| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/06/1992 | CN1060830A Chemically stabilized cristobalite |
| 05/06/1992 | CN1060829A Process for making chemically stabilized cristobalite |
| 05/05/1992 | US5111280 Thermal management of power conditioning systems |
| 05/05/1992 | US5111278 Three-dimensional multichip module systems |
| 05/05/1992 | US5111277 Surface mount device with high thermal conductivity |
| 05/05/1992 | US5111276 Thick bus metallization interconnect structure to reduce bus area |
| 05/05/1992 | US5111275 Multicell semiconductor memory device |
| 05/05/1992 | US5111274 Semiconductor integrated circuit with circuit blocks, dummy islands, and bias and shield electrodes |
| 05/05/1992 | US5111264 Photoelectric conversion device |
| 05/05/1992 | US5111262 Structure for protecting thin dielectrics during processing |
| 05/05/1992 | US5111060 Electronic circuit equipped with redundant or spare circuit elements for every circuit element |
| 05/05/1992 | US5110763 Glass coating |
| 05/05/1992 | US5110761 Formed top contact for non-flat semiconductor devices |
| 05/05/1992 | US5110754 Method of making a DRAM capacitor for use as an programmable antifuse for redundancy repair/options on a DRAM |
| 05/05/1992 | US5110664 Thick film and thin film composite substrate and electronic circuit apparatus using it |
| 05/05/1992 | US5110654 Ceramic multilayer wiring substrate |
| 05/05/1992 | US5110628 Without touching its leads |
| 05/05/1992 | US5110394 Apparatus for forming interconnection pattern |
| 05/05/1992 | US5110299 High density interconnect |
| 05/05/1992 | US5110032 Method and apparatus for wire bonding |
| 05/05/1992 | US5109980 Ic carrier with shaft coupling |
| 05/05/1992 | US5109601 Method of marking a thin film package |
| 05/05/1992 | CA1300282C Wire bonds and electrical contacts of an integrated circuit device |
| 05/01/1992 | CA2185936A1 Process for fabricating a superconducting circuit |
| 04/30/1992 | WO1992007454A1 Liquid cooling system employing air purging mechanism |
| 04/30/1992 | WO1992007248A1 Reference wafer for haze calibration |
| 04/30/1992 | DE4134172A1 Tape automated bonding interconnect device mfr. |
| 04/29/1992 | EP0483108A2 Cooling modules for electronic circuit components |
| 04/29/1992 | EP0483107A2 Cooling modules for electronic circuit devices |
| 04/29/1992 | EP0483080A1 A device for fastening electronic power components to a heatsink |
| 04/29/1992 | EP0483058A1 Heat sink for semiconductor components |
| 04/29/1992 | EP0482940A1 Method of forming an electrical connection for an integrated circuit |
| 04/29/1992 | EP0482812A2 Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same |
| 04/29/1992 | EP0482546A2 Cooling device for optical and/or electronic elements |
| 04/29/1992 | EP0482537A2 Chemically stabilized cristobalite |
| 04/29/1992 | EP0482534A2 Process for making chemically stabilized cristobalite |
| 04/29/1992 | EP0482431A1 Electronic substrate multiple location conductor attachment technology |
| 04/29/1992 | EP0482419A1 Circuit modul with safety case |
| 04/29/1992 | EP0482247A1 Method for producing an integrated circuit structure with a dense multilayer metallization pattern |
| 04/29/1992 | EP0482194A1 Wiring structure of semiconductor chip |
| 04/29/1992 | EP0481998A1 Uv-cured adhesive for semiconductor-chip assembly. |
| 04/29/1992 | EP0406373A4 Tape automated bonded lead package and reusable transport tape for use therewith |
| 04/28/1992 | US5109320 System for connecting integrated circuit dies to a printed wiring board |
| 04/28/1992 | US5109319 Terminal arrangement for axial lead electrically asymmetric electronic components |
| 04/28/1992 | US5109317 Mounting mechanism for mounting heat sink on multi-chip module |
| 04/28/1992 | US5109270 High frequency semiconductor device |
| 04/28/1992 | US5109268 Rf transistor package and mounting pad |
| 04/28/1992 | US5109267 Method for producing an integrated circuit structure with a dense multilayer metallization pattern |
| 04/28/1992 | US5109067 Process for the preparation of the modified resin and epoxy resin composition containing the modified resin for use in semiconductor encapsulation |
| 04/28/1992 | US5109058 Curable resin solution compositions, their preparation, and electronic part protective coatings |
| 04/28/1992 | US5108958 Ceramic composite for electronic applications |
| 04/28/1992 | US5108955 Method of making a resin encapsulated pin grid array with integral heatsink |
| 04/28/1992 | US5108951 Depositing aluminum while integrated circuit is being heated |
| 04/28/1992 | US5108950 Bonding to electrode pad through barrier/bonding metal alloy |
| 04/28/1992 | US5108942 Master slice integrated circuit having a memory region |
| 04/28/1992 | US5108825 Noncracking, good adhesion, heat resistance |
| 04/28/1992 | US5108819 Thin film electrical component |
| 04/28/1992 | US5108784 Maintaining low moisture level at the surface of solid substrate to inhibit corrosion of metal surface |
| 04/28/1992 | US5108562 Microelectronic packages; using base and oxidizer acid for copper etching |
| 04/28/1992 | US5108553 Two metal layer tape automated bonding |
| 04/28/1992 | US5108299 Electrostatic discharge protection devices for semiconductor chip packages |
| 04/28/1992 | US5108027 Barrier metallization layer between metallization layer that would react with solder and solder |
| 04/28/1992 | US5107586 Method for interconnecting a stack of integrated circuits at a very high density |
| 04/28/1992 | CA1299481C Method for producing a clean, highly conductive surface for mating composite articles |
| 04/25/1992 | WO1992008247A1 Rapid-curing adhesive formulation for semiconductor devices |
| 04/25/1992 | CA2094292A1 Rapid-curing adhesive formulation for semiconductor devices |
| 04/23/1992 | DE4133183A1 CCD housing structure assembly - uses automatically bondable foil with numerous outer and inner leads, and chip bonding straps |
| 04/23/1992 | CA2053581A1 Chemically stabilized cristobalite |
| 04/23/1992 | CA2053580A1 Process for making chemically stabilized cristobalite |
| 04/22/1992 | EP0481889A1 Method for manufacturing integrated circuits with double contacts |
| 04/22/1992 | EP0481846A1 Assembly process of a metallic cover on a substrate comprising an integrated circuit |
| 04/22/1992 | EP0481736A2 Organic resin multi-layer wiring substrate and method of making the same |
| 04/22/1992 | EP0481721A1 Heat sink for electronic circuitry |
| 04/22/1992 | EP0481720A1 Self-adjusting heat sink design for vlsi packages |
| 04/22/1992 | EP0481703A2 Interconnect structure for use with programming elements and test devices |
| 04/22/1992 | EP0481493A2 Fuse Conductor |
| 04/22/1992 | EP0481035A1 Economical housing for electronic power components for fixing on a heat sink and process for its manufacture |
| 04/22/1992 | EP0476136A4 Three-dimensional electronic unit and method of construction |
| 04/22/1992 | CN1060558A Metal film forming method |
| 04/21/1992 | US5107355 Liquid crystal display device having layered bus line structure |
| 04/21/1992 | US5107330 Self-adjusting heat sink design for vlsi packages |
| 04/21/1992 | US5107329 Pin-grid array semiconductor device |
| 04/21/1992 | US5107328 Packaging means for a semiconductor die having particular shelf structure |
| 04/21/1992 | US5107326 High-frequency smd transistor having two emitter terminals |
| 04/21/1992 | US5107325 Structure and method of packaging a semiconductor device |
| 04/21/1992 | US5107324 Two-terminal semiconductor device of surface installation type |
| 04/21/1992 | US5107323 Silicon oxynitride overcoating to prevent arcing |
| 04/21/1992 | US5107322 Wiring or conductor interconnect for a semiconductor device or the like |
| 04/21/1992 | US5107321 Interconnect method for semiconductor devices |
| 04/21/1992 | US5107320 Method and apparatus for improvement of interconnection capacitance |
| 04/21/1992 | US5107078 Electric connection or disconnection element, integrated circuit including such elements and the corresponding connection or disconnection method |
| 04/21/1992 | US5107074 Multi-lead hermetic power package with high packing density |
| 04/21/1992 | US5106785 Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant |
| 04/21/1992 | US5106784 Method of making a post molded cavity package with internal dam bar for integrated circuit |
| 04/21/1992 | US5106783 Process for fabricating semiconductor devices with self-aligned contacts |
| 04/21/1992 | US5106778 Forming grooves; growing semiconductor in grooves |
| 04/21/1992 | US5106773 Programmable gate array and methods for its fabrication |
| 04/21/1992 | US5106658 Hardness improvement of film containing arylsiloxane and organosilicate |
| 04/21/1992 | US5106461 High-density, multi-level interconnects, flex circuits, and tape for tab |
| 04/21/1992 | US5106451 Heat sink and method of attachment |