| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/29/2013 | US20130221510 Methods for bonding material layers to one another and resultant apparatus |
| 08/29/2013 | US20130221509 Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements |
| 08/29/2013 | US20130221508 Semiconductor device sealed with a resin molding |
| 08/29/2013 | US20130221507 Aluminum alloy lead-frame and its use in fabrication of power semiconductor package |
| 08/29/2013 | US20130221506 Semiconductor Packages with Integrated Heat Spreaders |
| 08/29/2013 | US20130221505 Printed wiring board |
| 08/29/2013 | US20130221504 Semiconductor module and method of manufacturing a semiconductor module |
| 08/29/2013 | US20130221503 Semiconductor package |
| 08/29/2013 | US20130221502 Joined body, power semiconductor device, and manufacturing methods of joined body and power semiconductor device |
| 08/29/2013 | US20130221501 Devices and methods related to interconnect conductors to reduce de-lamination |
| 08/29/2013 | US20130221500 System-In-Package with Integrated Socket |
| 08/29/2013 | US20130221499 Semiconductor Package with Integrated Electromagnetic Shielding |
| 08/29/2013 | US20130221497 Method for the production of a substrate comprising embedded layers of getter material |
| 08/29/2013 | US20130221494 Structure and method for strain-relieved tsv |
| 08/29/2013 | US20130221493 Semiconductor package |
| 08/29/2013 | US20130221484 Through silicon via noise suppression using buried interface contacts |
| 08/29/2013 | US20130221469 Semiconductor package and method of fabricating the same |
| 08/29/2013 | US20130221446 Semiconductor with through-substrate interconnect |
| 08/29/2013 | US20130221440 Method of manufacturing a semiconductor device |
| 08/29/2013 | US20130221382 Manufacturing light emitting diode (led) packages |
| 08/29/2013 | US20130221354 Flip chip semiconductor die internal signal access system and method |
| 08/29/2013 | US20130221353 Methods and Apparatus for Testing Pads on Wafers |
| 08/29/2013 | US20130221342 Overvoltage testing apparatus |
| 08/29/2013 | US20130220554 Laminate and method for separating the same |
| 08/29/2013 | DE19581856B3 Temperaturkompensation für Bauteile von integrierten Schaltungen auf der Halbleiterplättchen-Stufe Temperature compensation for components of integrated circuits on the wafer stage |
| 08/29/2013 | DE112011103941T5 Halbleitervorrichtung Semiconductor device |
| 08/29/2013 | DE102013203076A1 Erkennung des Latch-Up-Effekts Detection of the latch-up effect |
| 08/29/2013 | DE102013101857A1 Halbleitermodul mit Schaltelementen A semiconductor module with switching elements |
| 08/29/2013 | DE102013101747A1 Kühler und kühleinrichtung Coolers and cooling device |
| 08/29/2013 | DE102012203151A1 Halbleitermodul mit integrierten antennenstrukturen Semiconductor module with integrated antenna structures |
| 08/29/2013 | DE102012200329B4 Halbleiteranordnung mit einem Heatspreader und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device with a heat spreader and method of manufacturing a semiconductor device |
| 08/29/2013 | DE102012108284A1 Three-dimensional integrated circuit, has switching circuits formed adjacent to one side of substrate, and polygon-shaped silicon plated-through holes extended from former side to another side and arranged at tip of polygon part |
| 08/29/2013 | DE102012104731A1 Mechanismen zum Ausbilden von Verbindungselementen für eine Baugruppe-auf-Baugruppe Mechanisms for forming fasteners for assembly-to-assembly |
| 08/29/2013 | DE102012103583A1 Substrat mit vergrößerter Chipinsel Substrate with increased chip island |
| 08/29/2013 | DE102012101463A1 Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes optoelektronisches Bauelement A method for producing an optoelectronic component and thus produced optoelectronic component |
| 08/29/2013 | DE102012007804A1 Verfahren zum technologisch optimierten Ausführen von Lötverbindungen A method for performing technologically optimized solder joints |
| 08/29/2013 | DE102008005547B4 Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul The power semiconductor module and the circuit arrangement with a power semiconductor module |
| 08/29/2013 | DE102006036798B4 Elektronisches Bauteil und Verfahren zum Herstellen Electronic component and methods for making |
| 08/29/2013 | DE102005034485B4 Verbindungselement für ein Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterleistungsbauelements Connecting element for a semiconductor device and method of manufacturing a semiconductor power device |
| 08/29/2013 | CA2875314A1 Heterodyne detection system and method |
| 08/28/2013 | EP2631946A1 Semiconductor power module |
| 08/28/2013 | EP2631945A2 Microelectronic package with terminals on dielectric mass |
| 08/28/2013 | EP2631944A2 Semiconductor package with integrated electromagnetic shielding |
| 08/28/2013 | EP2631943A2 System-in-package with integrated protection socket |
| 08/28/2013 | EP2631942A1 Semiconductor device and production method for same |
| 08/28/2013 | EP2631941A2 Method for forming die assembly with heat spreader |
| 08/28/2013 | EP2631940A1 Semiconductor chip package, semiconductor module, and method for manufacturing same |
| 08/28/2013 | EP2631705A1 An ophthalmic lens with segmented ring layers in a functionalized insert |
| 08/28/2013 | EP2631704A1 Full rings for a functionalized layer insert of an ophthalmic lens |
| 08/28/2013 | EP2631275A1 Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same |
| 08/28/2013 | EP2630660A1 Incident radiation detector packaging |
| 08/28/2013 | EP2630657A1 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics |
| 08/28/2013 | EP2630655A2 System and method for packaging electronic devices |
| 08/28/2013 | CN203167493U L-shaped electronic radiating plate |
| 08/28/2013 | CN203165892U Same directional array type bridge rectifiers |
| 08/28/2013 | CN203165891U Semiconductor module |
| 08/28/2013 | CN203165890U Thyristor module of built-in temperature sensor |
| 08/28/2013 | CN203165889U Igbt module |
| 08/28/2013 | CN203165888U Silicon chain module |
| 08/28/2013 | CN203165887U Power device string vertical arrangement mechanical pressing structure |
| 08/28/2013 | CN203165886U Image sensor structure |
| 08/28/2013 | CN203165885U Plastic packaging type rectifier bridge |
| 08/28/2013 | CN203165884U 22-row lead frame |
| 08/28/2013 | CN203165883U Jumper wire of diode chip |
| 08/28/2013 | CN203165882U Stacked package structure |
| 08/28/2013 | CN203165881U Circuit packaging component |
| 08/28/2013 | CN203165880U Novel general fastener |
| 08/28/2013 | CN203165879U Chip supporting board |
| 08/28/2013 | CN203165878U Copper based composite heat conducting device |
| 08/28/2013 | CN203165877U Heat dissipation device |
| 08/28/2013 | CN203165876U Liquid cooling type CPU radiator and heat dissipation block thereof |
| 08/28/2013 | CN203165875U Heat radiation mechanism for power tube |
| 08/28/2013 | CN203165874U Improved integrated circuit package body |
| 08/28/2013 | CN203165873U Packaging shell with cavities at two sides |
| 08/28/2013 | CN203164565U Thin film transistor array substrate, display panel and display equipment |
| 08/28/2013 | CN1885850B Wireless local area network communications module and integrated chip package |
| 08/28/2013 | CN103270590A Power/ground layout for chips |
| 08/28/2013 | CN103270589A Method for producing an electrical terminal support |
| 08/28/2013 | CN103270588A Substrate with embedded stacked through-silicon via die |
| 08/28/2013 | CN103270587A Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure |
| 08/28/2013 | CN103270586A A multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same |
| 08/28/2013 | CN103270303A Synthetic jet packaging |
| 08/28/2013 | CN103270110A Curable resin composition, cured product, surface-processed cured product, and laminate |
| 08/28/2013 | CN103268879A Array substrate |
| 08/28/2013 | CN103268877A Semiconductor device and manufacturing method thereof |
| 08/28/2013 | CN103268875A Multi-wafer encapsulating structure |
| 08/28/2013 | CN103268874A Radiation-proof infrared focal plane detector reading circuit |
| 08/28/2013 | CN103268873A Inductor |
| 08/28/2013 | CN103268872A Payment-by -pure-card intelligent card loading belt and manufacturing method thereof |
| 08/28/2013 | CN103268871A Ultra-thin high-density multi-layer circuit chip front packaging structure and manufacturing method |
| 08/28/2013 | CN103268870A Packaging structure for glass sealing electronic component |
| 08/28/2013 | CN103268869A IC packaging structure and preparing mold and preparing technology of IC packaging structure |
| 08/28/2013 | CN103268868A Gas tightness metal shell used for surface mounting |
| 08/28/2013 | CN103268862A Semiconductor encapsulation structure and manufacturing method thereof |
| 08/28/2013 | CN103268775A Memory chip, memory device and use method of memory chip |
| 08/28/2013 | CN102449759B Radiator |
| 08/28/2013 | CN102403284B Electronic package, radiating structure for electronic devices and manufacturing method for radiating structure |
| 08/28/2013 | CN102403282B Packaging structure with basic islands and without pins at four sides and manufacturing method thereof |
| 08/28/2013 | CN102386153B Assembly used for fixing transistor |
| 08/28/2013 | CN102386152B Automobile power amplifier integrated circuit (IC) fixed elastic sheet |