H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1992
11/24/1992	US5165986 Copper conductive composition for use on aluminum nitride substrate
11/24/1992	US5165984 Stepped multilayer interconnection apparatus and method of making the same
11/24/1992	US5165957 Process for producing multilayer wiring structure
11/24/1992	US5165956 Method of encapsulating an electronic device with a silicone encapsulant
11/24/1992	US5165590 Process for manufacturing integrated device with improved connections between the pins and the semiconductor material chip
11/24/1992	US5165166 Method of making a customizable circuitry
11/24/1992	CA1310764C Solder bonding material
11/19/1992	EP0514213A2 Process for making a package for accommodating electronic elements
11/19/1992	EP0514141A1 Heat transfer apparatus
11/19/1992	EP0514134A2 Modular electrical connector
11/19/1992	EP0514103A1 Barrier metal process for sub-micron contacts
11/19/1992	EP0514095A2 Integrated circuit using SRAM cells
11/19/1992	EP0513743A2 Semiconductor package for surface mounting
11/19/1992	EP0513715A1 Wiring arrangement for high integrated circuits
11/19/1992	EP0513684A2 Method of improving the manufaturing of SOI devices by forming position alignment marks
11/19/1992	EP0513643A1 Electronic package using closed pore composites
11/19/1992	EP0513591A2 Lead Frame-chip package
11/19/1992	EP0513521A2 Planarized thin film surface covered wire bonded semiconductor package
11/19/1992	EP0513425A1 Method of bending lead of electric part and bender therefor
11/19/1992	EP0513273A1 Direct thermocompression bonding for thin electronic power chips.
11/19/1992	DE4216145A1 Verfahren zur bildung eines schutzueberzuges auf einer halbleitervorrichtung Process for the formation of a protective coating on a semiconductor device
11/19/1992	DE4114660A1 Passivation layer semiconductor element mfr. - has channels of defined width and depth filled with glass paste to provide glass passivation layer
11/17/1992	US5165067 Semiconductor chip packages
11/17/1992	US5165066 Contact chain structure for troubleshooting eprom memory circuits
11/17/1992	US5164888 Method and structure for implementing dynamic chip burn-in
11/17/1992	US5164885 Electronic package having a non-oxide ceramic bonded to metal and method for making
11/17/1992	US5164884 Device for cooling a power transistor
11/17/1992	US5164877 Semiconductor device
11/17/1992	US5164818 Removable vlsi assembly
11/17/1992	US5164817 Distributed clock tree scheme in semiconductor packages
11/17/1992	US5164816 Polyamides, polyimides
11/17/1992	US5164815 Integrated circuit device and method to prevent cracking during surface mount
11/17/1992	US5164813 New diode structure
11/17/1992	US5164699 Resistor structure in a cofired unitized multilayer circuit structure
11/17/1992	US5164683 RF amplifier assembly
11/17/1992	US5164342 Low dielectric, low temperature fired glass ceramics
11/17/1992	US5164336 Bonding bumps by thermocompression
11/17/1992	US5164334 Reduced wiring parasitic capacitance
11/17/1992	US5164333 Silicide diffusion barrier
11/17/1992	US5164332 Into polymer dielectric, copper alloy
11/17/1992	US5164331 Trifluoromethane and oxygen
11/17/1992	US5164246 For semiconductors, aluminum nitride ceramics, electroconduc-tive coating, metal nitride, tungsten and molybdenum
11/17/1992	US5164222 Chemical vapor deposition of tungsten
11/17/1992	US5164119 Silver-glass pastes
11/17/1992	US5163850 Electrostatic discharge protection devices for semiconductor chip packages
11/17/1992	US5163499 Method of forming electronic packages
11/17/1992	US5163222 Method and apparatus for loading metal leadframes with electronic components
11/17/1992	CA1310432C Package for emi, esd, thermal, and mechanical shock protection of circuit chips
11/17/1992	CA1310334C Adducts of metabrominated phenols and polyfunctional epoxides
11/12/1992	WO1992020205A1 Tapered semiconductor device package
11/12/1992	WO1992020203A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
11/12/1992	WO1992020109A1 A plug contact with antifuse and method of manufacture thereof
11/12/1992	WO1992020108A1 Multichip interconnect module including superconductive materials
11/12/1992	WO1992020100A1 A ceramic substrate having a protective coating and method of protection
11/12/1992	WO1992020099A1 Stabilization of the interface between aluminum and titanium nitride
11/12/1992	WO1992020097A1 Semiconductor device and manufacturing method therefor
11/12/1992	WO1992020095A1 Programmable interconnect structures and programmable integrated circuits
11/12/1992	WO1992019462A1 Process for the manufacture of an interconnect circuit
11/12/1992	DE4215471A1 Semiconductor package e.g. lead-on-chip, small outline J-lead type - has chip with several solder points which are soldered to numerous inner lines of conductor frame
11/12/1992	DE4215467A1 Integration of two semiconductor chips inside standard outline package - uses solder bumps on both dice which are bonded face-to-face in lead-on-chip configuration to lead frame
11/12/1992	DE4214391A1 Integrated semiconductor switching circuit - comprising substrate contg. electronic cpd., electrically insulating layer and electrically conducting cpd.
11/12/1992	CA2102626A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
11/11/1992	EP0512742A1 Semiconductor device assembly
11/11/1992	EP0512579A1 Packaging of semiconductor elements
11/11/1992	EP0512546A1 Anisotropically conductive material and method for connecting integrated circuits by using the same
11/11/1992	EP0512463A1 Process for manufacturing dynamic random access memories
11/11/1992	EP0512186A1 Cooling structures and package modules for semiconductors
11/11/1992	EP0511965A1 Mounting for electronic components which need to be cooled
11/11/1992	EP0319571B1 router for integrated circuits
11/11/1992	EP0280700B1 Circuit package attachment apparatus and method
11/10/1992	US5163180 Low voltage programming antifuse and transistor breakdown method for making same
11/10/1992	US5162975 Integrated circuit demountable TAB apparatus
11/10/1992	US5162970 Miniature monolithic ceramic coupler for electronic circuits
11/10/1992	US5162896 IC package for high-speed semiconductor integrated circuit device
11/10/1992	US5162895 Lead frame for semiconductor device that prevents island torsion
11/10/1992	US5162894 Semiconductor integrated circuit having a dummy lead and shaped inner leads
11/10/1992	US5162892 Semiconductor device with polycrystalline silicon active region and hydrogenated passivation layer
11/10/1992	US5162875 Protective layer for electroactive passivation layers
11/10/1992	US5162613 Integrated circuit interconnection technique
11/10/1992	US5162437 Sealing Semiconductors
11/10/1992	US5162400 Epoxy resin compositions and semiconductor devices encapsulated therewith
11/10/1992	US5162265 Method of making an electrical interconnection having angular lead design
11/10/1992	US5162264 Integrated circuit package
11/10/1992	US5162262 Multilayer, silicides, nitrides
11/10/1992	US5162260 Stacked solid via formation in integrated circuit systems
11/10/1992	US5162257 Forming intermetallic between solder bump and contact pad
11/10/1992	US5162250 Method for interconnecting a filament channel transistor with a wordline conductor
11/10/1992	US5162240 Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate
11/10/1992	US5162062 Method for making multilayer electronic circuits
11/10/1992	US5161729 Placing alloy of solder bonding material between conductive element of first level of packaging and active interconnect site on chip, reflowing alloy to form connection
11/10/1992	US5161304 Method for packaging an electronic circuit device
11/10/1992	CA1310099C Customizable circuitry
11/07/1992	WO1992020096A1 Arrangement for encasing a functional device, and a process for the production of same
11/07/1992	CA2086825A1 Arrangement for encasing a functional device, and a process for the production of same
11/05/1992	DE4213934A1 Anschlussrahmenhalter Connection frame holder
11/04/1992	EP0511833A2 Epoxy molding composition for surface mount applications
11/04/1992	EP0511702A2 Semiconductor device encapsulated in resin and completely insulated for high voltages
11/04/1992	EP0511578A2 A modular construction, power circuit arrangement being highly compact and efficient in terms of heat dissipation
11/04/1992	EP0511301A1 Method for reducing shrinkage during firing of green ceramic bodies.
11/04/1992	EP0511218A1 Fabricating eletronic circuitry unit containing stacked ic layers having lead rerouting.

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