H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1992
12/10/1992	DE4118541A1 Interface coupling for microwave strip conductors - uses overlapping integrated circuit chip over supporting substrate to interface microwave strip conductor to other circuit elements
12/10/1992	DE4118398A1 Electronic assembly with circuit board in metallic housing e.g. for satellite - cools by conduction into metallic core without insulation under chip and against heat sink
12/10/1992	DE4118397A1 Metal-cored circuit board carrying integrated circuit chip e.g. for satellite - cools by conduction into core from underside of chip mounted in hole through insulating layer
12/09/1992	EP0517551A2 Method of forming a multilayer wiring structure on a semiconductor device
12/09/1992	EP0517439A1 Apparatus and method for assembling circuit structures
12/09/1992	EP0517368A2 Local interconnect for integrated circuits
12/09/1992	EP0517288A1 Diffusion barrier enhancement in metallization structure for semiconductor device fabrication
12/09/1992	EP0517264A1 Electronic circuits and their fabrication
12/09/1992	EP0517247A2 Multilayer package
12/09/1992	EP0517073A1 Method of encapsulating electrical and electronic components
12/09/1992	EP0516875A1 Module for electronic package
12/09/1992	EP0516866A1 Modular multilayer interwiring structure
12/09/1992	EP0516765A1 Methods of forming electronic packages.
12/09/1992	EP0447463A4 Antistatic sheet material, package and method of making
12/09/1992	CN1019423B Regeneration power supply method for ic
12/09/1992	CN1019413B System for cooling heat generating body
12/08/1992	US5170374 Semiconductor memory
12/08/1992	US5170337 Low-inductance package for multiple paralleled devices operating at high frequency
12/08/1992	US5170329 Stress free chip mount and method of manufacture
12/08/1992	US5170325 Spring element for a group of components of an electronic control device
12/08/1992	US5170319 Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels
12/08/1992	US5170312 Protection circuit on a lead of a power device
12/08/1992	US5170244 Underlying metal film having crystalline form of a body-centered cubic system; molybdenum-tantalum alloy film; corrosion resistance; high quality, high definition television screen
12/08/1992	US5170242 One or more active ionic species implanted at interface region
12/08/1992	US5170235 Semiconductor integrated circuit
12/08/1992	US5169911 Dielectric; catalyst system of diaryliodonium salt and free radical catalyst
12/08/1992	US5169805 Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation
12/08/1992	US5169803 Method of filling contact holes of a semiconductor device
12/08/1992	US5169802 Internal bridging contact
12/08/1992	US5169800 Burying metal layer in first and second openings by irradiation
12/08/1992	US5169678 Rendering at specific laser frequency by mixing ultraviolet wavelength absorpted azo dyes with thermoplastic resins
12/08/1992	US5169056 Connecting of semiconductor chips to circuit substrates
12/08/1992	US5168995 Pinch clip lid for non-hermetic packages
12/08/1992	US5168926 Heat sink design integrating interface material
12/08/1992	US5168919 Air cooled heat exchanger for multi-chip assemblies
12/06/1992	WO1992021927A1 Heat pipe connector, electronic device and heat radiating fan having said pipe
12/03/1992	DE4217604A1 New hardenable polyimide cpds. used to coat electronic components - contg. hydrocarbyl-oxy-silyl gps. and mixts. or co-condensates or silicon-contg. amic acid with organo-silane or organo-polysiloxane
12/03/1992	DE4214102A1 Multi-chip semiconductor module e.g. of LOC-TSOP type - has two blank chips which are interconnected by solder, while several TAB strips have each inner and outer leads
12/02/1992	EP0516478A2 Cooling structure for integrated circuits
12/02/1992	EP0516416A1 Semiconductor device and method of fabricating the same
12/02/1992	EP0516402A1 Substrate provided with electric lines and its manufacturing method
12/02/1992	EP0516334A2 Method of etching a window in a dielectric layer on an integrated circuit and planarization thereof
12/02/1992	EP0516280A1 Semi-rigid heat transfer devices
12/02/1992	EP0516279A2 An interconnection structure of a semiconductor device and a method of manufacturing thereof
12/02/1992	EP0516185A2 Wafer-scale semiconductor integrated circuit device
12/02/1992	EP0516170A2 Semiconductor chip mounted circuit board assembly and method for manufacturing the same
12/02/1992	EP0516149A1 Electronic device
12/02/1992	EP0516096A2 Semiconductor device unit having holder and method of mounting semiconductor devices using holder
12/02/1992	EP0516043A2 Dry etching method
12/02/1992	EP0314738B1 Carbon connectors to liquid-immersion cooled integrated circuit
12/01/1992	US5168432 Adapter for connection of an integrated circuit package to a circuit board
12/01/1992	US5168430 Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board
12/01/1992	US5168425 Mounting arrangements for high voltage/high power semiconductors
12/01/1992	US5168368 Lead frame-chip package with improved configuration
12/01/1992	US5168348 Impingment cooled compliant heat sink
12/01/1992	US5168347 Integrated circuit chip package having signal input/output connections located at edges of the substrate
12/01/1992	US5168345 Semiconductor device having a universal die size inner lead layout
12/01/1992	US5168344 Hermetically sealed perimeter-leaded housing for integrated circuit substrates which are electrically accessible
12/01/1992	US5168342 Semiconductor integrated circuit device and manufacturing method of the same
12/01/1992	US5168126 Container package for semiconductor element
12/01/1992	US5168078 Method of making high density semiconductor structure
12/01/1992	US5167794 Heat-diffusion of plated silver into copper or copper alloy matrix
12/01/1992	US5167744 Method of hermetically sealing a space
12/01/1992	US5167697 Substrate material for mounting semiconductor device thereon and manufacturing method thereof
12/01/1992	US5167515 Socket for electric part
12/01/1992	CA1311042C Subassembly for optoelectronic devices
11/1992
11/26/1992	WO1992021223A1 Heat sink and electromagnetic interference shield assembly
11/26/1992	WO1992021154A1 Amorphous silicon antifuses and methods for fabrication thereof
11/26/1992	WO1992021150A1 Integrated circuit chip carrier
11/26/1992	WO1992021051A1 Liquid crystal module
11/26/1992	WO1992020637A1 Ceramic board having glaze, manufacturing method therefor, and electronic device using the ceramic board
11/25/1992	EP0515094A1 Molded circuit package
11/25/1992	EP0515061A1 Process of producing aluminum nitride multiple-layer circuit board
11/25/1992	EP0514905A1 Semiconductor memory device and manufacturing method thereof
11/25/1992	EP0514888A1 Method of forming a contact pad by selective deposition of a metal film
11/25/1992	EP0514873A1 Heater type hybrid integrated circuit
11/25/1992	EP0514723A1 Electronic parts loaded module
11/25/1992	EP0514637A1 Ultra thin electronic component and method for its production
11/25/1992	EP0514615A1 Electronic power device realized by a series of elementary semi-conductor components connected in parallel and related manufacturing process
11/25/1992	EP0514547A1 SEMICONDUCTOR MEMORY HAVING A FERROELECTRIC CAPACITOR AND A TiON BARRIER FILM
11/25/1992	CN1019250B Electric device and mfg. method of same
11/24/1992	US5166901 Programmable memory cell structure including a refractory metal barrier layer
11/24/1992	US5166866 Semiconductor package
11/24/1992	US5166863 Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling
11/24/1992	US5166775 Air manifold for cooling electronic devices
11/24/1992	US5166774 Selectively releasing conductive runner and substrate assembly having non-planar areas
11/24/1992	US5166773 Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
11/24/1992	US5166772 Transfer molded semiconductor device package with integral shield
11/24/1992	US5166771 Self-aligning contact and interconnect structure
11/24/1992	US5166770 Silicided structures having openings therein
11/24/1992	US5166556 Gate array cell
11/24/1992	US5166547 Programmable DCVS logic circuits
11/24/1992	US5166292 Tetracarboxylic acid and diamine curable to imide films for high strength and heat resistance
11/24/1992	US5166228 Protective coatings for electronics
11/24/1992	US5166101 Method for forming a boron phosphorus silicate glass composite layer on a semiconductor wafer
11/24/1992	US5166099 Manufacturing method for semiconductor device
11/24/1992	US5166098 Method of manufacturing an encapsulated semiconductor device with a can type housing
11/24/1992	US5166097 Silicon wafers containing conductive feedthroughs
11/24/1992	US5166096 Process for fabricating self-aligned contact studs for semiconductor structures
11/24/1992	US5166095 Low contact resistance process

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