| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/19/1992 | EP0471376A2 Electrode structure of monolithically-formed heavy-current element and small signal element and method of manufacturing the same |
| 02/19/1992 | EP0471310A1 MOS-type semiconductor integrated circuit device |
| 02/19/1992 | EP0471185A2 Process for forming refractory metal silicide layers in an integrated circuit |
| 02/19/1992 | EP0471122A1 High density interconnection structures and methods of forming such structures |
| 02/19/1992 | EP0471003A1 Method of grounding an ultra high density pad array chip carrier. |
| 02/19/1992 | EP0422127A4 Thick film dielectric compositions |
| 02/19/1992 | CN2096818U Transistor gate device |
| 02/19/1992 | CN1015585B Self-centering electrode for power devices |
| 02/19/1992 | CN1015584B Electronic parts |
| 02/19/1992 | CN1015582B Carrier substrate and method for preparing same |
| 02/18/1992 | WO1992003846A1 Anodized aluminum electronic package components |
| 02/18/1992 | US5089936 Semiconductor module |
| 02/18/1992 | US5089929 Retrofit integrated circuit terminal protection device |
| 02/18/1992 | US5089881 Fine-pitch chip carrier |
| 02/18/1992 | US5089880 Pressurized interconnection system for semiconductor chips |
| 02/18/1992 | US5089879 Resin seal type semiconductor device |
| 02/18/1992 | US5089878 Low impedance packaging |
| 02/18/1992 | US5089877 Electrical power to a circuit device |
| 02/18/1992 | US5089876 Semiconductor ic device containing a conductive plate |
| 02/18/1992 | US5089587 Novel epoxy resins and manufacturing method thereof based on phenoldicyclopentadiene adducts |
| 02/18/1992 | US5089549 Polyimide resin solution compositions |
| 02/18/1992 | US5089543 Epoxy resin electrical encapsulation composition |
| 02/18/1992 | US5089440 Solder interconnection structure and process for making |
| 02/18/1992 | US5089439 Process for attaching large area silicon-backed chips to gold-coated surfaces |
| 02/18/1992 | US5089436 Doping through barrier layer so maximum ion density is within barrier layer |
| 02/18/1992 | US5089303 Striation-free, protective coatings for silicon wafers, polyimides, graphite composites |
| 02/18/1992 | CA2088165A1 Anodized aluminum electronic package components |
| 02/12/1992 | EP0470920A1 Tube assembly for pin grid array modules |
| 02/12/1992 | EP0470899A1 Diode having electrodes and housing assembled without soldering or crimping and rectifier bridge created with such diodes |
| 02/12/1992 | EP0470839A2 Ceramic substrate having wiring incorporating silver |
| 02/12/1992 | EP0470806A2 Active device having an oxide superconductor and a fabrication process thereof |
| 02/12/1992 | EP0470559A1 Method of mounting semiconductor integrated circuits |
| 02/12/1992 | EP0470501A2 Thermal conductive colored aluminum nitride sintered body and method of preparing the same |
| 02/12/1992 | EP0470210A1 Low inductance encapsulated package including a semiconductor chip |
| 02/11/1992 | US5088008 Circuit board for mounting electronic components |
| 02/11/1992 | US5087964 Package for a light-responsive semiconductor chip |
| 02/11/1992 | US5087963 Glass-sealed semiconductor device |
| 02/11/1992 | US5087962 Insulated lead frame using plasma sprayed dielectric |
| 02/11/1992 | US5087961 Semiconductor device package |
| 02/11/1992 | US5087959 Protective coating useful as a passivation layer for semiconductor devices |
| 02/11/1992 | US5087958 Misalignment tolerant antifuse |
| 02/11/1992 | US5087888 Light weight power amplifier assembled with no hand soldering or screws |
| 02/11/1992 | US5087839 Method of providing flexibility and alterability in VLSI gate array chips |
| 02/11/1992 | US5087658 Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste |
| 02/11/1992 | US5087590 Bonding pellet having electrodes to a die pad on copper alloy lead frame free from silver plating with resin, thermally curing resin in oxidation resistance atmosphere |
| 02/11/1992 | US5087589 Selectively programmable interconnections in multilayer integrated circuits |
| 02/11/1992 | US5087588 Semiconductor |
| 02/11/1992 | US5087578 Forming electrodes of high melting metal or its silicide; heat treatment to flatten insulating surface; noncracking; electrodes connected to bonding wire |
| 02/11/1992 | US5087530 Automatic bonding tape used in semiconductor device |
| 02/11/1992 | US5087509 Substrate used for fabrication of thick film circuit |
| 02/11/1992 | US5087479 Method and apparatus for enveloping an electronic component |
| 02/11/1992 | US5087413 Conducting material and a method of fabricating thereof |
| 02/11/1992 | US5087331 Process and jig for plating pin grid arrays |
| 02/11/1992 | US5086558 Direct attachment of semiconductor chips to a substrate with a substrate with a thermoplastic interposer |
| 02/11/1992 | CA1295753C Printed circuit board cooling system employing bellows and layer of thermal grease and method for forming the layer |
| 02/06/1992 | WO1992002117A1 Heat dissipating structure of semiconductor device |
| 02/06/1992 | WO1992002042A1 Compact sram cell layout |
| 02/06/1992 | WO1992002041A1 Process for producing a marker indicating the orientation of the crystal lattice of a wafer |
| 02/06/1992 | WO1992002040A1 Package for incorporating an integrated circuit and a process for the production of the package |
| 02/06/1992 | WO1992002036A1 Method of producing a semiconductor layer with a rutile-type crystalline structure and articles made therefrom |
| 02/06/1992 | WO1991020098A3 Wafer base for silicon carbide semiconductor devices, incorporating alloy substrates, and method of making the same |
| 02/05/1992 | EP0469988A1 Interconnection method between an integrated circuit and a circuit carrier and integrated circuit adapted to this method |
| 02/05/1992 | EP0469920A1 Method of manufacturing insulated substrate for semiconductor devices and patterned metal plate used therefor |
| 02/05/1992 | EP0469890A2 Organopolysiloxane composition and its gel cured product |
| 02/05/1992 | EP0469798A2 Micropin array and production method thereof |
| 02/05/1992 | EP0469744A1 Wafer cooling device |
| 02/05/1992 | EP0469728A1 Programmable interconnect architecture |
| 02/05/1992 | EP0469614A1 Flip-chip semiconductor device |
| 02/05/1992 | EP0469587A2 Improvements in or relating to integrate circuits |
| 02/05/1992 | EP0469299A2 Electrically well insulated support element for a silicon wafer used as a component in electrical and electronic circuits |
| 02/05/1992 | EP0469217A1 Method of forming stacked self-aligned polysilicon PFET devices and structures resulting therefrom |
| 02/05/1992 | EP0469216A1 Method of forming metal contact pads and terminals on semiconductor chips |
| 02/05/1992 | EP0469215A1 Method of forming stacked tungsten gate PFET devices and structures resulting therefrom |
| 02/05/1992 | EP0469214A1 Method of forming stacked conductive and/or resistive polysilicon lands in multilevel semiconductor chips and structures resulting therefrom |
| 02/05/1992 | EP0469157A1 Method of treating semiconductor substrate surface and device therefor |
| 02/05/1992 | CN1058487A Transistor for electric power |
| 02/04/1992 | US5086337 Connecting structure of electronic part and electronic device using the structure |
| 02/04/1992 | US5086334 Chip carrier |
| 02/04/1992 | US5086333 Substrate for semiconductor apparatus having a composite material |
| 02/04/1992 | US5086018 Method of making a planarized thin film covered wire bonded semiconductor package |
| 02/04/1992 | US5086006 Semiconductor device and method of production |
| 02/04/1992 | US5085923 Printed circuits; high purity, high density |
| 02/04/1992 | US5085913 Silicone material |
| 02/04/1992 | US5085712 Iron/copper/chromium alloy material for high-strength lead frame or pin grid array |
| 02/04/1992 | US5084966 Method of manufacturing heat pipe semiconductor cooling apparatus |
| 02/04/1992 | CA1295436C Holding container |
| 01/29/1992 | EP0468801A2 Distributed constant circuit board using ceramic substrate material |
| 01/29/1992 | EP0468787A2 Tape automated bonding in semiconductor technique |
| 01/29/1992 | EP0468748A1 Socket for electric part |
| 01/29/1992 | EP0468734A1 Semi-conductor device having circuits on both sides of insulation layer and ultrasonic signal path between the circuits |
| 01/29/1992 | EP0468710A1 Protection of devices |
| 01/29/1992 | EP0468475A1 Power semiconductor device suitable for automation of production |
| 01/29/1992 | EP0468420A2 Integrated component in flatpack package |
| 01/29/1992 | EP0468379A2 Semiconductor device having a package |
| 01/29/1992 | EP0468275A2 Filmcarrier for tape automated bonding |
| 01/29/1992 | EP0468035A1 Diffuser features for spin-coated films |
| 01/28/1992 | US5084753 Packaging for multiple chips on a single leadframe |
| 01/28/1992 | US5084752 Semiconductor device having bonding pad comprising buffer layer |
| 01/28/1992 | US5084750 Multilayer |
| 01/28/1992 | US5084595 Ceramic base for a semiconductor device |