H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1992
08/19/1992	CN1017951B Superconductive semiconductor device
08/19/1992	CN1017950B Silicon ic back silver sputtering metallization
08/18/1992	US5140496 Direct microcircuit decoupling
08/18/1992	US5140407 Semiconductor integrated circuit devices
08/18/1992	US5140406 Crimp-type semiconductor device having non-alloy structure
08/18/1992	US5140405 Semiconductor assembly utilizing elastomeric single axis conductive interconnect
08/18/1992	US5140404 Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape
08/18/1992	US5140403 Used for image sensors, printer heads and can operate at high speed
08/18/1992	US5140109 Herne tic sealing, chemical resistanc,e accuracy, low noise
08/18/1992	US5139973 Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet
08/18/1992	US5139972 Batch assembly of high density hermetic packages for power semiconductor chips
08/18/1992	US5139963 Method and a system for assisting mending of a semiconductor integrated circuit, and a wiring structure and a wiring method suited for mending a semiconductor integrated circuit
08/18/1992	US5139880 Photoresists comprising oligomers of a fluorinated dihydric phenol/formaldehyde and a dialdehyde/phenol; microcircuits; hardness; adhesion; shrinkage and chemical resistance
08/18/1992	US5139852 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, strees relieving, noncracking and high strength
08/18/1992	US5139851 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, stree relieving, noncracking and high strength
08/18/1992	US5139448 Solder-bearing lead
08/18/1992	US5139443 Housing assembly for plug-in electrical element having blade-type terminals
08/15/1992	CA2061093A1 Filler for heat-conductive thermosetting resins
08/13/1992	DE4203832A1 Semiconductor pressure sensor in plastic moulded package - can be made with a lower strain level due to thermal expansion coefficient mismatch by careful optimisation of some dimensions
08/13/1992	DE4103780A1 Power diode with semiconductor chip between head wire and metal socket - has mounting connecting power diode to sheet metal heat sink via heat conducting plastics material
08/12/1992	WO1992014261A1 Multichip module and integrated circuit substrates having planarized patterned surfaces
08/12/1992	EP0498753A2 Integral cooling system for cooling electronic components
08/12/1992	EP0498713A2 Process of mounting miniature electronic components with solderable leads on a flexible substrate
08/12/1992	EP0498703A1 Process and device to place chips into receptacles provided in a substrate using an adhesive
08/12/1992	EP0498604A1 Semiconductor device having a teos based spin-on-glass and process for making the same
08/12/1992	EP0498446A2 Multichip packaged semiconductor device and method for manufacturing the same
08/12/1992	EP0498412A1 Semiconductor device including a package having a plurality of bumps arranged in a grid form as external terminals
08/12/1992	EP0498274A2 Electrolytic method for forming vias and through holes in copper-invar-copper core structures
08/12/1992	EP0498109A1 Method for manufacturing semiconductor device having a via hole
08/12/1992	EP0497963A1 Mounting of electronic devices
08/12/1992	EP0497948A1 Method and device for hermetic encapsulation of electronic components.
08/12/1992	EP0493411A4 Method and apparatus for aligning mating form tools
08/12/1992	CA2101426A1 Multichip module and integrated circuit substrates having planarized patterned surfaces
08/11/1992	US5138524 Apparatus for securing electronic device packages to heat sinks
08/11/1992	US5138439 Semiconductor device
08/11/1992	US5138438 Lead connections means for stacked tab packaged IC chips
08/11/1992	US5138436 Interconnect package having means for waveguide transmission of rf signals
08/11/1992	US5138434 Packaging for semiconductor logic devices
08/11/1992	US5138433 Multi-chip package type semiconductor device
08/11/1992	US5138431 Terminal of ferromagnetic material; bonding pad; continuous path of electrically conducting non-ferromagnetic material; wear resistance; rigidity
08/11/1992	US5138430 High performance versatile thermally enhanced IC chip mounting
08/11/1992	US5138429 Precisely aligned lead frame using registration traces and pads
08/11/1992	US5138428 Connection of a semiconductor component to a metal carrier
08/11/1992	US5138427 Semiconductor device having a particular structure allowing for voltage stress test application
08/11/1992	US5138426 Ceramic joined body
08/11/1992	US5138425 Semiconductor integrated circuit device with nitride barrier layer ion implanted with resistivity decreasing elements
08/11/1992	US5138424 Positive working polyamic acid/imide photoresist compositions and their use as dielectrics
08/11/1992	US5138423 Programmable device and a method of fabricating the same
08/11/1992	US5138419 Wafer scale integration device with dummy chips and relay pads
08/11/1992	US5138407 Transistor made of 3-5 group semiconductor materials on a silicon substrate
08/11/1992	US5138115 Carrierles surface mounted integrated circuit die
08/11/1992	US5138114 Hybrid/microwave enclosures and method of making same
08/11/1992	US5138028 Polyimides end-capped with diaryl substituted acetylene
08/11/1992	US5137846 Applying a mixture of inorganic powder and cyanate ester; curing; protective coating; integrated circuit dies
08/11/1992	US5137845 Method of forming metal contact pads and terminals on semiconductor chips
08/11/1992	US5137597 Fabrication of metal pillars in an electronic component using polishing
08/11/1992	US5137479 Lead structure for packaging semiconductor chip
08/11/1992	US5137283 Thermally conductive gasket device
08/11/1992	US5136779 Method of mounting lead frame on substrate
08/06/1992	WO1992013435A1 Manufacturing multilayer ceramic substrate
08/06/1992	WO1992013360A1 Aluminum alloy wiring layer, manufacturing thereof, and aluminum alloy sputtering target
08/06/1992	WO1992013359A1 An improved antifuse circuit structure for use in a field programmable gate array and method of manufacture thereof
08/06/1992	WO1992011743A3 An interconnect structure for connecting electronic devices
08/06/1992	DE4201792A1 Improved corrosion-resistant plastic encapsulated integrated circuit - having elastic insulating layer on top of the passivation layer of the side sealing round the ball and and preventing moisture ingress
08/05/1992	EP0497744A1 Metal heat sink baseplate for a resin-encapsulated semiconductor device, having raised portions for welding ground connection wires thereon
08/05/1992	EP0497620A2 Micromechanical barb and method for making the same
08/05/1992	EP0497595A2 Local interconnect for integrated circuits
08/05/1992	EP0497541A1 Semiconductor device with a borophosphosilicate glass and method of manufacturing the same
08/05/1992	EP0497478A2 Low impedance, high voltage protection circuit
08/05/1992	EP0497286A2 Gold plating bath additives for copper circuitization on polyimide printed circuit boards
08/05/1992	EP0497228A1 Microwave dielectric ceramic composition
08/05/1992	EP0496874A1 Encapsulation of electronic components
08/05/1992	EP0173733B1 Capacitive device
08/04/1992	US5136471 Laminate wiring board
08/04/1992	US5136367 Low cost erasable programmable read only memory package
08/04/1992	US5136366 Overmolded semiconductor package with anchoring means
08/04/1992	US5136365 Anisotropic conductive adhesive and encapsulant material
08/04/1992	US5136364 Noncontaminating
08/04/1992	US5136363 Semiconductor device with bump electrode
08/04/1992	US5136362 Electrical contact with diffusion barrier
08/04/1992	US5136361 Stratified interconnect structure for integrated circuits
08/04/1992	US5136360 Electronic circuit device, method of connecting with solder and solder for connecting gold-plated terminals
08/04/1992	US5136359 Anisotropic conductive film with through-holes filled with metallic material
08/04/1992	US5136358 Multi-layered wiring structure
08/04/1992	US5136357 Low-noise, area-efficient, high-frequency clock signal distribution line structure
08/04/1992	US5136355 Tungsten deposit constituting elongate power supply rail; highly doped silicon
08/04/1992	US5136354 Semiconductor device wafer with interlayer insulating film covering the scribe lines
08/04/1992	US5136271 Microwave integrated circuit mountings
08/04/1992	US5135890 Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
08/04/1992	US5135889 Method for forming a shielding structure for decoupling signal traces in a semiconductor
08/04/1992	US5135878 Diffusion barrier of TA-SI-N; reliability
08/04/1992	US5135595 Process for fabricating a low dielectric composite substrate
08/04/1992	US5135034 Outer lead forming apparatus for semiconductor device
08/04/1992	US5134773 Method for making a credit card containing a microprocessor chip
08/04/1992	CA1306072C Refractory metal - titanium nitride conductive structures and processes for forming the same
08/01/1992	WO1992013545A1 Endothelin converting enzyme inhibitors
08/01/1992	CA2100171A1 Endothelin converting enzyme inhibitors
07/1992
07/30/1992	DE4102441A1 Ceramic-filled fluoro-polymer compsn. for electrical substrates - with silanised filler present to give improved flow properties, e.g. into through-holes
07/30/1992	DE4102350A1 Heat transfer element for integrated circuits - has enclosed casing filled with liq. coolant of good thermal conductivity provided between contact surfaces of IC and heat sink
07/29/1992	EP0496614A1 Method for forming contact hole in process of manufacturing semiconductor device

1 ... 2127 2128 2129 2130 2131 2132 2133 2134 2135 2136 2137 2138 2139 2140 2141 2142 2143 2144 2145 2146 2147 ... 2262