| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/08/1992 | EP0493870A2 A TAB package and a liquid-crystal panel unit using the same |
| 07/08/1992 | EP0493828A2 On-chip variance detection for integrated circuit devices |
| 07/08/1992 | EP0493411A1 Method and apparatus for aligning mating form tools. |
| 07/08/1992 | EP0448702A4 Application specific tape automated bonding |
| 07/07/1992 | US5128831 High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias |
| 07/07/1992 | US5128744 Wiring |
| 07/07/1992 | US5128738 Integrated circuit |
| 07/07/1992 | US5128737 Semiconductor integrated circuit fabrication yield improvements |
| 07/07/1992 | US5128283 Method of forming mask alignment marks |
| 07/07/1992 | US5128280 Sharp edges, molybdenum silicide |
| 07/07/1992 | US5128279 Organic glass, semiconductors |
| 07/07/1992 | US5128278 Tungsten |
| 07/07/1992 | US5128008 Method of forming a microelectronic package having a copper substrate |
| 07/07/1992 | US5128006 Deposition of diamond films on semicondutor substrates |
| 07/07/1992 | US5127998 Oxidation, non-photoresist |
| 07/07/1992 | US5127986 High power, high density interconnect method and apparatus for integrated circuits |
| 07/07/1992 | US5127837 Electrical connectors and IC chip tester embodying same |
| 07/07/1992 | US5127570 Flexible automated bonding method and apparatus |
| 07/07/1992 | US5127447 Method of bending outer leads of a semiconductor device |
| 07/07/1992 | CA1304831C Integrated circuit having laser-alterable metallization layer |
| 07/07/1992 | CA1304830C Cooling structure |
| 07/02/1992 | DE4041224A1 Semiconductor chip module - comprises chips with active surfaces towards each other and distance pieces in between |
| 07/02/1992 | DE4040822A1 Depositing protective layers on mounted chips - sets chip eccentrically on turntable and partly centrifuges protective layer for uniform distribution |
| 07/02/1992 | DE4040288A1 Electronic module with metal housing - has circuit board with integrated circuit element in thermal contact with housing |
| 07/01/1992 | EP0493208A1 Cold finger for semiconductor circuit and cryogenic device having such finger |
| 07/01/1992 | EP0493131A1 Method of connecting an integrated circuit chip to a substrate having wiring pattern formed thereon |
| 07/01/1992 | EP0492987A1 Copper alloys and lead frames made therefrom |
| 07/01/1992 | EP0492952A1 Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system |
| 07/01/1992 | EP0492933A2 Multichip module |
| 07/01/1992 | EP0492518A1 A ceramic substrate for electronic circuit and a method for producing the same |
| 07/01/1992 | EP0491855A1 Sealing glass compositions |
| 06/30/1992 | US5126920 Multiple integrated circuit interconnection arrangement |
| 06/30/1992 | US5126919 Cooling system for an electronic circuit device |
| 06/30/1992 | US5126911 Integrated circuit self-protected against reversal of the supply battery polarity |
| 06/30/1992 | US5126830 Cryogenic semiconductor power devices |
| 06/30/1992 | US5126829 Cooling apparatus for electronic device |
| 06/30/1992 | US5126828 Wafer scale integration device |
| 06/30/1992 | US5126827 Semiconductor chip header having particular surface metallization |
| 06/30/1992 | US5126826 Light-emitting or receiving device and method for preparing the same |
| 06/30/1992 | US5126825 Connecting wiring layer with diffusion layer |
| 06/30/1992 | US5126824 Carrier tape and method of manufacturing semiconductor device employing the same |
| 06/30/1992 | US5126823 Lead frame having at least two islands and resin molded semiconductor device using it |
| 06/30/1992 | US5126822 Supply pin rearrangement for an I.C. |
| 06/30/1992 | US5126821 Semiconductor device having inner leads extending over a surface of a semiconductor pellet |
| 06/30/1992 | US5126820 Thermal expansion compensated metal lead frame for integrated circuit package |
| 06/30/1992 | US5126819 Wiring pattern of semiconductor integrated circuit device |
| 06/30/1992 | US5126818 Semiconductor device |
| 06/30/1992 | US5126813 Semiconductor pressure sensor device with two semiconductor pressure sensor chips and a method of manufacturing thereof |
| 06/30/1992 | US5126292 Glassy binder system for ceramic substrates, thick films and the like |
| 06/30/1992 | US5126290 Method of making memory devices utilizing one-sided ozone teos spacers |
| 06/30/1992 | US5126286 Method of manufacturing edge connected semiconductor die |
| 06/30/1992 | US5126283 Forming a protective coating of aluminum oxide, acts as oxidation and chemical resistance |
| 06/30/1992 | US5126282 Methods of reducing anti-fuse resistance during programming |
| 06/30/1992 | US5126206 Excellent electrical and thermal properties, high electrical resistance |
| 06/30/1992 | US5126188 Curable epoxy resin blended with thermoplastic resin, filler and curing agent |
| 06/30/1992 | US5126016 Oxidation to soluble trivalent chromium |
| 06/30/1992 | US5125451 Heat exchanger for solid-state electronic devices |
| 06/25/1992 | WO1992010925A1 Electrical device, in particular a switching and control device for motor vehicles |
| 06/25/1992 | WO1992010853A1 Method and device for three-dimensionally interconnecting integrated circuits |
| 06/25/1992 | WO1992010852A1 Identical semiconductor chips with indexing, produced together on a circuit board and subsequently separated |
| 06/25/1992 | WO1992010814A1 Coin validators |
| 06/25/1992 | WO1992010365A1 Non-beading, thin-film, metal-coated ceramic substrate |
| 06/25/1992 | DE4041347A1 Encapsulated integrated circuit chip mfr. - using centrifugal action on droplets of liq. polymer applied over top and shorter sides, to improve IC reliability |
| 06/25/1992 | DE4041346A1 Plastic housing containing encapsulated semiconductor chips - has chips protruding on all sides beyond metal islands below |
| 06/24/1992 | EP0491543A2 Via resistors within multilayer 3-dimensional structures/substrates |
| 06/24/1992 | EP0491433A2 Method of forming conductive region on silicon semiconductor material, and silicon semiconductor device with such region |
| 06/24/1992 | EP0491389A1 Semiconductor power component |
| 06/24/1992 | EP0491336A2 Electric circuit |
| 06/24/1992 | EP0491308A1 Tetrapolyimide film containing oxydiphthalic dianhydride |
| 06/24/1992 | EP0491307A1 Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride |
| 06/24/1992 | EP0491262A2 Semiconductor module |
| 06/24/1992 | EP0491161A1 Interconnect package for circuitry components |
| 06/24/1992 | EP0491045A1 Novel phenol/aralkyl resin, production thereof, and epoxy resin composition containing the same |
| 06/23/1992 | US5124884 Electronic part mounting board and method of manufacturing the same |
| 06/23/1992 | US5124877 Structure for providing electrostatic discharge protection |
| 06/23/1992 | US5124783 Semiconductor device having insulating substrate adhered to conductive substrate |
| 06/23/1992 | US5124782 Integrated circuit package with molded cell |
| 06/23/1992 | US5124781 Semiconductor device having organic film as interlayer insulating film for multilayer wirings |
| 06/23/1992 | US5124780 Conductive contact plug and a method of forming a conductive contact plug in an integrated circuit using laser planarization |
| 06/23/1992 | US5124774 Memory cell for use in an integrated circuit |
| 06/23/1992 | US5124766 Filament channel transistor interconnected with a conductor |
| 06/23/1992 | US5124508 Application of sheet batteries as support base for electronic circuits |
| 06/23/1992 | US5124311 Structure of ceramic superconductive wiring and process of fabrication thereof |
| 06/23/1992 | US5124280 Depositing polycrystalline silicon dielectric, patterning, converting part of patterned layer ot conductive silicide |
| 06/23/1992 | US5124276 Filling contact hole with selectively deposited EPI and poly silicon |
| 06/23/1992 | US5123852 Modular electrical connector |
| 06/23/1992 | US5123164 Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
| 06/23/1992 | CA1304172C Metal electronic package |
| 06/23/1992 | CA1304171C Overcurrent protection circuit for semiconductor device |
| 06/23/1992 | CA1304170C Highly integrated circuit and method for the production thereof |
| 06/22/1992 | WO1992011654A1 Leadless pad array chip carrier |
| 06/18/1992 | CA2057420A1 Tetrapolyimide film containing oxydiphthalic dianhydride |
| 06/18/1992 | CA2057398A1 Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride |
| 06/17/1992 | EP0490877A2 Interconnection for an integrated circuit |
| 06/17/1992 | EP0490761A1 Method of realising an electrically conductive diffusion barrier at the metal/silicon interface of an MOS transistor, and corresponding transistor |
| 06/17/1992 | EP0490739A1 Interconnection method and device for three-dimensional integrated circuits |
| 06/17/1992 | EP0490653A1 Tape carrier semiconducteur device |
| 06/17/1992 | EP0490506A1 Semiconductor device having a bonding pad |
| 06/17/1992 | EP0490499A1 Integrated circuit package with molded battery cell |
| 06/17/1992 | EP0490377A2 Defect tolerant power distribution network for integrated circuits |