H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1992
10/14/1992	EP0508504A1 A device for applying dot-shaped coatings
10/14/1992	EP0508462A2 Microelectronic device incorporating an improved packaging scheme
10/14/1992	EP0508408A2 Semiconductor device having metallization layers
10/14/1992	EP0508266A1 Semiconductor device having reduced die stress and process for making the same
10/14/1992	EP0508195A1 Method of forming a microelectronic package having a copper substrate
10/14/1992	EP0508179A2 Circuit device
10/14/1992	EP0508156A1 Copper alloy metallurgies for VLSI interconnection structures
10/14/1992	EP0508137A2 Liquid-crystal display device and process for producing the same
10/14/1992	EP0344290B1 Vacuum apparatus
10/14/1992	CN1065351A 半导体引线架 Semiconductor lead frame
10/13/1992	US5155700 Method for reducing coupling noise of word lines in a semiconductor memory device
10/13/1992	US5155692 Technique for routing conductive paths
10/13/1992	US5155665 Copper sheet bonded to surface of ceramic substrate; hardness
10/13/1992	US5155661 Aluminum nitride multi-chip module
10/13/1992	US5155660 Semiconductor device
10/13/1992	US5155656 Integrated series capacitors for high reliability electronic applications including decoupling circuits
10/13/1992	US5155655 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
10/13/1992	US5155579 Molded heat sink for integrated circuit package
10/13/1992	US5155578 Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages
10/13/1992	US5155577 Integrated circuit carriers and a method for making engineering changes in said carriers
10/13/1992	US5155576 Semiconductor integrated circuit having a multilayer wiring structure
10/13/1992	US5155575 Chip carrier for a microwave semiconductor component
10/13/1992	US5155564 Thin-film transistor array
10/13/1992	US5155302 Electronic device interconnection techniques
10/13/1992	US5155299 Corrosion resistant, lightweigth, thermoconductive casings for electronics
10/13/1992	US5155175 Dielectrics
10/13/1992	US5155068 Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
10/13/1992	US5155066 Rapid-curing adhesive formulation for semiconductor devices
10/13/1992	US5155065 Universal pad pitch layout
10/13/1992	US5155064 Fabrication method of a semiconductor device having a planarized surface
10/13/1992	US5155063 Method of fabricating semiconductor device including an al/tin/ti contact
10/13/1992	US5154976 Flame retardant epoxy molding compound, method and encapsulated device
10/13/1992	US5154886 Protection of devices
10/13/1992	US5154341 Noncollapsing multisolder interconnection
10/13/1992	US5153986 Method for fabricating metal core layers for a multi-layer circuit board
10/13/1992	CA1308817C Low dielectric composite substrate
10/09/1992	CA2065587A1 Substrate for microwave component
10/08/1992	DE4210821A1 Connection structure for semiconductor component - has aluminium@ compound laminate contg. aluminium@ alloy and refractory metal layers covered by insulating layer
10/07/1992	EP0507719A1 Improved glass-ceramic to copper adhesion
10/07/1992	EP0507718A1 Low lead content Pb-Sn-Ag-Sb solder alloy useful in an interconnect metallization structure
10/07/1992	EP0507446A2 Structure and method for self-aligned contact formation
10/07/1992	EP0507077A2 Semiconductor integrated circuit with a plurality of gate electrodes
10/07/1992	EP0506859A1 Flip chip technology using electrically conductive polymers and dielectrics.
10/07/1992	EP0506710A1 Process enhancement using molybdenum plugs in fabricating integrated circuits
10/07/1992	EP0506675A1 Process for determining the position of a pn transition.
10/06/1992	US5153815 Cooling structure of a test head for IC tester
10/06/1992	US5153814 Mounting system for electrical function units, particularly for data technology
10/06/1992	US5153734 Solid state image pickup device mounting structure
10/06/1992	US5153710 Integrated circuit package with laminated backup cell
10/06/1992	US5153709 Improved reliability without entailing the dangers of closed-circuit failure, corrosion and formation of dew
10/06/1992	US5153708 Tape carrier used in tab system
10/06/1992	US5153707 Film material for manufacturing film carriers having outer lead portions with inner and outer metallic layers
10/06/1992	US5153706 Lead frames for use in plastic mold type semiconductor devices
10/06/1992	US5153705 Tab package and a liquid-crystal panel unit using the same
10/06/1992	US5153704 Semiconductor device using annealed bonding wire
10/06/1992	US5153700 Crystal-etched matching faces on semiconductor chip and supporting semiconductor substrate
10/06/1992	US5153699 Semiconductor device
10/06/1992	US5153698 Master slice integrated circuit device
10/06/1992	US5153689 Capacitor comprises a stacked structure formed of metals having high melting points and low reflectance; improved reliability and highly integrated
10/06/1992	US5153463 Programmable logic device having a reduced switching matrix
10/06/1992	US5153449 Heatsink bus for electronic switch
10/06/1992	US5153408 Method and structure for repairing electrical lines
10/06/1992	US5153385 Transfer molded semiconductor package with improved adhesion
10/06/1992	US5153384 Circuit board and process for manufacturing same
10/06/1992	US5153379 Shielded low-profile electronic component assembly
10/06/1992	US5153077 Ceramic-metal composite substrate
10/06/1992	US5152880 Electrodeposition of a polymer
10/06/1992	US5152869 Process for obtaining passive thin-layer circuits with resistive lines having different layer resistances and passive circuit made by said process
10/06/1992	US5152868 Elastomer connector for integrated circuits or similar, and method of manufacturing same
10/06/1992	US5152834 Reacting crosslinked polysiloxane with organosilicon adhesion promoter yields damage resistant storage stable coating for semiconductors
10/06/1992	US5152450 Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method
10/06/1992	US5152057 Molded integrated circuit package
10/06/1992	US5152054 Method of making film carrier structure for integrated circuit tape automated bonding
10/06/1992	CA1308494C Connection structure between components for semiconductor apparatus
10/06/1992	CA1308446C Thermoelectric cooling device with efficient heat sink
10/05/1992	CA2062937A1 Optically patterned rf shield for an integrated circuit chip for analog and/or digital operation at microwave frequencies
10/01/1992	WO1992017045A1 Multi-level/multi-layered hybrid package
10/01/1992	WO1992016976A1 Improved method of fabricating antifuses in an integrated circuit device and resulting structure
10/01/1992	WO1992016969A1 Semiconductor sealing resin tablet and its manufacture
10/01/1992	WO1992016968A1 Method and device for manufacturing a single product from integrated circuits received on a lead frame
10/01/1992	DE4210129A1 Novel 3A,4,7,7A-tetra:hydro-indene phenolic resin(s) - useful as hardeners in epoxy resin encapsulating compsns. for e.g. semiconductors
10/01/1992	DE4210127A1 Epoxy] resin used in sealing semiconductor building elements - comprising epoxy] resin, phenolic hardening agent, organo phosphor-hardening catalyst, aluminium oxide and sepg. agent
10/01/1992	DE4108981A1 Cooling circuit for electronic equipment - regulates by either temp. or pressure control with ventilator or liq. cooling for condenser
09/1992
09/30/1992	EP0506526A1 Hybrid module and its process for manufacture
09/30/1992	EP0506509A2 Semiconductor device having radiation part and method of producing the same
09/30/1992	EP0506480A2 Semiconductor device package
09/30/1992	EP0506426A1 Integrated circuit metallization with zero contact enclosure requirements and method of making the same
09/30/1992	EP0506360A2 Epoxy resin compositions and semiconductor devices encapsulated therewith
09/30/1992	EP0506359A2 Epoxy resin compositions and semiconductor devices encapsulated therewith
09/30/1992	EP0506225A2 Integrated circuit chip package
09/30/1992	EP0506129A1 Process for forming an electrical contact through an insulation layer to a silicon semiconductor wafer thereunder
09/30/1992	EP0506097A2 Method of manufacturing a semiconductor device having a layer with a controlled thickness
09/30/1992	EP0506090A2 Semiconductor device with electromagnetic shield
09/30/1992	EP0505894A1 Coating processes and apparatus
09/30/1992	EP0505880A1 Electron induced transformation of an isoimide to an N-imide and uses thereof
09/30/1992	EP0505859A1 Electronic package for high density applications
09/30/1992	EP0505842A1 Arrangement with a support, a semi-conductor laser and leads
09/30/1992	EP0505438A1 Electronic articles containing a fluorinated poly(arylene ether) dielectric
09/29/1992	US5151846 Surface mountable rectifier and method for fabricating same
09/29/1992	US5151777 Copper, aluminum, iron-nickel alloy

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