| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/17/1992 | EP0490211A2 Electronic circuit packages with tear resistant organic cores |
| 06/17/1992 | EP0489995A1 Flexible printed circuit package and flexible printed circuit for incorporation into such a package |
| 06/17/1992 | EP0489958A1 Circuit board for electronic control apparatus and method of making this circuit board |
| 06/17/1992 | EP0489932A1 Iron-nickel alloy |
| 06/17/1992 | DE4040113A1 Package for IC comprises carrier and encapsulating agent - of moulded round carrier, with opening for IC |
| 06/17/1992 | CN1017110B Superconducting devices |
| 06/16/1992 | US5122930 For high speed signal tranmissions |
| 06/16/1992 | US5122929 Method of achieving selective inhibition and control of adhesion in thick-film conductors |
| 06/16/1992 | US5122862 Ceramic lid for sealing semiconductor element and method of manufacturing the same |
| 06/16/1992 | US5122860 Integrated circuit device and manufacturing method thereof |
| 06/16/1992 | US5122858 Lead frame having polymer coated surface portions |
| 06/16/1992 | US5122857 Semiconductor memory device having first and second selecting lines for accessing memory cells |
| 06/16/1992 | US5122856 Semiconductor device |
| 06/16/1992 | US5122621 Universal surface mount package |
| 06/16/1992 | US5122620 Chip carrier with terminating resistive elements |
| 06/16/1992 | US5122480 Method for assembling a heat sink to a circuit element using a retentive spring force |
| 06/16/1992 | US5122475 Method of making a high speed, high density semiconductor memory package with chip level repairability |
| 06/16/1992 | US5122045 Mold for molding a package for a semiconductor device for detecting or emitting a magnetic line of force or light |
| 06/16/1992 | CA1303753C Ic with means for reducing esd damage |
| 06/16/1992 | CA1303752C Burn-in pads for tab interconnect structures |
| 06/11/1992 | WO1992010000A1 Power component with electrical insulation |
| 06/11/1992 | DE4038723A1 Auf einer platte gemeinsam hergestellte und danach vereinzelte, gleichartige halbleiter-chips mit indizierung On a plate jointly produced and then scattered, like semiconductor chips with indexing |
| 06/10/1992 | EP0489710A2 A mirror wafer of compound semiconductor |
| 06/10/1992 | EP0489488A2 Misalignment tolerant antifuse |
| 06/10/1992 | EP0489177A1 Semiconductor device and method of manufacturing the same |
| 06/10/1992 | EP0283479B1 Circuit utilizing resistors trimmed by metal migration |
| 06/10/1992 | EP0229850B1 Connection terminals between substrates and method of producing the same |
| 06/10/1992 | CN2107067U Glue injector |
| 06/10/1992 | CN2107066U Palladium fence field-effect transistor |
| 06/10/1992 | CN1061872A Method of manufacturing semiconductor devices having alignment mark |
| 06/09/1992 | US5121300 Lead frame and electronic device employing the same |
| 06/09/1992 | US5121299 Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |
| 06/09/1992 | US5121293 Method and apparatus for interconnecting devices using tab in board technology |
| 06/09/1992 | US5121292 Field replaceable cryocooled computer logic unit |
| 06/09/1992 | US5121290 Circuit pack cooling using perforations |
| 06/09/1992 | US5121194 Substrate output for a semiconductor device and a method of fabricating the same |
| 06/09/1992 | US5121190 For joining integrated semicoductor improved fatigue and stability |
| 06/09/1992 | US5121189 Semiconductor device and method of manufacturing the same |
| 06/09/1992 | US5121187 Hermetically sealed integrated semiconductor circuit chip |
| 06/09/1992 | US5121184 Bipolar transistor containing a self-aligned emitter contact and method for forming transistor |
| 06/09/1992 | US5121053 Tab frame and process of testing same |
| 06/09/1992 | US5121036 Semiconductor integrated circuit with pads and power supply lines |
| 06/09/1992 | US5120803 Modified epoxy resin and silicon polymer |
| 06/09/1992 | US5120679 Form insulating layer on substrate surface, form opening, deposit anti-fuse material in opening, forming spacer on sidewalls |
| 06/09/1992 | US5120678 Infiltrating gap between component and substrate with polymer-precursor liquid, curing to solidy and protect |
| 06/09/1992 | US5120665 Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits |
| 06/09/1992 | US5120579 Bonding glass to dielectric |
| 06/09/1992 | US5120569 Method of forming a polymer on a substrate |
| 06/09/1992 | US5120495 Mixing diamond in a powder of aluminum, magnesium, cobalt, silver or alloys thereof, heating and pressurization to consolidate |
| 06/09/1992 | US5120339 Method for fabricating a low thermal expansion coefficient glass fiber-reinforced polymer matrix composite substrate and composite substrate |
| 06/09/1992 | CA1303251C Semiconductor package |
| 06/09/1992 | CA1303250C Integrated circuit comprising load resistors, arranged as thin-film elements on the field oxide zones which separate the active transistor zones, and processes for the production thereof |
| 06/09/1992 | CA1303249C2 Liquid cooling system for integrated circuits |
| 06/09/1992 | CA1303248C Semiconductor heat dissipating apparatus |
| 06/09/1992 | CA1303241C Electronic microcircuit card and fabrication process for said card |
| 06/09/1992 | CA1303238C Flat cooling structure of integrated circuit |
| 06/09/1992 | CA1302947C Copper-chromium-polyimide composite |
| 06/09/1992 | CA1302739C Copper-tungsten metal mixture and process |
| 06/05/1992 | WO1992010875A1 High frequency oscillator comprising cointegrated thin film resonator and active device |
| 06/05/1992 | CA2097717A1 High frequency oscillator comprising cointegrated thin film resonator and active device |
| 06/04/1992 | DE4038168A1 Multi-chip module with drawn-out terminal contacts - has chip(s) deposited on semiconductor substrate, which carries wiring plane(s) for chip contacting |
| 06/03/1992 | EP0488783A2 Lead frame for semiconductor device comprising a heat sink |
| 06/03/1992 | EP0488641A1 Package for a semiconductor element or semiconductor elements |
| 06/03/1992 | EP0488628A2 Method of producing an aluminum stacked contact/via for multilayer interconnections |
| 06/03/1992 | EP0488576A1 Method of forming an integrated circuit contact |
| 06/03/1992 | EP0488574A2 Personal data card construction |
| 06/03/1992 | EP0488554A2 Tab tape, tab tape package and method of bonding same |
| 06/03/1992 | EP0488546A1 Contact for integrated circuits |
| 06/03/1992 | EP0488374A2 Epoxy resin compositions and cured products thereof |
| 06/03/1992 | EP0488364A2 Method and apparatus for securing integrated circuits from unauthorized use |
| 06/03/1992 | EP0488319A1 Multichip module |
| 06/03/1992 | EP0488273A1 Electrical device containing a lubricant or heat conducting composition. |
| 06/03/1992 | EP0488264A2 Method of manufacturing a semiconductor device with improved electromigration resistance |
| 06/03/1992 | EP0488186A1 Shape of bonding pad of semiconductor device bonded by wire bonding method |
| 06/03/1992 | EP0488165A2 A metallic member with an improved surface layer |
| 06/03/1992 | EP0488160A1 Multistage amplifier |
| 06/03/1992 | EP0488154A2 Contact for semiconductor device and method of manufacturing the same |
| 06/03/1992 | EP0488091A2 Plastic-packaged semiconductor device and method of forming the same |
| 06/03/1992 | EP0488053A1 Method for manufacturing a semiconductor chip |
| 06/03/1992 | EP0487937A1 A semiconductor device having punch-through protected buried contacts and method for making the same |
| 06/03/1992 | EP0487640A1 Capacitor laminate for printed circuit board. |
| 06/02/1992 | US5119332 Semiconductor memory |
| 06/02/1992 | US5119269 Semiconductor with a battery unit |
| 06/02/1992 | US5119175 High power density solid-state, insulating coolant module |
| 06/02/1992 | US5119173 Method of making integrated circuit to package connections |
| 06/02/1992 | US5119172 Microelectronic device package employing capacitively coupled connections |
| 06/02/1992 | US5119170 Thin film metal interconnects in integrated circuit structures to reduce circuit operation speed delay |
| 06/02/1992 | US5119169 Semiconductor integrated circuit device |
| 06/02/1992 | US5119168 Semiconductor integrated circuit |
| 06/02/1992 | US5119165 Semiconductor integrated circuit device using a planar structure with reduced bit line and word line resistance |
| 06/02/1992 | US5119164 Avoiding spin-on-glass cracking in high aspect ratio cavities |
| 06/02/1992 | US5119163 Semiconductor device |
| 06/02/1992 | US5119112 Protective coating for thermal printing head |
| 06/02/1992 | US5118742 Blend of silicate and photocurable arylsiloxane materials |
| 06/02/1992 | US5118643 Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass |
| 06/02/1992 | US5118584 Method of producing microbump circuits for flip chip mounting |
| 06/02/1992 | US5118556 Film material for film carrier manufacture and a method for manufacturing film carrier |
| 06/02/1992 | US5118470 Alloy with TI, ZR, V, CR, MG, CA and others |
| 06/02/1992 | US5118385 Multilayer electrical interconnect fabrication with few process steps |
| 06/02/1992 | US5118370 LSI chip and method of producing same |