | CA1293544C Plated plastic castellated interconnect for electrical components |
| 12/23/1991 | CA2029566A1 Metallized bag with improved interlayer adhesion for static protection of electronic components |
| 12/20/1991 | WO1991020095A1 Solder interconnections and methods for making same |
| 12/19/1991 | DE4039536A1 Encapsulated semiconductor device - has bond formed by melting tip of thin wire and pressing onto contact spot |
| 12/18/1991 | EP0461989A1 Device using surface mounted electronic components and comprising a cooling device |
| 12/18/1991 | EP0461875A2 Wiring connecting device |
| 12/18/1991 | EP0461818A2 Solder-desolder modular station |
| 12/18/1991 | EP0461753A2 Modular electronic packaging system |
| 12/18/1991 | EP0461750A2 Interconnect for integrated circuits |
| 12/18/1991 | EP0461639A2 Plastic-molded-type semiconductor device |
| 12/18/1991 | EP0461544A1 Heat dissipation device and method of fabricating same |
| 12/18/1991 | EP0461458A1 Method & structure for forming vertical semiconductor interconnection |
| 12/18/1991 | EP0461414A2 Method of cutting interconnection pattern with laser and apparatus thereof |
| 12/18/1991 | EP0461316A1 Die attachment |
| 12/18/1991 | EP0461313A1 Dynamic random access memory device |
| 12/18/1991 | EP0214229B1 Logic circuit having improved testability for defective via contacts |
| 12/18/1991 | EP0169241B1 Method for forming hermetically sealed electrical feedthrough conductors |
| 12/18/1991 | EP0120918B1 An aluminum-metal silicide interconnect structure for integrated circuits and method of manufacture thereof |
| 12/17/1991 | US5073817 Resin encapsulated semiconductor device with heat radiator |
| 12/17/1991 | US5073816 Packaging semiconductor chips |
| 12/17/1991 | US5073814 Multi-sublayer dielectric layers |
| 12/17/1991 | US5073580 Oxyacid bismuth oxyhydroxide compounds; waterproofing, corrosion resistance for aluminum wiring |
| 12/17/1991 | US5073526 Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite |
| 12/17/1991 | US5073521 Method for housing a tape-bonded electronic device and the package employed |
| 12/17/1991 | US5073210 Gold alloy |