| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/11/1992 | EP0474224A1 Semiconductor device comprising a plurality of semiconductor chips |
| 03/11/1992 | EP0474176A2 Thin film multilayer circuit and method of making thin film multilayer circuits |
| 03/11/1992 | EP0474044A1 Cooling device for a transistor-power-amplifier |
| 03/11/1992 | EP0473929A1 Method of forming a thin film electronic device |
| 03/11/1992 | EP0473796A1 Semiconductor device having a plurality of chips |
| 03/11/1992 | EP0454734A4 Devitrifying glass formulations for low expansion printed-circuit substrates and inks |
| 03/10/1992 | US5095404 Arrangement for mounting and cooling high density tab IC chips |
| 03/10/1992 | US5095402 Internally decoupled integrated circuit package |
| 03/10/1992 | US5095362 Method for reducing resistance for programmed antifuse |
| 03/10/1992 | US5095361 Tape-like carrier for mounting of integrated circuit |
| 03/10/1992 | US5095360 Ceramic chip-resistant chamfered integrated circuit package |
| 03/10/1992 | US5095359 Semiconductor package and computer using the package |
| 03/10/1992 | US5095357 Inductive structures for semiconductor integrated circuits |
| 03/10/1992 | US5095356 Cellular integrated circuit and hierarchical method |
| 03/10/1992 | US5095352 Semiconductor integrated circuit device of standard cell system |
| 03/10/1992 | US5095268 Tool for tuning microwave circuit within a closed housing |
| 03/10/1992 | US5094984 Suppression of water vapor absorption in glass encapsulation |
| 03/10/1992 | US5094983 Making circuit hydrophobic with reaction product of disilazane and water |
| 03/10/1992 | US5094982 Lead frame and method of producing electronic components using such improved lead frame |
| 03/10/1992 | US5094981 Technique for manufacturing interconnections for a semiconductor device by annealing layers of titanium and a barrier material above 550° C. |
| 03/10/1992 | US5094969 Method for making a stackable multilayer substrate for mounting integrated circuits |
| 03/10/1992 | US5094963 Process for producing a semiconductor device with a bulk-defect region having a nonuniform depth |
| 03/10/1992 | US5094769 Mineral oil or poly alpha olefin oil, filler, coupler |
| 03/10/1992 | US5094709 Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
| 03/10/1992 | US5093989 Method of making heat-resistant hermetic packages for electronic components |
| 03/10/1992 | CA2045227A1 High memory density package |
| 03/10/1992 | CA1297208C Diamond composite heat sink for use with semiconductor devices |
| 03/10/1992 | CA1297203C Compliant s-leads for chip carriers |
| 03/05/1992 | WO1992003904A1 Mounting of electronic devices |
| 03/05/1992 | WO1992003849A1 Semiconductor device, semiconductor memory using the same, cmos semiconductor integrated circuit, and process for fabricating the semiconductor device |
| 03/05/1992 | WO1992003848A2 Stacking of integrated circuits |
| 03/05/1992 | WO1992003847A1 Encapsulation of electronic components |
| 03/05/1992 | WO1992003845A1 Packaging of electronic devices |
| 03/05/1992 | WO1992003844A1 Multilayer integrated circuit module |
| 03/05/1992 | WO1991000683A3 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 03/05/1992 | DE4128421A1 Interconnection of 2 aluminium@ metallisation layers in semiconductor - using reactive first layer and a transition layer between the aluminium layers in via-contacts |
| 03/04/1992 | EP0473260A1 Fabrication of semiconductor packages |
| 03/04/1992 | EP0473144A2 Semiconductor integrated circuit comprising interconnections |
| 03/04/1992 | EP0472938A2 Device for testing and repairing an integrated circuit |
| 03/04/1992 | EP0472866A2 Ferroelectric device packaging techniques |
| 03/04/1992 | EP0472804A2 Copper-semiconductor compounds capable of being produced at room temperature |
| 03/04/1992 | EP0472776A2 Aluminum nitride powder, sintered body and production thereof |
| 03/04/1992 | EP0472766A1 Process for encapsulating a contacted semiconductor chip |
| 03/04/1992 | EP0286660B1 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
| 03/03/1992 | US5093713 Semiconductor device package |
| 03/03/1992 | US5093712 Resin-sealed semiconductor device |
| 03/03/1992 | US5093710 Semiconductor device having a layer of titanium nitride on the side walls of contact holes and method of fabricating same |
| 03/03/1992 | US5093709 Lead frame having a diagonally terminating side rail end |
| 03/03/1992 | US5093708 Multilayer integrated circuit module |
| 03/03/1992 | US5093283 Method of manufacturing a semiconductor device |
| 03/03/1992 | US5093282 Gold plating |
| 03/03/1992 | US5093281 method for manufacturing semiconductor devices |
| 03/03/1992 | US5093276 Channel formation by contact self-alignment |
| 03/03/1992 | US5092161 Duct testing |
| 03/03/1992 | US5092036 Filling metal tubes, then etching tubes away |
| 03/03/1992 | US5092034 Soldering interconnect method for semiconductor packages |
| 03/03/1992 | CA1296815C Aluminum alloy semiconductor packages |
| 03/01/1992 | CA2047767A1 Electronic circuit |
| 02/28/1992 | CA2048005A1 High thermal conductivity metal matrix composite |
| 02/27/1992 | DE4026667A1 Mfg. SMD semiconductor component - using support system of flat, metal frames in row with inwardly directed contact tongues |
| 02/27/1992 | DE4026666A1 Mfg. monolithic semiconductor chip on substrate wafer - applying beam leads from contact windows to chip edge via insulating layer |
| 02/26/1992 | EP0472465A2 Method of depositing insulating layer on underlaying layer using plasma-assisted CVD process using pulse-modulated plasma |
| 02/26/1992 | EP0472452A1 Power transistor and its manufacturing process |
| 02/26/1992 | EP0472451A1 Hybrid integrated circuit interconnection structure and method of fabrication |
| 02/26/1992 | EP0472357A2 A semiconductor integrated circuit |
| 02/26/1992 | EP0472199A1 Method of manufacturing plastic molded semiconductor device and apparatus for manufacturing the same |
| 02/26/1992 | EP0472165A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/26/1992 | EP0472041A2 Method and apparatus for detecting deformations of leads of semiconductor device |
| 02/26/1992 | EP0471982A1 Mounting system for electrical function units, especially for data technics |
| 02/26/1992 | EP0471938A1 High circuit density thermal carrier |
| 02/26/1992 | EP0397747A4 Three-dimensional circuit component assembly and method corresponding thereto |
| 02/26/1992 | EP0204004B1 Wiring structure of a terminal circuit |
| 02/25/1992 | WO1992003902A1 Method and device for hermetic encapsulation of electronic components |
| 02/25/1992 | US5091772 Semiconductor device and package |
| 02/25/1992 | US5091770 Semiconductor device having a ceramic package |
| 02/25/1992 | US5091769 Configuration for testing and burn-in of integrated circuit chips |
| 02/25/1992 | US5091768 Semiconductor device having a funnel shaped inter-level connection |
| 02/25/1992 | US5091341 Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member |
| 02/25/1992 | US5091340 Flatness, accuracy |
| 02/25/1992 | US5091339 Etching, patterning |
| 02/25/1992 | US5091331 Ultra-thin circuit fabrication by controlled wafer debonding |
| 02/25/1992 | US5091289 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
| 02/25/1992 | US5091251 Adhesive tapes and semiconductor devices |
| 02/25/1992 | US5091229 Electronics protective packaging film |
| 02/25/1992 | US5090609 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
| 02/25/1992 | US5090119 Method of forming an electrical contact bump |
| 02/24/1992 | CA2048558A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/20/1992 | WO1992003035A1 Ultra high density integrated circuit packages, method and apparatus |
| 02/20/1992 | WO1992003034A1 Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
| 02/20/1992 | WO1992002958A1 Trench conductors and crossover architecture |
| 02/20/1992 | WO1992002954A1 High power, compound semiconductor device and fabrication process |
| 02/20/1992 | WO1992002953A1 Molded integrated circuit package |
| 02/20/1992 | DE4124877A1 Integrated semiconductor circuit with standard cells - has one cell interconnection in internal region of standard cell(s) |
| 02/20/1992 | DE4101042C1 Contact and encapsulation of micro-circuits using solder laser - and laser transparent contact film segments with conductor sheets of solderable material, geometrically associated with solder protuberances |
| 02/20/1992 | DE4039037C1 Mfg. electronic components using conductor frame - providing retaining strips in parallel with connecting tags and encapsulating chip, solder metal and contact strap |
| 02/20/1992 | DE4025885A1 Compact high-power thyristor stack for heavy duty machinery - uses cylindrical frame formed from disc-shaped heat sinks |
| 02/20/1992 | DE4025622A1 Terminal contact for integrated circuit semiconductor systems - comprises barrier-, undoped gold and gold rich eutectic gold-tin doped-layers on conducting path |
| 02/19/1992 | EP0471552A1 Heat transfer module for ultra high density and silicon on silicon packaging applications |
| 02/19/1992 | EP0471507A2 Plastic cavity package lid seal process |
| 02/19/1992 | EP0471471A1 Package enclosing semiconductor devices |