H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1992
03/31/1992	US5101324 Structure, method of, and apparatus for mounting semiconductor devices
03/31/1992	US5101323 Component-connecting device and functional module for the use thereof
03/31/1992	US5101263 Semiconductor device and method for manufacturing the same
03/31/1992	US5101261 Electronic circuit device with electronomigration-resistant metal conductors
03/31/1992	US5101259 Multilayer element with a wiring layer of aluminum, a heat resistant thermoplastic film and a protective layer of an inorganic material
03/31/1992	US5101154 Open bond detector for an integrated circuit
03/31/1992	US5100834 Method of planarizing metal layer
03/31/1992	US5100827 Buried antifuse
03/31/1992	US5100826 Process for manufacturing ultra-dense dynamic random access memories using partially-disposable dielectric filler strips between wordlines
03/31/1992	US5100817 Load devices in SRAM cells
03/31/1992	US5100812 Method of manufacturing semiconductor device
03/31/1992	US5100809 Method of manufacturing semiconductor device
03/31/1992	US5100740 Eutectic Oxide
03/31/1992	US5100737 Multi-layer material comprising flexible graphite which is reinforced mechanically, electrically and thermally by a metal and a process for the production thereof
03/31/1992	US5100503 Silica-based anti-reflective planarizing layer
03/31/1992	US5100498 Method of producing a minutely patterned structure
03/31/1992	US5099910 Microchannel heat sink with alternating flow directions
03/31/1992	US5099550 Clamp for attachment of a heat sink
03/31/1992	CA1298414C Linewidth loss measurement
03/31/1992	CA1298392C Resin sealed semiconductor device and a method for making the same
03/31/1992	CA1298377C Miniature device for connecting electrical conductors carrying very high intensity currents
03/28/1992	WO1992006495A1 Thermal stress-relieved composite microelectronic device
03/28/1992	CA2091465A1 Thermal stress-relieved composite microelectronic device
03/28/1992	CA2051924A1 Leadframe adapted to support semiconductor elements and method of mounting leadframe
03/26/1992	DE4109533A1 Silicon chip with low-carrier-density oxide passivation - prevents significant narrowing of space-charge region on both sides of PN junctions adjoining diffusion regions
03/26/1992	DE4030055A1 Verfahren zum herstellen einer schaltung A method of making a circuit
03/26/1992	CA2051989A1 Method of forming interlayer-insulating film
03/25/1992	WO1992005582A1 Semiconductor chip assemblies, methods of making same and components for same
03/25/1992	EP0477004A2 Multi-layer wiring board
03/25/1992	EP0476971A2 Ceramic packages and ceramic wiring board
03/25/1992	EP0476954A1 Method for preparing green sheets
03/25/1992	EP0476871A1 Process monitor circuit and method
03/25/1992	EP0476661A2 Press-contact type semiconductor device
03/25/1992	EP0476625A2 A semiconductor device comprising interconnections
03/25/1992	EP0476589A2 Multi-layer wiring substrate and production thereof
03/25/1992	EP0476584A1 Dynamic random access memory having an elevated contact
03/25/1992	EP0476136A1 Three-dimensional electronic unit and method of construction
03/25/1992	EP0476095A1 Electrical isolator device
03/25/1992	CN1016027B Hermetically sealed electronic component
03/24/1992	USRE33859 Hermetically sealed electronic component
03/24/1992	US5099393 Electronic package for high density applications
03/24/1992	US5099388 Alumina multilayer wiring substrate provided with high dielectric material layer
03/24/1992	US5099381 Enable circuit with embedded thermal turn-off
03/24/1992	US5099311 Microchannel heat sink assembly
03/24/1992	US5099310 Alloy of copper, tungsten and molybdenum on alumina, thermoconductivity
03/24/1992	US5099308 Semiconductor device having reverse conductivity-type diffusion layer and semiconductor wiring layer connected by metallic connection wiring layer
03/24/1992	US5099306 Stacked tab leadframe assembly
03/24/1992	US5098963 Adducts of metabrominated phenols and polyfunctional epoxides
03/24/1992	US5098864 Dielectric polymer sealant bonding to cover component
03/24/1992	US5098863 Method of stabilizing lead dimensions on high pin count surface mount I.C. packages
03/24/1992	US5098862 Method of making ohmic electrical contact to a matrix of semiconductor material
03/24/1992	US5098769 Two-shot molded article for use in circuit formation
03/24/1992	US5098609 A filler, a stabilizing dispersant of a fatty acid ester and salts and carriers
03/24/1992	US5098534 Succinimide and phthalimide with alkali metal hydroxide for stripping silver
03/24/1992	US5098305 Memory metal electrical connector
03/24/1992	CA1297998C Interconnection system for integrated circuit chips
03/19/1992	WO1992004730A1 Semiconductor device and its manufacturing process
03/19/1992	WO1992004729A1 Leadframe for molded plastic electronic packages
03/19/1992	DE4029505A1 Feuchtigkeitshaertende, alkoxysilanterminierte polyurethane Moisture-curing polyurethane alkoxysilane
03/19/1992	DE4029504A1 Dichtungs- und klebemassen mit speziellen weichmachern Sealing and adhesive compositions with special plasticizers
03/18/1992	EP0475646A2 Semiconductor integrated circuit comprising interconnections
03/18/1992	EP0475637A2 Dynamic latch circuit
03/18/1992	EP0475575A1 High thermal conductivity metal matrix composite
03/18/1992	EP0475519A1 Interconnection structure
03/18/1992	EP0475432A2 Wire bonding inspection equipment
03/18/1992	EP0475269A2 Integrated circuit device comprising a wiring substrate
03/18/1992	EP0475223A2 Method of fabricating integrated circuit chip package
03/18/1992	EP0475022A1 Direct attachment of semiconductor chips to a substrate with a thermoplastic interposer
03/18/1992	CN1059606A Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices
03/18/1992	CA2051272A1 Method for preparing green sheets
03/17/1992	US5097441 Interdigitated and twisted word line structure for semiconductor memories
03/17/1992	US5097393 Multilayer interconnect device and method of manufacture thereof
03/17/1992	US5097387 Circuit chip package employing low melting point solder for heat transfer
03/17/1992	US5097385 Super-position cooling
03/17/1992	US5097319 Cover with through terminals for a hermetically sealed electronic package
03/17/1992	US5097318 Semiconductor package and computer using it
03/17/1992	US5097317 Connector are coated with mixture of silica gel and resin
03/17/1992	US5097117 Electronic microcircuit card and method for its manufacture
03/17/1992	US5096934 Polyuerethane, Polyetherurethane
03/17/1992	US5096857 Containing silica, alumina and one or more of oxides of sodium, calcium and strontium; packaging integrated circuits
03/17/1992	US5096853 Method for manufacturing a resin encapsulated semiconductor device
03/17/1992	US5096852 Method of making plastic encapsulated multichip hybrid integrated circuits
03/17/1992	US5096851 Vapor deposition of silicon nitride protective coating
03/17/1992	US5096768 Dielectric
03/17/1992	US5096762 Epoxy resin, curing agent, alumina filler, silicone-modified epoxy or phenol resin
03/17/1992	US5096749 Method of producing a metallization layer structure
03/17/1992	US5096425 Pin-shaped or flat-plate-shaped parallel terminals of an electronic or piezoelectric component for being inserted in a printed circuit board
03/17/1992	US5096081 Cover plate for semiconductor devices
03/17/1992	US5095973 Heat exchangers
03/17/1992	US5095626 Method of producing semiconductor memory packages
03/17/1992	CA1297597C Method of assembling tab bonded semiconductor chip package
03/17/1992	CA1297572C Box for the thermal stabilization of equipment, such as electronic components contained therein
03/12/1992	WO1992004145A1 System of machining devices
03/12/1992	DE4028725A1 Ink marker for semiconductor chips - has inking head with nozzle and air valve for ejecting preset ink vol.
03/12/1992	DE4028440A1 Mfg. printed circuits from PCB(s) and hybrid(s) - using hybrid(s) in greenform to obtain shape for mounting before sintering
03/12/1992	CA2091446A1 System of machining devices
03/11/1992	EP0474508A2 Liquid crystal display device and mounting arrangement therefor
03/11/1992	EP0474499A2 Lead frame for a semiconductor device
03/11/1992	EP0474469A1 Multi-layer lead frame for a semiconductor device
03/11/1992	EP0474383A1 Dielectric for use in manufacturing semiconductors

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