| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/28/1992 | US5084421 Bonding a semiconductor with a paste of silver flake, glass frit, surfactant, thixotropic agent and solvent |
| 01/28/1992 | US5084418 Method of making an array device with buried interconnects |
| 01/28/1992 | US5084417 Method for selective deposition of refractory metals on silicon substrates and device formed thereby |
| 01/28/1992 | US5084416 Burying a wiring layer film securely into a contact hole havin g high aspect ratio |
| 01/28/1992 | US5084415 Adhesive layer on dielectric |
| 01/28/1992 | US5084414 For VLSI circuits, three step additive process, selectively de positing a tungsten conductor |
| 01/28/1992 | US5084412 Method of manufacturing a semiconductor device with a copper wiring layer |
| 01/28/1992 | US5084406 Method for forming low resistance DRAM digit-line |
| 01/28/1992 | US5084404 Gate array structure and process to allow optioning at second metal mask only |
| 01/28/1992 | US5084403 Contact hole |
| 01/28/1992 | US5084402 Bipolar transistor |
| 01/28/1992 | US5084355 Semiconductor integrated circuits |
| 01/28/1992 | US5084323 Oxidation resistant barrier layer for refractory metal |
| 01/28/1992 | US5083927 Solderless compliant socket |
| 01/28/1992 | US5083865 Particle monitor system and method |
| 01/28/1992 | US5083605 Self-pumping phase change thermal energy device |
| 01/28/1992 | US5083373 Method for providing a thermal transfer device for the removal of heat from packaged elements |
| 01/28/1992 | US5083368 Method of forming modular power device assembly |
| 01/25/1992 | CA2047546A1 Socket for electric part |
| 01/23/1992 | WO1992001198A1 Liquid cooled cooling device |
| 01/23/1992 | WO1992001011A1 Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same |
| 01/23/1992 | WO1992000925A1 Glass compositions |
| 01/23/1992 | WO1992000924A1 Tellurite glass compositions |
| 01/23/1992 | WO1992000800A1 Radiation-resistant polycrystalline diamond optical and thermally conductive articles and their method of manufacture |
| 01/23/1992 | DE4022904A1 Verfahren zum anbringen einer die orientierung des kristallgitters einer kristallscheibe angebenden markierung A method for attaching a marker the orientation of the crystal lattice of a crystal disc indicating |
| 01/23/1992 | DE4022829A1 Electronic memory card - with connection leads aiding fixing of chip onto card |
| 01/23/1992 | DE4022545A1 Solder contact points prodn. on semiconductor contact layer - using structurised oxide film of e.g. silica or alumina as solder stop in simple, quick and economical technique |
| 01/23/1992 | DE4021872A1 Highly integrated electronic component with semiconductor chip - stabilises terminal lead frame by insulating strip-form frame with slits joining conductor paths by conductive adhesive |
| 01/22/1992 | EP0467711A1 Flow-through heat transfer apparatus with movable thermal via |
| 01/22/1992 | EP0467553A1 Integrated circuit device having signal wiring structure of ultrahigh-speed performance |
| 01/22/1992 | EP0467259A2 Electronic device |
| 01/21/1992 | US5083234 Multilayer transducer with bonded contacts and method for implementation of bonding |
| 01/21/1992 | US5083194 Air jet impingement on miniature pin-fin heat sinks for cooling electronic components |
| 01/21/1992 | US5083193 Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility |
| 01/21/1992 | US5083191 Semiconductor device |
| 01/21/1992 | US5083189 Resin-sealed type IC device |
| 01/21/1992 | US5083188 Integrated circuit having superconductive wirings |
| 01/21/1992 | US5083187 Integrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereof |
| 01/21/1992 | US5083186 Semiconductor device lead frame with rounded edges |
| 01/21/1992 | US5082880 Semiconductor sealing composition containing epoxy resin and polymaleimide |
| 01/21/1992 | US5082802 Depositing metal layer; patterning, etching, encapsulation |
| 01/21/1992 | US5082801 Process for producing multilayer interconnection for semiconductor device with interlayer mechanical stress prevention and insulating layers |
| 01/21/1992 | US5082796 Doping, etching, heating |
| 01/21/1992 | US5082606 Catalytic hydrogen oxidation to form water vapor; cofiring |
| 01/21/1992 | US5082522 Dielectric layer in semiconductor |
| 01/21/1992 | US5082162 Methods for soldering semiconductor devices |
| 01/21/1992 | US5081949 Apparatus for selective tinning of substrate leads |
| 01/21/1992 | US5081764 Terminal structure and process of fabricating the same |
| 01/20/1992 | CA2047329A1 Compact sram cell layout |
| 01/19/1992 | WO1992002038A1 Processing microchips |
| 01/19/1992 | CA2087429A1 Processing microchips |
| 01/15/1992 | EP0466611A1 Composite comprising a silicon substrate and layered superconducting thin films |
| 01/15/1992 | EP0466363A1 High power semiconductor device with integral heat sink |
| 01/15/1992 | EP0466205A1 Method for coating a substrate with a silicon nitrogen-containing material. |
| 01/15/1992 | EP0465814A1 A semiconductor device package and method of its manufacture |
| 01/15/1992 | EP0465812A1 Electronic assembly with enhanced heat sinking |
| 01/15/1992 | CN1015306B Making method for power transistor |
| 01/14/1992 | US5081563 Multi-layer package incorporating a recessed cavity for a semiconductor chip |
| 01/14/1992 | US5081562 Circuit board with high heat dissipations characteristic |
| 01/14/1992 | US5081520 Chip mounting substrate having an integral molded projection and conductive pattern |
| 01/14/1992 | US5081518 Use of a polysilicon layer for local interconnect in a CMOS or BICMOS technology incorporating sidewall spacers |
| 01/14/1992 | US5081516 Self-aligned, planarized contacts for semiconductor devices |
| 01/14/1992 | US5081327 Sealing system for hermetic microchip packages |
| 01/14/1992 | US5081070 Superconducting circuit board and paste adopted therefor |
| 01/14/1992 | US5081067 Hermetic sealing ceramic packages on a support, wires, solders and caps |
| 01/14/1992 | US5081064 Method of forming electrical contact between interconnection layers located at different layer levels |
| 01/14/1992 | US5081060 Masking, integrated circuits |
| 01/14/1992 | US5080980 Ceramic package for semiconductor device |
| 01/14/1992 | US5080966 Copper and copper oxide coated with titanium compound |
| 01/14/1992 | US5080927 Titanium nitride from vapor deposition of cyclopentadienyl tit anium bound to a triazo group |
| 01/14/1992 | US5079835 Method of forming a carrierless surface mounted integrated circuit die |
| 01/14/1992 | CA1294377C Fabrication of customized integrated circuits |
| 01/11/1992 | CA2045081A1 High power semiconductor device with integral heat sink |
| 01/09/1992 | WO1992000605A1 Metal electronic package having improved resistance to electromagnetic interference |
| 01/09/1992 | WO1992000604A1 Metal bump for a thermal compression bond and method for making same |
| 01/09/1992 | WO1992000603A1 Semiconductor device and method of manufacturing the same |
| 01/09/1992 | WO1992000395A1 Iron-nickel alloy |
| 01/09/1992 | DE4119920A1 Semiconductor device with increased life - by preventing grain boundary electromigration in connection layer |
| 01/08/1992 | EP0465264A2 Metal film forming method |
| 01/08/1992 | EP0465253A2 Integrated circuit and lead frame assembly |
| 01/08/1992 | EP0465227A2 Composite integrated circuit device |
| 01/08/1992 | EP0465199A1 Multiple lamination high density interconnect process and structure |
| 01/08/1992 | EP0465197A2 Multi-sublayer dielectric layers |
| 01/08/1992 | EP0465196A2 Compact high density interconnect structure |
| 01/08/1992 | EP0465195A2 Multiple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing Tg's |
| 01/08/1992 | EP0465152A2 Method for producing semiconductor device having alignment mark |
| 01/08/1992 | EP0465143A2 Molded hybrid IC package and lead frame therefore |
| 01/08/1992 | EP0465138A2 Interconnection of electronic components |
| 01/08/1992 | EP0465084A2 Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s) |
| 01/08/1992 | EP0464866A2 Wafer and method of making same |
| 01/08/1992 | EP0464834A1 Method of generating active semiconductor structures by means of starting structures which have a two-dimensional charge carrier layer parallel to the surface |
| 01/08/1992 | EP0464567A2 Cold cathode element |
| 01/08/1992 | EP0464232A1 Solder connector and process for making an electrical circuit with this solder connector |
| 01/08/1992 | EP0314712B1 Two-terminal semiconductor diode arrangement |
| 01/08/1992 | EP0174986B1 Process for forming and locating buried layers |
| 01/07/1992 | US5079673 Ic card module |
| 01/07/1992 | US5079619 Apparatus for cooling compact arrays of electronic circuitry |
| 01/07/1992 | US5079618 Semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies |
| 01/07/1992 | US5079617 Multiple layer electrode structure for semiconductor device and method of manufacturing thereof |
| 01/07/1992 | US5079609 Semiconductor device having dielectric breakdown protection element and method of fabricating same |