H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1992
11/04/1992	CA2065980A1 Cooling structures and package modules for semiconductors
11/03/1992	US5161093 Electronics
11/03/1992	US5161092 Circuit card assembly conduction converter
11/03/1992	US5161090 Apparatus for controlling the temperature
11/03/1992	US5161089 Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
11/03/1992	US5161087 Pivotal heat sink assembly
11/03/1992	US5161086 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
11/03/1992	US5161009 Ic module having a folding junction structure
11/03/1992	US5161000 High-frequency thick-film semiconductor circuit
11/03/1992	US5160999 Acceleration resistant packaging for integrated circuits and method of producing them
11/03/1992	US5160998 Semiconductor device and method of manufacturing the same
11/03/1992	US5160997 Semiconductor integrated circuit with shield electrodes for protecting the interconnection lines from undesirable radiation
11/03/1992	US5160995 Semiconductor IC device with dummy wires
11/03/1992	US5160907 Multiple layer semiconductor circuit module
11/03/1992	US5160903 Gap-less package to provide isolation between signals
11/03/1992	US5160810 Universal surface mount package
11/03/1992	US5160787 Electrical laminate having ability to absorb ultraviolet rays
11/03/1992	US5160786 Polyarylene sulfide
11/03/1992	US5160765 Coating paste, water vapor, hydrogen, oxygen, heating
11/03/1992	US5160747 Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit package
11/03/1992	US5160270 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
11/03/1992	US5159750 Method of connecting an IC component with another electrical component
11/02/1992	CA2066497A1 Epoxy molding composition for surface mount applications
10/1992
10/29/1992	WO1992019027A1 Thin planer package for cooling an array of edge-emitting laser diodes
10/29/1992	WO1992019024A1 Solder-bearing lead
10/29/1992	WO1992019013A1 Power semiconductor packaging
10/29/1992	WO1992018213A1 High dielectric constant flexible ceramic composite
10/29/1992	DE4213606A1 Transistor with current detection property - has main transistor region on substrate also carrying separately arranged measurement regions with common base and collector connections and separate emitter regions
10/29/1992	DE4213251A1 Semiconductor chip with insulating frame - including heat sink and conductive structure
10/29/1992	DE4213250A1 Semiconductor assembly based on double sided circuit board - which can bend to absorb differential expansion of components soldered to either side in different positions
10/28/1992	EP0511162A1 Heat conducting adhesive films, laminates with heat conducting adhesive layers and their application
10/28/1992	EP0511096A1 Process for local passivation of a substrate, by an hydrogenated amorphous carbon layer, and method for fabricating thin film transistors on this passivated substrate
10/28/1992	EP0510969A2 Semiconductor circuit device wiring and semiconductor circuit device
10/28/1992	EP0510966A2 MOS semiconductor device and fabrication method of the same
10/28/1992	EP0510905A1 Semiconductor package which does not delaminate or crack
10/28/1992	EP0510900A2 Wetting-based breakable links
10/28/1992	EP0510755A1 Display device
10/28/1992	EP0510734A1 Heat exchanging member, more particularly for cooling a semiconductor module
10/28/1992	EP0510727A2 Superconducting ceramic film-forming paste
10/28/1992	EP0510434A2 Apparatus and method for inhibiting analysis of a secure circuit
10/28/1992	EP0510433A2 Secure circuit structure
10/28/1992	EP0510067A1 Metaphosphate glass composition
10/28/1992	EP0510049A1 A method for manufacturing of mineature impedance matched interconnection patterns
10/28/1992	EP0502887A4 Metal pin grid array package including dieletric polymer sealant
10/27/1992	US5159535 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
10/27/1992	US5159531 Multiple radial finger contact cooling device
10/27/1992	US5159530 Electronic circuit module with power feed spring assembly
10/27/1992	US5159529 Composite liquid cooled plate for electronic equipment
10/27/1992	US5159434 Semiconductor device having a particular chip pad structure
10/27/1992	US5159432 Semiconductor device package having improved sealing at the aluminum nitride substrate/low melting point glass interface
10/27/1992	US5158990 Coating compounds for electrical and electronic components containing vitreons fused silica
10/27/1992	US5158912 Integral heatsink semiconductor package
10/27/1992	US5158911 Method for interconnection between an integrated circuit and a support circuit, and integrated circuit adapted to this method
10/27/1992	US5158818 Conductive die attach tape
10/27/1992	US5158735 Encapsulating electronic components
10/27/1992	US5158136 Pin fin heat sink including flow enhancement
10/27/1992	US5158121 Method of bending lead of electric part and bender therefor
10/27/1992	CA1309512C Tape automated bonding of bumped tape on bumped die
10/25/1992	CA2066867A1 Heat-conductive adhesive films, laminated with heat-conductive adhesive layers and the use thereof
10/22/1992	DE4213003A1 Dielectric ceramic for electronic components - has varying dielectric constant to facilitate miniaturisation and contacting
10/22/1992	DE4128930A1 Integrated circuit with multiple power supply connections - has number of conducting plates connected to pins located at centre ends of each row
10/21/1992	EP0509825A2 Package structure for semiconductor device
10/21/1992	EP0509732A2 Semiconductor device attached on a substrate
10/21/1992	EP0509634A1 Electrostatic discharge protection device for semiconductor chip packages
10/21/1992	EP0509631A1 Antifuses having minimum areas
10/21/1992	EP0509065A1 Ultra high density integrated circuit packages, method and apparatus
10/20/1992	US5157589 Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing TG 's
10/20/1992	US5157588 Semiconductor package and manufacture thereof
10/20/1992	US5157480 Semiconductor device having dual electrical contact sites
10/20/1992	US5157479 Semiconductor device being capable of improving the packing density with a high heat radiation characteristics
10/20/1992	US5157478 Tape automated bonding packaged semiconductor device incorporating a heat sink
10/20/1992	US5157477 Electrical wiring structure
10/20/1992	US5157476 Tape carrier having improved test pads
10/20/1992	US5157475 Semiconductor device having a particular conductive lead structure
10/20/1992	US5157061 Encapsulation of semiconductor
10/20/1992	US5157003 One step resist coating and prebaking process
10/20/1992	US5156998 Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes
10/20/1992	US5156997 Using focused liquid metal ion source
10/20/1992	US5156996 Method for forming gold ribbon connectors for microwave integrated circuits
10/20/1992	US5156994 Masking surfaces, doping, removing mask, selectively growing semiconductor, depositing refractory metal, annealing
10/20/1992	US5156983 Method of manufacturing tape automated bonding semiconductor package
10/20/1992	US5156981 Method of making a semiconductor device of a high withstand voltage
10/20/1992	US5156923 Heat-transferring circuit substrate with limited thermal expansion and method for making
10/20/1992	US5156909 Thick, low-stress films, and coated substrates formed therefrom, and methods for making same
10/20/1992	US5156716 Process for the manufacture of a three layer tape for tape automated bonding
10/20/1992	US5156649 Test clip adapter for integrated circuit device
10/20/1992	US5156319 Wire bonding inspection equipment
10/20/1992	CA1309157C Subassemblies for optoelectronic hybrid integrated circuits
10/19/1992	CA2062248A1 Electrostatic discharge protection devices for semiconductor chip packages
10/15/1992	WO1992017905A1 Method for producing coaxial connections for electronic components, and component casing containing such connections
10/15/1992	WO1992017904A1 Secure component arrangement and method of securing a component
10/15/1992	WO1992017902A2 Surface mount device with high thermal conductivity
10/15/1992	WO1992017745A1 Heat exchanger for solid-state electronic devices
10/15/1992	WO1992017516A1 Process for curing polyquinoline polymers and compositions thereof
10/15/1992	WO1992017297A1 Fabrication of metal matrix composites by vacuum die casting
10/15/1992	DE4210643A1 Cooling appts. with conductive medium for semiconductor devices - has thermally highly conductive insulators between coolant and devices and externally insulated container
10/15/1992	DE4207916A1 Interconnecting aluminium@ metallisation layers in semiconductor integrated circuit - involves forming barrier layer on first aluminium@ layer and sequence of titanium@ layer, barrier layer and aluminium@ layer as second metallisation
10/14/1992	EP0508893A1 Substrate for microwave component
10/14/1992	EP0508821A2 Process for manufacturing multi-layer glass ceramic substrate
10/14/1992	EP0508717A1 Integrated heat sink for semiconductor modules

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