| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/02/1992 | US5118299 Cone electrical contact |
| 06/02/1992 | CA1302100C Apparatus for supplying cooling fluid |
| 05/31/1992 | CA2056663A1 Hub for optical disk and optical disk |
| 05/29/1992 | WO1992009102A1 A method of making a multilayer thin film structure |
| 05/27/1992 | EP0486829A2 Semiconductor device and semiconductor device packaging system |
| 05/27/1992 | EP0486724A1 Thermoplastic film die attach adhesives |
| 05/27/1992 | DE4037488A1 Leistungsbausteine mit elektrisch isolierender thermischer ankopplung Service modules with electrically insulating thermal coupling |
| 05/27/1992 | CN1061491A Thermal stress-relieved composite microelectronic device |
| 05/26/1992 | US5117282 Stacked configuration for integrated circuit devices |
| 05/26/1992 | US5117281 Semiconductor device having a heat-sink attached thereto |
| 05/26/1992 | US5117280 Plastic package semiconductor device with thermal stress resistant structure |
| 05/26/1992 | US5117279 Semiconductor device having a low temperature uv-cured epoxy seal |
| 05/26/1992 | US5117278 Semiconductor device having a semiconductor body embedded in an envelope made of synthetic material |
| 05/26/1992 | US5117277 Semiconductor integrated circuit device with improved connection pattern of signal wirings |
| 05/26/1992 | US5117276 High performance interconnect system for an integrated circuit |
| 05/26/1992 | US5117275 Electronic substrate multiple location conductor attachment technology |
| 05/26/1992 | US5117273 Contact for integrated circuits |
| 05/26/1992 | US5117272 Having a protective film of a polymer having a fluorine-containing aliphatic cyclic structure |
| 05/26/1992 | US5117068 Surface mount package for R.F. devices |
| 05/26/1992 | US5116885 Inorganic Filler Particles |
| 05/26/1992 | US5116782 Method and apparatus for processing a fine pattern |
| 05/26/1992 | US5116657 Spheroid copper and copper oxide particles coated with organic titanium compound; printed circuit substrates |
| 05/26/1992 | US5116638 Organic electro-conductive thin films and process for production thereof |
| 05/26/1992 | US5116459 Processes for electrically conductive decals filled with organic insulator material |
| 05/26/1992 | US5115964 Method for bonding thin film electronic device |
| 05/26/1992 | CA1301949C Device for interconnection and protection of a bare microwave componentchip |
| 05/20/1992 | WO1992008606A1 Microelectronics package |
| 05/20/1992 | EP0486392A1 Hybrid circuit formed by two circuits whose tracks are joined by electrical connection balls |
| 05/20/1992 | EP0486273A1 Package for microwave IC |
| 05/20/1992 | EP0486244A1 Method of producing low resistance contacts |
| 05/20/1992 | EP0486027A2 Resin sealed semiconductor device |
| 05/20/1992 | EP0485910A2 Organic vehicle for electronic composition |
| 05/20/1992 | EP0485802A1 Method of preventing corrosion of aluminium alloys |
| 05/20/1992 | EP0485627A1 Lead frame and semiconductor package using it |
| 05/20/1992 | EP0485414A1 Improvements in mounting of the lids of capsules for solid state integrated circuits |
| 05/20/1992 | CA2096008A1 Microelectronics package |
| 05/19/1992 | US5115475 Automatic semiconductor package inspection method |
| 05/19/1992 | US5115300 High-power semiconductor device |
| 05/19/1992 | US5115299 Hermetically sealed chip carrier with ultra violet transparent cover |
| 05/19/1992 | US5115298 Packaged integrated circuit with encapsulated electronic devices |
| 05/19/1992 | US5115296 Preferential oxidization self-aligned contact technology |
| 05/19/1992 | US5115290 Mos type semiconductor device and method for manufacturing the same |
| 05/19/1992 | US5115090 Polyamic acids and polyimides for multilayer elements, imsulators and passivation layers |
| 05/19/1992 | US5115082 Fluorinated poly(arylene ether) |
| 05/19/1992 | US5114994 Silicon polymers and epoxy resins |
| 05/19/1992 | US5114878 Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same |
| 05/19/1992 | US5114780 Electronic articles containing a fluorinated poly(arylene ether) dielectric |
| 05/19/1992 | US5114741 Ethers of reaction product of a dicyclopentadiene and a phenol and of a dialdehyde and a phenol |
| 05/19/1992 | US5114642 Process for producing a metal-screened ceramic package |
| 05/19/1992 | US5114358 Chip carrier socket |
| 05/19/1992 | CA1301370C Integrated circuit package using plastic encapsulant |
| 05/19/1992 | CA1301369C Hermetic pin grid array package |
| 05/17/1992 | CA2054089A1 Interconnect package for circuitry components |
| 05/14/1992 | WO1992008338A1 Stacked configuration for integrated circuit devices |
| 05/14/1992 | WO1992008337A1 A novel method and structure for repairing electrical lines |
| 05/14/1992 | WO1992008248A1 Direct thermocompression bonding for thin electronic power chips |
| 05/14/1992 | WO1992007906A1 Plastisol composition |
| 05/14/1992 | DE4135189A1 Assembling multi-layer package for semiconductor device - using plastic moulded package with internal cavity in which die is placed and bonded and which is sealed with lid |
| 05/14/1992 | CA2055065A1 Organic vehicle for electronic composition |
| 05/13/1992 | EP0485205A2 Heat sink and the producing method thereof |
| 05/13/1992 | EP0485188A1 Electronic package comprising an interconnection board |
| 05/13/1992 | EP0485130A2 Method for forming a metal contact |
| 05/13/1992 | EP0485086A1 Dielectric layers for integrated circuits |
| 05/13/1992 | EP0484992A2 Electrical interconnection having angular lead design |
| 05/13/1992 | EP0484772A2 Semiconductor package and method of fabrication |
| 05/13/1992 | EP0484353A1 Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards. |
| 05/12/1992 | US5113315 Heat-conductive metal ceramic composite material panel system for improved heat dissipation |
| 05/12/1992 | US5113314 High-speed, high-density chip mounting |
| 05/12/1992 | US5113241 Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles |
| 05/12/1992 | US5113240 Leadframe with heat dissipator connected to s-shaped fingers |
| 05/12/1992 | US5113239 Aluminum and gold |
| 05/12/1992 | US5113234 Semiconductor device having reduced contact resistance between diffusion regions and wiring layer |
| 05/12/1992 | US5113232 LED array chips with thermal conductor |
| 05/12/1992 | US5113161 Case for housing integrated microwave circuits |
| 05/12/1992 | US5112802 Superconducting ceramics elongated body and method of manufacturing the same |
| 05/12/1992 | US5112765 Method of forming stacked tungsten gate PFET devices and structures resulting therefrom |
| 05/12/1992 | US5112668 Insulated metal substrates and process for the production thereof |
| 05/12/1992 | US5111935 Supporting semiconductor chips |
| 05/12/1992 | CA1300762C2 Fabrication of customized integrated circuits |
| 05/12/1992 | CA1300761C Semiconductor package |
| 05/12/1992 | CA1300648C Glass-ceramics for electronic packaging |
| 05/07/1992 | DE4135810A1 Improved intermediate insulation layer between metallisation levels |
| 05/07/1992 | DE4135533A1 Epoxide] and phenolic resin mixt. contg. naphthalene rings - to reduce expansion coefft. and water absorption, useful for encapsulating semiconductor |
| 05/07/1992 | DE4129160A1 Plastic semiconductor device package - has lead frame with parallel power and ground planes, large area heat-sink and is partly moulded |
| 05/07/1992 | DE4113741A1 Integrated circuit metallisation process with improved step covering - uses same metal, with preferential deposition on polycrystalline silicon@, for contact plus and interconnection pattern |
| 05/07/1992 | DE4035445A1 Generating very low temp. by gas liquefaction - coupling long conductor ends respectively to electric motor potential and to transformer sec. winding |
| 05/07/1992 | DE4034725A1 Non-PVC plastisol compsn. as e.g. automobile sealant - contains emulsion copolymer of styrene] cpd. and (meth)acrylic] and-or itaconic acid, with plasticiser and inorganic fillers |
| 05/06/1992 | EP0484320A2 Cooling modules for electronic circuit devices |
| 05/06/1992 | EP0484297A2 Process for assembling and resin-encapsulating a semiconductor power device mounted on a heat sink |
| 05/06/1992 | EP0484257A1 Molded package for integrated circuit comprising a device for reducing the dynamic impedance |
| 05/06/1992 | EP0484248A2 A novel superconducting circuit and a process for fabricating the same |
| 05/06/1992 | EP0484180A1 Packaged semiconductor device having an optimized heat dissipation |
| 05/06/1992 | EP0484157A2 Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition |
| 05/06/1992 | EP0484062A1 A semiconductor device comprising two integrated circuit packages |
| 05/06/1992 | EP0484032A2 Microchip with electrical element in sealed cavity |
| 05/06/1992 | EP0483958A1 Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer |
| 05/06/1992 | EP0483408A1 Removable VLSI package |
| 05/06/1992 | CN1060925A Self-adjusting heat sink design for vlsi packages |
| 05/06/1992 | CN1060924A Heat sink for electronic circuitry |
| 05/06/1992 | CN1060923A Production method for rectifier diode |