| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/29/1992 | US5151776 Die attachment method for use in high density interconnected assemblies |
| 09/29/1992 | US5151775 Integrated circuit device having improved substrate capacitance isolation |
| 09/29/1992 | US5151773 Electronic circuit apparatus comprising a structure for sealing an electronic circuit |
| 09/29/1992 | US5151772 Semiconductor integrated circuit device |
| 09/29/1992 | US5151771 High lead count circuit board for connecting electronic components to an external circuit |
| 09/29/1992 | US5151770 Shielded semiconductor device |
| 09/29/1992 | US5151769 Optically patterned RF shield for an integrated circuit chip for analog and/or digital operation at microwave frequencies |
| 09/29/1992 | US5151611 Programmable device for integrated circuits |
| 09/29/1992 | US5151559 Planarized thin film surface covered wire bonded semiconductor package |
| 09/29/1992 | US5151387 Integrated circuits |
| 09/29/1992 | US5151384 Amorphous silicon switch with forming current controlled by contact region |
| 09/29/1992 | US5151375 EPROM virtual ground array |
| 09/29/1992 | CA2064319A1 Device including a carrier member, a semiconductor laser and leads |
| 09/28/1992 | WO1992017903A2 Three-dimensional multichip module systems and methods of fabrication |
| 09/28/1992 | WO1992017901A1 Multichip integrated circuit module and method of fabrication |
| 09/28/1992 | CA2106873A1 Three-dimensional multichip module systems and methods of fabrication |
| 09/28/1992 | CA2106872A1 Multichip integrated circuit module and method of fabrication |
| 09/24/1992 | DE4124269A1 Halbleiterleitungsrahmen Semiconductor lead frame |
| 09/23/1992 | EP0505290A2 Semiconductor device having improved leads, production process of the semiconductor device, and lead frame used in production process of the semiconductor device |
| 09/23/1992 | EP0505193A1 Cover for electrical components package |
| 09/23/1992 | EP0504959A2 Carbon-alloyed cubic boron nitride films |
| 09/23/1992 | EP0504856A1 Radiating device |
| 09/23/1992 | EP0504821A2 Packaged semiconductor device having stress absorbing film |
| 09/23/1992 | EP0504796A1 Method for surface treatment of a body, surface treatment agent, surface treated body, surface treated members, and apparatus being furnished with same |
| 09/23/1992 | EP0504669A1 Semiconductor device comprising a substrate |
| 09/23/1992 | EP0504634A2 Resin-sealed semiconductor device containing porous fluorocarbon resin |
| 09/23/1992 | EP0504614A1 Electrical connecting member and manufacturing method therefor |
| 09/23/1992 | EP0504601A2 Substrate soldering in a reducing atmosphere |
| 09/23/1992 | EP0504569A2 Method of coating or sealing of electronic components or component groups |
| 09/23/1992 | EP0504532A1 Material for passive electronic components |
| 09/23/1992 | EP0504411A1 Semiconductor device having many lead pins |
| 09/23/1992 | EP0504314A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith. |
| 09/23/1992 | EP0504265A1 Crosslinkable fluorinated polymer compositions. |
| 09/22/1992 | US5150371 Laser diode carrier with a semiconductor cooler |
| 09/22/1992 | US5150274 Multi-chip-module |
| 09/22/1992 | US5150233 Multilayer electrode; indium, tin oxide, molybdenum (or alloy there of)and aluminum (or alloy thereof) |
| 09/22/1992 | US5150216 Solid-state image sensing device having an optimum overflow drain voltage generation circuit |
| 09/22/1992 | US5150198 Radiator for semiconductor chip |
| 09/22/1992 | US5150197 Die attach structure and method |
| 09/22/1992 | US5150196 Hermetic sealing of wafer scale integrated wafer |
| 09/22/1992 | US5150195 Rapid-curing adhesive formulation for semiconductor devices |
| 09/22/1992 | US5150194 Anti-bow zip lead frame design |
| 09/22/1992 | US5150193 Lead frame for a semiconductor device |
| 09/22/1992 | US5150189 Semiconductor apparatus |
| 09/22/1992 | US5150180 Protective glass of cerium and titanium oxides |
| 09/22/1992 | US5150083 Digitally controlled monolithic switch matrix using selectable dual gate FET power dividers and combiners |
| 09/22/1992 | US5149993 Circuit arrangement of semiconductor integrated circuit device |
| 09/22/1992 | US5149730 Diglycidyl ether of 4,4*-dihydroxybiphenyl, trisphenolic curing agent, cure accelerator, inorganic filler |
| 09/22/1992 | US5149674 Multilayer; metal overcoating of dielectric |
| 09/22/1992 | US5149671 Applying malleable electroconductivity material; removal segments |
| 09/22/1992 | US5149662 Methods for testing and burn-in of integrated circuit chips |
| 09/22/1992 | US5149615 Applying multicoat of chromium adhesion, gold plating seed, polyimide dielectric, passivation layer and electroplated copper conductors; patterning, dissolving, exposing and etching to form desired integrated circuit |
| 09/22/1992 | US5149590 Fluoropolymer filled with ceramic having a coating of fluorinated silane |
| 09/21/1992 | CA2063334A1 Radiating device |
| 09/17/1992 | WO1992016096A1 Low temperature co-fired multilayer ceramic circuit boards with silver conductors |
| 09/17/1992 | WO1992016091A1 A package for integrated circuits |
| 09/17/1992 | WO1992016018A1 Batch assembly methods for packaging of chips |
| 09/17/1992 | DE4108667A1 Composite circuit board with metallic base plate - obtd. by fixing a thick layer conductor plate on a metallic base plate using a pressure hardenable silicone adhesive hardened in separate oven process |
| 09/16/1992 | EP0503904A2 Contact structure of an interconnection layer placed on a surface having steps and SRAM having a multilayer interconnection and manufacturing method thereof |
| 09/16/1992 | EP0503810A2 Connector for leadless IC package |
| 09/16/1992 | EP0503809A2 Mount-to-contact type contact |
| 09/16/1992 | EP0503805A1 IC package having direct attach backup battery |
| 09/16/1992 | EP0503769A1 Lead frame and resin sealed semiconductor device using the same |
| 09/16/1992 | EP0503744A2 Curable resin compositions and semiconductor devices coated and sealed with the same |
| 09/16/1992 | EP0503731A1 Method of making a transistor with high electron mobility |
| 09/16/1992 | EP0503455A2 Electronic assembly group and method of manufacturing electronic assembly groups |
| 09/16/1992 | EP0503201A2 Semiconductor device having an interconnecting circuit board and method for manufacturing same |
| 09/16/1992 | EP0503200A2 Package for microwave integrated circuit |
| 09/16/1992 | EP0503072A1 Semiconductor device and its manufacturing process |
| 09/16/1992 | EP0502887A1 Metal pin grid array package including dieletric polymer sealant. |
| 09/16/1992 | EP0502884A1 Method and device for semiconductor fabrication fault analasys. |
| 09/16/1992 | CN2116280U Improved connector end strip of integrated circuit |
| 09/16/1992 | CN1064566A Package |
| 09/16/1992 | CA2062202A1 Mount-to-contact type contact |
| 09/16/1992 | CA2062199A1 Connector for leadless ic package |
| 09/15/1992 | US5148266 Semiconductor chip assemblies having interposer and flexible lead |
| 09/15/1992 | US5148265 Semiconductor chip assemblies with fan-in leads |
| 09/15/1992 | US5148264 High current hermetic package |
| 09/15/1992 | US5148263 Semiconductor device having a multi-layer interconnect structure |
| 09/15/1992 | US5148260 Semiconductor device having an improved air-bridge lead structure |
| 09/15/1992 | US5148259 Semiconductor device having thin film wiring layer of aluminum containing carbon |
| 09/15/1992 | US5148249 Semiconductor protection device |
| 09/15/1992 | US5148241 Method of manufacturing a schottky diode device |
| 09/15/1992 | US5147985 Sheet batteries as substrate for electronic circuit |
| 09/15/1992 | US5147982 Encapsulation of electronic modules |
| 09/15/1992 | US5147851 Stabilized zirconia substrate, silver-platinum coating |
| 09/15/1992 | US5147832 Heat treatment with boron/carbon compounds, aluminium oxide and rare earth oxides, group 4,5,6 compounds in presence of nitrogen anf oxidation resistance hydrocarbon gas to form colored ceramic body |
| 09/15/1992 | US5147824 Semiconductor wafer |
| 09/15/1992 | US5147822 Plasma processing method for improving a package of a semiconductor device |
| 09/15/1992 | US5147821 Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
| 09/15/1992 | US5147815 Method for fabricating a multichip semiconductor device having two interdigitated leadframes |
| 09/15/1992 | US5147484 During burnout of binder |
| 09/15/1992 | US5147470 Alloy of cobalt, nickel, manganese, silicon and iron |
| 09/15/1992 | US5147469 Quenching, heat treating and cold working alloy containing cobalt and phosphorous |
| 09/15/1992 | US5147210 Polymer film interconnect |
| 09/15/1992 | US5146981 Substrate to heatsink interface apparatus and method |
| 09/15/1992 | US5146674 Manufacturing process of a high density substrate design |
| 09/15/1992 | US5146662 Lead frame cutting apparatus for various sized integrated circuit packages and method therefor |
| 09/10/1992 | DE4107312A1 Mounting system for power semiconductor device - has heat conductive coupling between heat conductive layer beneath semiconductor device and insulating layer supporting circuit board |
| 09/09/1992 | EP0502710A1 Flexible film semiconductor package |