| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/21/1992 | US5106433 Sandwiching metal sheet of high thermal expansion between punched low expansion sheets, rolling, welding exterior foils of high expansion |
| 04/21/1992 | US5106432 With sharp edges which are reliably detectable by automatic alignment systems |
| 04/21/1992 | US5106009 Methods of joining components |
| 04/21/1992 | US5105536 Method of packaging a semiconductor chip in a low inductance package |
| 04/21/1992 | US5105533 Mounting head |
| 04/18/1992 | CA2053521A1 Organic resin multi-layer wiring substrate and method of making the same |
| 04/16/1992 | WO1992006561A1 Temperature stabilization buffer for a solid state electronic component |
| 04/16/1992 | WO1992006494A1 Amalgam preform, method of forming the preform and method of bonding therewith |
| 04/16/1992 | WO1992006493A1 Hermetically sealed microelectronic package |
| 04/16/1992 | WO1992006491A1 Bonding of solid state device to terminal board |
| 04/16/1992 | WO1992006138A1 Flame retardant epoxy molding compound, method and encapsulated device |
| 04/16/1992 | DE4131504A1 heat sink spring clamp for electronic power component - provides openings for insertion of release tool in opposing spring arms |
| 04/16/1992 | DE4130637A1 Mfg. connection element for power semiconductor module - esp. from one-side copper@ coated polyimide foil |
| 04/16/1992 | DE4033361A1 Bipolar high voltage transistor - comprises collector-base junction covered with layer of polycrystalline silicon@ and undoped CVD-silicon di:oxide |
| 04/16/1992 | DE4032099A1 Dram-bauteil und verfahren zu seiner herstellung DRAM component and process for its preparation |
| 04/15/1992 | EP0480750A2 Liquid cooling system for LSI packages |
| 04/15/1992 | EP0480580A2 Method for manufacturing an electrode structure of a semiconductor device |
| 04/15/1992 | EP0480468A1 Glassy low dielectric inorganic composition |
| 04/15/1992 | EP0480409A1 Method of fabricating a Ti/TiN/Al contact, with a reactive sputtering step |
| 04/15/1992 | EP0480372A1 Semiconductor rectifying device and full-wave rectifier fabricated using the same |
| 04/15/1992 | EP0480271A1 Semiconductor device having structures for accurate bonding |
| 04/15/1992 | EP0480197A1 A method for manufacturing plastics IC packages incorporating a heat sink |
| 04/15/1992 | EP0380570A4 Heat dissipating interconnect tape for use in tape automated bonding |
| 04/15/1992 | CN1060280A Sealing glass composition and electrically conductive formulation containing same |
| 04/15/1992 | CN1016298B Formed top contact for non-flat semiconductor devices |
| 04/15/1992 | CN1016297B Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body |
| 04/14/1992 | US5105430 Thin planar package for cooling an array of edge-emitting laser diodes |
| 04/14/1992 | US5105324 Device for protecting semiconductor circuits against transients on the supply line |
| 04/14/1992 | US5105261 Semiconductor device package having particular lead structure for mounting multiple circuit boards |
| 04/14/1992 | US5105260 Rf transistor package with nickel oxide barrier |
| 04/14/1992 | US5105259 Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation |
| 04/14/1992 | US5105258 Thermal expansion buffer |
| 04/14/1992 | US5105257 Packaged semiconductor device and semiconductor device packaging element |
| 04/14/1992 | US5105256 Semiconductor device having improved element arrangement strong against external surge voltage |
| 04/14/1992 | US5105255 MMIC die attach design for manufacturability |
| 04/14/1992 | US5105066 Device comprising a heating sample carrier |
| 04/14/1992 | US5104848 Device and method of manufacturing a device |
| 04/14/1992 | US5104827 Method of making a plastic-packaged semiconductor device having lead support and alignment structure |
| 04/14/1992 | US5104826 Prevention current leakage; barrier metal below aluminum electrode |
| 04/14/1992 | US5104820 Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting |
| 04/14/1992 | US5104734 Applying metal as metal benzotriazole; heating |
| 04/14/1992 | US5104604 Flame retardant epoxy molding compound, method and encapsulated device method of encapsulating a semiconductor device with a flame retardant epoxy molding compound |
| 04/14/1992 | US5104581 Tray for integrated circuit |
| 04/14/1992 | CA1298700C Protective box for electronic circuits hardened with respect to x-rays |
| 04/12/1992 | CA2051890A1 Crystal growth inhibitor for glassy low dielectric inorganic composition |
| 04/09/1992 | DE4129654A1 Metallising process for semiconductor - by applying first metal, barrier of titanium-tungsten nitride, then second metal |
| 04/09/1992 | DE4031814A1 Power semiconductor package with semiconductor support - has metal core with insulated conductor track structures for semiconductor coupling |
| 04/08/1992 | EP0479461A2 Prevention of inspection of secret data stored in encapsulated integrated circuit chip |
| 04/08/1992 | EP0479205A2 Electronic circuit and method of making same |
| 04/08/1992 | EP0479127A2 Semiconductor device sealed with mold resin |
| 04/08/1992 | EP0478879A2 A system of interconnecting electrical elements having differing bonding requirements for mounting said elements to a printed circuit board |
| 04/08/1992 | EP0478554A1 Selective tungsten interconnection for yield enhancement |
| 04/08/1992 | EP0438524A4 Flame retardant epoxy molding compound, method and enscapsulated device |
| 04/08/1992 | EP0404766B1 Arrangement for detachable fastening modules to a module support |
| 04/07/1992 | US5103293 Polyimides |
| 04/07/1992 | US5103292 Metal pin grid array package |
| 04/07/1992 | US5103291 Hermetically sealed package for electronic components |
| 04/07/1992 | US5103290 Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip |
| 04/07/1992 | US5103289 Dual sip package structures |
| 04/07/1992 | US5103288 Semiconductor device having multilayered wiring structure with a small parasitic capacitance |
| 04/07/1992 | US5103287 Multi-layered wiring structure of semiconductor integrated circuit device |
| 04/07/1992 | US5103283 Packaged integrated circuit with in-cavity decoupling capacitors |
| 04/07/1992 | US5103282 Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and i/o unit circuit of the gate array |
| 04/07/1992 | US5103247 Semiconductor device |
| 04/07/1992 | US5103166 Semiconductor integrated circuit chip having an identification circuit therein |
| 04/07/1992 | US5103103 Microwave shield |
| 04/07/1992 | US5102831 Method of manufacturing multi-chip package |
| 04/07/1992 | US5102829 Plastic pin grid array package |
| 04/07/1992 | US5102828 Method for manufacturing a semiconductor card with electrical contacts on both faces |
| 04/07/1992 | US5102827 Contact metallization of semiconductor integrated-circuit devices |
| 04/07/1992 | US5102822 Etching grooves in semiconductor; filling with dielectric |
| 04/07/1992 | US5102749 Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite |
| 04/07/1992 | US5102718 Multi-chip substrate |
| 04/07/1992 | US5102506 Zinc-based microfuse |
| 04/07/1992 | US5102029 Microwave integrated circuit package to eliminate alumina substrate cracking and method |
| 04/07/1992 | CA1298669C2 Fabrication of customized integrated circuits |
| 04/07/1992 | CA1298667C Module sealing structure |
| 04/05/1992 | CA2050359A1 Method of packaging microwave semiconductor components and integrated circuits |
| 04/02/1992 | WO1992005677A1 Process for manufacturing circuits |
| 04/02/1992 | WO1992005583A1 Semiconductor device having many lead pins |
| 04/02/1992 | WO1992005581A1 Semiconductor device having heat radiating fin assembly and case for containing the same |
| 04/02/1992 | WO1992005227A1 Sealing and adhesive compounds with special plasticizers |
| 04/02/1992 | WO1992005212A1 Moisture-setting alkoxysilane-terminated polyurethanes |
| 04/02/1992 | DE4129647A1 Stable multiple layer metallisation contacts for cpd. semiconductors - consist of contact metal, barrier of titanium-tungsten-nitride and wire-bond metal and can be easily processed |
| 04/02/1992 | DE4030771A1 Plastic casing for semiconductor chip - fixed to lead frame by intermediate layer to reduce stresses |
| 04/02/1992 | DE4030532A1 Hybrid multilevel circuit with metal substrate - bonded directly to glass-ceramic layer of lowest circuit level |
| 04/01/1992 | EP0478476A1 Moulding process for integrated circuit packages and moulds |
| 04/01/1992 | EP0478426A1 Method of fabrication for a hybrid module |
| 04/01/1992 | EP0478368A1 Integrated circuits and processes of manufacture |
| 04/01/1992 | EP0478308A2 Method of forming interlayer-insulating film |
| 04/01/1992 | EP0478250A1 Integrated circuit device and method to prevent cracking during surface mount |
| 04/01/1992 | EP0478241A2 Insulated lead frame for integrated circuits and method of manufacture thereof |
| 04/01/1992 | EP0478240A2 Insulated lead frame for integrated circuits and method of manufacture thereof |
| 04/01/1992 | EP0478188A2 Integrated circuit package and compact assemblies thereof |
| 04/01/1992 | EP0478160A2 IC package with electric conductor lines in dielectric package body |
| 04/01/1992 | EP0478072A1 Process for making alignment marks for masks |
| 04/01/1992 | EP0477990A2 A method of enhancing the properties of a thin film on a substrate |
| 04/01/1992 | EP0477937A1 Lead frame for semiconductor device of the resin encapsulation type |
| 04/01/1992 | EP0477502A1 Electronic circuit |
| 04/01/1992 | EP0275433B1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |