| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/09/1992 | EP0502647A2 Conductive structure for integrated circuits |
| 09/09/1992 | EP0502614A2 Thin film circuit substrate and processes for its manufacture |
| 09/09/1992 | EP0502145A1 Packaging of electronic devices |
| 09/09/1992 | EP0336951B1 Integrated circuit contact fabrication process |
| 09/08/1992 | US5146314 Apparatus for semiconductor circuit chip cooling using a diamond layer |
| 09/08/1992 | US5146313 Metallized ceramic structure comprising aluminum nitride and tungsten layers |
| 09/08/1992 | US5146312 Insulated lead frame for semiconductor packaged devices |
| 09/08/1992 | US5146310 Thermally enhanced leadframe |
| 09/08/1992 | US5146308 Semiconductor package utilizing edge connected semiconductor dice |
| 09/08/1992 | US5146307 Fuse having a dielectric layer between sloped insulator sidewalls |
| 09/08/1992 | US5146005 Cationically curable oxalkylene ethers, method for their synthesis and their use as casting compounds, coating compositions or as reactive diluents for epoxide resins |
| 09/08/1992 | US5145889 Acid anhydride-cured epoxy resin encapsulant with triorganothiophosphite |
| 09/08/1992 | US5145800 Method of wiring for power supply to large-scale integrated circuit |
| 09/08/1992 | US5145715 Light transmission paste and metallic copper deposition method using same |
| 09/08/1992 | US5145571 Integrated circuits |
| 09/08/1992 | US5145552 Process for preparing electrical connecting member |
| 09/08/1992 | US5145540 Finely dispersed, sinterable alumina, silica, magnesia, and glass; multilayer housings for microelectronics |
| 09/08/1992 | US5145104 Substrate soldering in a reducing atmosphere |
| 09/08/1992 | US5145001 High heat flux compact heat exchanger having a permeable heat transfer element |
| 09/08/1992 | US5144746 Method of assembling compact silicon module for high density integrated circuits |
| 09/08/1992 | CA1307355C Soft-faced semiconductor component backing |
| 09/08/1992 | CA1307139C Copper-based metal alloy of improved type, particularly for the construction of electronic components |
| 09/03/1992 | WO1992015118A1 Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method |
| 09/03/1992 | DE4106185A1 Electronic component or circuit cooler - has thermal container which is formed by thin-wall, enclosed, rubber-like sleeve |
| 09/03/1992 | DE4105152A1 Electronic circuit mounted onto heat sink for efficient cooling - has elements interconnected by bridging strips and uses common base of electrical insulating material |
| 09/03/1992 | CA2389603A1 Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method |
| 09/02/1992 | EP0501830A2 Insulated lead frame for semiconductor packaged devices |
| 09/02/1992 | EP0501734A2 Semiconductor device-encapsulating epoxy resin composition |
| 09/02/1992 | EP0501687A2 Buried antifuse |
| 09/02/1992 | EP0501686A1 Fabrication of aluminium-containing semiconductor devices by metal-organic molecular-beam-epitaxy |
| 09/02/1992 | EP0501564A1 Semiconductor device |
| 09/02/1992 | EP0501474A2 Electronic circuit package |
| 09/02/1992 | EP0501407A1 Semiconductor integrated circuit having wirings |
| 09/02/1992 | EP0501361A1 Electrical connecting member and method of manufacturing the same |
| 09/02/1992 | EP0501358A2 Connecting method and apparatus for electric circuit components |
| 09/02/1992 | EP0501357A1 Electrical connecting member and method of manufacturing the same |
| 09/02/1992 | EP0501341A1 Semiconductor device comprising a filler |
| 09/02/1992 | EP0501120A2 Programmable antifuse structure, process, logic cell and architecture for programmable integrated circuits |
| 09/02/1992 | EP0501013A2 Shearing stress interconnection apparatus and method |
| 09/02/1992 | EP0500965A1 Semiconductor device having heat radiating fin assembly and case for containing the same |
| 09/02/1992 | EP0500690A1 Multi-layer lead frames for integrated circuit packages. |
| 09/01/1992 | US5144583 Dynamic semiconductor memory device with twisted bit-line structure |
| 09/01/1992 | US5144578 Semiconductor device having multiple supply potential paths for reducing electrical interference between circuits contained therein |
| 09/01/1992 | US5144536 Electronic circuit substrate |
| 09/01/1992 | US5144532 Circuit board assembly |
| 09/01/1992 | US5144531 Electronic apparatus cooling system |
| 09/01/1992 | US5144526 Low temperature co-fired ceramic structure containing buried capacitors |
| 09/01/1992 | US5144524 Light trap for blocking reflection and scattering of light |
| 09/01/1992 | US5144519 Electrostatic protection circuit for semiconductor chip |
| 09/01/1992 | US5144413 Semiconductor structures and manufacturing methods |
| 09/01/1992 | US5144411 Method and structure for providing improved insulation in vlsi and ulsi circuits |
| 09/01/1992 | US5144407 Semiconductor chip protection layer and protected chip |
| 09/01/1992 | US5144406 Diode devices and active matrix addressed display devices incorporating them |
| 09/01/1992 | US5143948 Semiconductor element protecting compositions |
| 09/01/1992 | US5143865 Metal bump type semiconductor device and method for manufacturing the same |
| 09/01/1992 | US5143510 Lead frame separating device |
| 09/01/1992 | US5143277 Method for the mounting of miniature electronic beam lead components |
| 09/01/1992 | US5142765 Lead mounting apparatus |
| 09/01/1992 | CA1307055C2 Semiconductor interconnection structure |
| 09/01/1992 | CA1307053C Metallic base semiconductor device |
| 08/29/1992 | CA2059408A1 Fabrication of aluminum-containing semiconductor devices |
| 08/27/1992 | CA2061801A1 Semiconductor device-encapsulating epoxy resin composition |
| 08/26/1992 | WO1992015117A1 Wiring board |
| 08/26/1992 | EP0500235A1 Protecting tape automated bonding devices |
| 08/26/1992 | EP0500093A1 Ceramic composite material and process for producing the same |
| 08/26/1992 | EP0500074A1 Structure of semiconductor IC chip |
| 08/26/1992 | EP0500034A1 Sidewall anti-fuse structure and method for making |
| 08/26/1992 | EP0499986A2 Multilayer wiring structure and method for forming multilayer construction |
| 08/26/1992 | EP0499865A1 Glass-aluminum nitride composite material |
| 08/26/1992 | EP0499758A1 Moulded integrated circuit box with window and moulding processing |
| 08/26/1992 | EP0499748A1 TAB tape |
| 08/26/1992 | EP0499707A1 Gate turn-off semiconductor power component |
| 08/26/1992 | CN1063942A Low impedance, high voltage protection circuit |
| 08/26/1992 | CN1063888A Silver-filled die attachment compositions and use of same |
| 08/25/1992 | US5142450 Non-contact lead design and package |
| 08/25/1992 | US5142444 Demountable tape-automated bonding system |
| 08/25/1992 | US5142443 Cryogenic cooling of circuit boards |
| 08/25/1992 | US5142352 Ceramic package component having one quarter wavelength spaced conductive grounding vias |
| 08/25/1992 | US5142351 Via-less two-metal tape-automated bonding system |
| 08/25/1992 | US5141974 Curable polyepoxide and phenolic resin copolymer; molding material for encapsulating electrical components |
| 08/25/1992 | US5141899 Low dielectric inorganic composition for multilayer ceramic package containing titanium silicate glass and crystal inhibitor |
| 08/25/1992 | US5141898 Integrated circuit with means for reducing ESD damage |
| 08/25/1992 | US5141897 Filling opening in dielectric layer, forming etch stop and covering layers, etching runners in top layer and connecting pattern in second layer |
| 08/25/1992 | US5141896 Forming solid support between layers; durability |
| 08/25/1992 | US5141817 Organosilicon, organogermanium polymer |
| 08/25/1992 | US5141050 Controlled highly densified diamond packing of thermally conductive electrically resistive conduit |
| 08/20/1992 | WO1992014264A1 Arrangement of heat-generating structural components in a liquid-cooled device |
| 08/20/1992 | WO1992014263A1 Carrier ring for semiconductor packages |
| 08/20/1992 | WO1992014260A1 Method of making semiconductor bonding bumps using metal cluster ion deposition |
| 08/20/1992 | DE4104888A1 Electronic module with metal housing - has heat sink for semiconductor components of PCB by base, stamp and resilient disc |
| 08/20/1992 | DE4104327A1 Peltier element for heat removal from silicon@ dice - is formed on a cantilevered part of a silicon substrate to avoid the degradation caused by a cooling substrate |
| 08/20/1992 | DE4103486A1 Anordnung zur kuehlung waermeerzeugender bauelemente Arrangement for cooling devices waermeerzeugender |
| 08/20/1992 | CA2101745A1 Carrier ring for semiconductor package |
| 08/19/1992 | EP0499585A1 Filler for heat conducting polymers |
| 08/19/1992 | EP0499433A2 Semiconductor device with improved reliability wiring and method of its fabrication |
| 08/19/1992 | EP0499314A2 Method of manufacturing a semiconducteur device using electroless plating |
| 08/19/1992 | EP0499249A2 Method of producing a semiconductor device including a barrier layer |
| 08/19/1992 | EP0499241A1 Sputtering process for forming aluminum layer over stepped semiconductor wafer |
| 08/19/1992 | EP0499079A1 Electronic packaging with varying height connectors |
| 08/19/1992 | EP0499063A2 Resin sealed semiconductor integrated circuit comprising a wiring layer |