| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/29/1992 | EP0496543A2 Method of forming silicon oxide film containing fluorine |
| 07/29/1992 | EP0496491A1 Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same |
| 07/29/1992 | EP0496372A2 Process for coating a non-noble metal with a noble metal |
| 07/29/1992 | EP0496365A1 Compositions for the production of seed layers |
| 07/29/1992 | EP0496364A1 Composition for the production of seed layers |
| 07/29/1992 | EP0495974A1 Trench conductors and crossover architecture |
| 07/28/1992 | US5134545 Insulative cradle isolation structure for electrical components |
| 07/28/1992 | US5134539 Multichip module having integral decoupling capacitor |
| 07/28/1992 | US5134463 Soldering semiconductor chip to electrode |
| 07/28/1992 | US5134462 Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate |
| 07/28/1992 | US5134461 Nickel alloy layer prevents diffusion of nickel into gold layer |
| 07/28/1992 | US5134460 Semiconductor chips, tape automated bonding |
| 07/28/1992 | US5134459 Lead frame for semiconductor device |
| 07/28/1992 | US5134458 Long size lead frame for semiconductor elements |
| 07/28/1992 | US5134457 Capacitor-like structure in integrated circuit, doped electrode with concentration gradient |
| 07/28/1992 | US5134455 Semiconductor integrated circuit device |
| 07/28/1992 | US5134247 Reduced capacitance chip carrier |
| 07/28/1992 | US5134246 Ceramic-glass integrated circuit package with integral ground and power planes |
| 07/28/1992 | US5134204 Polymaleimide, Polyepoxide, Phenolic Compound |
| 07/28/1992 | US5134094 Single inline packaged solid state relay with high current density capability |
| 07/28/1992 | US5134093 Passivating aluminum alloy |
| 07/28/1992 | US5134029 Thermoconductivity, layers of lead oxide and bismuth oxide, aluminum nitride, alumina, silicon dioxide |
| 07/28/1992 | US5133989 Process for producing metal-polyimide composite article |
| 07/28/1992 | US5133795 Method of making a silicon package for a power semiconductor device |
| 07/28/1992 | US5133403 Computers, heat dissipation, aluminum nitride-boron nitride ceramics |
| 07/28/1992 | US5133119 Shearing stress interconnection apparatus and method |
| 07/28/1992 | CA1305777C Circuit arrangement having a plurality of electrical elements to be cooled |
| 07/26/1992 | CA2059892A1 Compositions for the production of seed layers |
| 07/26/1992 | CA2059891A1 Compositions for the production of seed layers |
| 07/23/1992 | WO1992003848A3 Stacking of integrated circuits |
| 07/22/1992 | EP0495629A1 Vertical lead-on-chip package |
| 07/22/1992 | EP0495479A1 Diamond member, laminated diamond substrate, and method of making same |
| 07/22/1992 | EP0495474A1 Plastic package type semiconductor device |
| 07/22/1992 | EP0495317A1 Low voltage programmable antifuse and method for programming same |
| 07/22/1992 | EP0495282A2 Film carrier tape for TAB |
| 07/22/1992 | EP0495005A1 Die attach structure |
| 07/22/1992 | EP0438444A4 Aluminum alloy semiconductor packages |
| 07/22/1992 | EP0428681A4 Improved electrical connectors and ic chip tester embodying same |
| 07/22/1992 | CN1062995A Method for improving electro static discharge characteristic of semiconductor device |
| 07/21/1992 | US5132879 Secondary board for mounting of components having differing bonding requirements |
| 07/21/1992 | US5132878 Customizable circuitry |
| 07/21/1992 | US5132875 Removable protective heat sink for electronic components |
| 07/21/1992 | US5132873 Diaphragm sealing apparatus |
| 07/21/1992 | US5132780 Heat sink apparatus with an air deflection member |
| 07/21/1992 | US5132779 No heat distortion, aluminum-silicon alloy |
| 07/21/1992 | US5132778 Transfer molding compound |
| 07/21/1992 | US5132777 Cooled high-power semiconductor device |
| 07/21/1992 | US5132776 Heat dissipating aluminum-silicon alloy, substrate |
| 07/21/1992 | US5132775 Methods for and products having self-aligned conductive pillars on interconnects |
| 07/21/1992 | US5132773 Carrier ring having first and second ring means with bonded surfaces |
| 07/21/1992 | US5132772 Semiconductor device having tape automated bonding (TAB) leads which facilitate lead bonding |
| 07/21/1992 | US5132768 Semiconductor component with turn-off facility |
| 07/21/1992 | US5132756 Method of manufacturing semiconductor devices |
| 07/21/1992 | US5132571 Programmable interconnect architecture having interconnects disposed above function modules |
| 07/21/1992 | US5132386 Insulating resin composition and semiconductor device using the same |
| 07/21/1992 | US5132252 Method for fabricating semiconductor devices that prevents pattern contamination |
| 07/21/1992 | US5131852 Electrical socket |
| 07/21/1992 | US5131456 Bimetallic insert fin for high conduction cooling structure |
| 07/21/1992 | CA1305563C Resilient retainer for chip carrier sockets |
| 07/21/1992 | CA1305398C Method for producing high yield electrical contacts to n _amorphous silicon |
| 07/15/1992 | EP0494744A1 Coating composition for forming insulating layers and masks |
| 07/15/1992 | EP0494711A1 Semiconductor device with a contact metallization comprising aluminium and silicon and method of manufacturing this semiconductor device |
| 07/15/1992 | EP0494668A2 Polyimide multilayer wiring board and method of producing same |
| 07/15/1992 | EP0494634A2 Methods of applying substance to integrated circuit die and lead frames to improve adhesion to mold compound, and apparatus therefor |
| 07/15/1992 | EP0494625A1 Semiconductor device for improving high-frequency characteristics and avoiding chip cracking |
| 07/15/1992 | EP0494463A2 Connection method and connection device for electrical connection of small portions |
| 07/15/1992 | EP0494251A1 Hybrid module electronics package |
| 07/15/1992 | EP0494204A1 Improved composite dielectric |
| 07/15/1992 | EP0332658A4 Enhanced density modified isoplanar process |
| 07/14/1992 | US5130894 Three-dimensional circuit modules |
| 07/14/1992 | US5130889 Integrated circuit protection by liquid encapsulation |
| 07/14/1992 | US5130888 Spring clip fastener for surface mounting of printed circuit board components |
| 07/14/1992 | US5130784 Semiconductor device including a metallic conductor for preventing arcing upon failure |
| 07/14/1992 | US5130783 Flexible film semiconductor package |
| 07/14/1992 | US5130782 Conformal coating |
| 07/14/1992 | US5130780 Dual in-line packaging with improved moisture resistance |
| 07/14/1992 | US5130779 Solder mass having conductive encapsulating arrangement |
| 07/14/1992 | US5130777 Apparatus for improving antifuse programming yield and reducing antifuse programming time |
| 07/14/1992 | US5130771 Diamond composite heat sink for use with semiconductor devices |
| 07/14/1992 | US5130768 Compact, high-density packaging apparatus for high performance semiconductor devices |
| 07/14/1992 | US5130498 Aluminum nitride, aluminum alloy, bonding layer, resistance against thermal stress |
| 07/14/1992 | US5130275 Pads, patterns, bumps, flowable alloy |
| 07/14/1992 | US5130274 Copper alloy metallurgies for VLSI interconnection structures |
| 07/14/1992 | US5130273 High resistance region |
| 07/14/1992 | US5130229 Photosensitive polymer overlays having both wiring and interconnecting metallurgy |
| 07/14/1992 | US5129974 Microlabelling system and method of making thin labels |
| 07/14/1992 | CA1305255C Marching interconnecting lines in semiconductor integrated circuits |
| 07/09/1992 | WO1992011743A2 An interconnect structure for connecting electronic devices |
| 07/09/1992 | WO1992011657A1 Method for predicting capacitance of connection nets on an integrated circuit |
| 07/09/1992 | WO1992011656A1 Integrated circuit die-to-leadframe interconnect assembly system |
| 07/09/1992 | WO1992011655A1 Semiconductor device package with improved heat dissipation characteristics |
| 07/09/1992 | WO1992011580A1 Photodefinable interlevel dielectrics |
| 07/09/1992 | WO1992011578A1 Photodefinable interlevel dielectrics |
| 07/09/1992 | DE4200284A1 Connecting layer for semiconductor - in which device has semiconductor substrate, first insulating layer, first conducting layer, and second conducting layer of higher conductivity |
| 07/09/1992 | DE4137058A1 Improved step-coverage of electrode on semiconductor surface - uses preferential etching of the edge of surface layer to produce bevel |
| 07/09/1992 | DE4101790C1 Chip-support arrangement prodn. - in tape form, in dual-in-line format by film-bond technology |
| 07/08/1992 | EP0494001A1 Cold finger for semiconductor circuit and cryogenic device having such finger |
| 07/08/1992 | EP0493967A1 Direct microcircuit decoupling |
| 07/08/1992 | EP0493957A1 Apparatus for improving antifuse programming yield and reducing antifuse programming time |
| 07/08/1992 | EP0493876A2 Reducing circuit path crossovers in stacked multiprocessor board arrays |