H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1992
12/30/1992	EP0520243A2 Metal core circuit board
12/30/1992	EP0316404B1 Improved thermoelectric cooling design
12/30/1992	EP0271509B1 Staggered radial-fin heat sink device for integrated circuit package
12/30/1992	CN2126464U Guiding-positioning apparatus for electroic element wire automatically-filling machine
12/29/1992	US5175774 Semiconductor wafer marking for identification during processing
12/29/1992	US5175668 Circuit board for a component requiring heat sinkage
12/29/1992	US5175613 Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
12/29/1992	US5175611 Microwave integrated circuit package to eliminate alumina substrate cracking
12/29/1992	US5175610 Resin molded type semiconductor device having a metallic plate support
12/29/1992	US5175609 Structure and method for corrosion and stress-resistant interconnecting metallurgy
12/29/1992	US5175399 Copper conductor laminated to substrate which also has organic dielectric, heat and chemical resistance
12/29/1992	US5175397 Integrated circuit chip package
12/29/1992	US5175130 Low-temperature baked substrate
12/29/1992	US5175127 Forming contacts between alternating polycrystalline silicon layers in semiconductors by isotropic oxygen plasma etching of photoresist through dielectric oxide layer, simplification
12/29/1992	US5175118 Dry etching, wet etching high melting point metal silicide layer
12/29/1992	US5175060 Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same
12/29/1992	US5175033 Metallized bag with improved interlayer adhesion for static protection of electronic components
12/29/1992	US5174858 Method of forming contact structure
12/29/1992	US5174816 Surface treating agent for aluminum line pattern substrate
12/29/1992	US5174188 Process and device for marking and cleaving plaquettes of monocrystalline semiconductor materials
12/28/1992	CA2070747A1 Ic socket
12/27/1992	CA2071662A1 Integrated socket-type package for flip-chip semiconductor devices and circuits
12/24/1992	DE4219927A1 Anordnung von spannungsquelle- und erdungsleitungen einer halbleiterspeichereinrichtung Arrangement of spannungsquelle- and grounding lines of a semiconductor memory device
12/24/1992	DE4217076A1 Ceramic-filled fluoro:polymer for PCB use - contg. specified volume of filler coated with fluorinated and/or non-fluorinated silane, having improved flow properties
12/24/1992	DE4217075A1 Ceramic-filled fluoro:polymer composite for circuit board use - contains specific vol. of filler coated with zirconate or titanate to improve flow properties and chemical resistance at high pH
12/23/1992	WO1992022923A1 Lead frame for integrated circuits or the like
12/23/1992	WO1992022827A1 An improved miniature transponder device
12/23/1992	WO1992022422A1 Shape retaining flexible electrical circuit
12/23/1992	EP0519676A2 Process of producing multiple layer glass-ceramic circuit board
12/23/1992	EP0519665A1 Method for making a planar multi-layer metal bonding pad
12/23/1992	EP0519473A2 Method of fabricating a semiconductor device having an insulating side wall
12/23/1992	EP0519352A2 Semiconductor device provided with contact through a thick insulating film
12/23/1992	EP0519268A2 High-voltage transistor
12/23/1992	EP0519200A1 Connection of LLCCC structural elements for the space electronics
12/23/1992	EP0519175A2 Method for making multilayer electronic circuits
12/23/1992	EP0518908A1 Method for polymerization of epoxide compounds.
12/22/1992	US5173844 Integrated circuit device having a metal substrate
12/22/1992	US5173842 Electrical assembly with deformable bridge printed circuit board
12/22/1992	US5173767 Integrated circuit housing composed of three coated, dielectric plates
12/22/1992	US5173766 Semiconductor device package and method of making such a package
12/22/1992	US5173765 Conductive adhesive and article made therewith
12/22/1992	US5173764 Semiconductor device having a particular lid means and encapsulant to reduce die stress
12/22/1992	US5173763 Electronic packaging with varying height connectors
12/22/1992	US5173762 Semiconductor device using bonding wires of different materials
12/22/1992	US5173752 Semiconductor device having interconnection layer contacting source/drain regions
12/22/1992	US5173621 Transceiver with isolated power rails for ground bounce reduction
12/22/1992	US5173574 Soldering connector and method for manufacturing an electric circuit with this soldering connector
12/22/1992	US5173542 Bistriazene compounds and polymeric compositions crosslinked therewith
12/22/1992	US5173451 Soft bond for semiconductor dies
12/22/1992	US5173450 Titanium silicide local interconnect process
12/22/1992	US5173449 Forming T; WN layer by sputtering TiW in N2, purging, forming TiW layer in nitrogen-free atmosphere
12/22/1992	US5173442 Masking, etching insulation; copper-polyimide substrate
12/22/1992	US5173354 Non-beading, thin-film, metal-coated ceramic substrate
12/22/1992	US5173256 Liquid metal matrix thermal paste
12/22/1992	US5173147 Apparatus for sealing a semiconductor package having frosted quartz glass piece and UV light source
12/22/1992	US5172851 Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device
12/22/1992	US5172756 Heat sink
12/22/1992	US5172755 Cooling apparatus for a heat generating device
12/22/1992	US5172473 Method of making cone electrical contact
12/22/1992	US5172471 Method of providing power to an integrated circuit
12/22/1992	CA2026437C Method of manufacturing heat pipe semiconductor cooling apparatus
12/22/1992	CA1311860C Device mounting
12/22/1992	CA1311857C Environmentally protected semiconductor chip package
12/22/1992	CA1311856C Multiple integrated circuit interconnection arrangement
12/22/1992	CA1311855C Method and apparatus for packaging and cooling integrated circuit chips
12/19/1992	CA2070743A1 Semiconductor chip module and method for manufacturing the same
12/18/1992	CA2066069A1 Method for making multilayer electronic circuits
12/16/1992	EP0518774A1 Process for cleaning oxidized metallic surfaces in the fabrication of interconnection networks and boards for such networks
12/16/1992	EP0518701A2 Field programmable circuit module
12/16/1992	EP0518196A1 Polyethers based on 9,9-BIS-perfluoroalkyl-3,6-dihydroxy-xanthene or 9-aryl-9-perfluoroalkyl-3,6-dihydroxy-xanthene
12/16/1992	EP0518026A1 Infrared radiation detector including a cooling device
12/16/1992	EP0518005A2 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
12/16/1992	EP0517967A1 High current hermetic package
12/16/1992	CN1067138A Electronic detail mounting module
12/16/1992	CN1067063A Current converting device
12/15/1992	US5172310 Low impedance bus for power electronics
12/15/1992	US5172301 Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
12/15/1992	US5172215 Overcurrent-limiting type semiconductor device
12/15/1992	US5172214 Leadless semiconductor device and method for making the same
12/15/1992	US5172213 Molded circuit package having heat dissipating post
12/15/1992	US5172212 Semiconductor having an improved electrode pad
12/15/1992	US5172210 Master slice integrated circuit having a memory region
12/15/1992	US5172197 Hemt structure with passivated donor layer
12/15/1992	US5171828 Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA
12/15/1992	US5171716 Containing stress relieving interface
12/15/1992	US5171715 Process for fabricating electrically programmable antifuse element
12/15/1992	US5171714 Photolithography
12/15/1992	US5171712 Electroconductive projections on bonding pads formed on transparent substrates
12/15/1992	US5171711 Method of manufacturing integrated circuit devices
12/15/1992	US5171701 Method of manufacturing master-slice semiconductor integrated circuits
12/15/1992	US5171642 Multilayered intermetallic connection for semiconductor devices
12/15/1992	US5170931 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
12/15/1992	US5170930 Liquid metal paste for thermal and electrical connections
12/12/1992	CA2070976A1 Polyethers based on 9, 9-bis-perfluoroalkyl-3,6-dihydroxy-xanthene or 9-aryl-9-perfluoroalkyl-3,6-dihydroxy-xanthene
12/10/1992	WO1992022090A1 Thermally conductive electronic assembly
12/10/1992	WO1992022089A1 Semiconductor chip cooling apparatus
12/10/1992	WO1992022088A1 Anti-fuse structures and methods for making same
12/10/1992	WO1992017903A3 Three-dimensional multichip module systems and methods of fabrication
12/10/1992	WO1992017902A3 Surface mount device with high thermal conductivity
12/10/1992	DE4218495A1 Semiconductor device suitable for LSI - has 2nd metal wiring layer formed on metal film electrically connected to photoresist, selectively coated on 1st metal wiring above insulating layer

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