| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/03/2013 | US8525334 Semiconductor on semiconductor substrate multi-chip-scale package |
| 09/03/2013 | US8525333 Electronic device and manufacturing method therefor |
| 09/03/2013 | US8525332 Semiconductor device having semiconductor substrate, and method of manufacturing the same |
| 09/03/2013 | US8525331 Chip design having integrated fuse and method for the production thereof |
| 09/03/2013 | US8525330 Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer |
| 09/03/2013 | US8525329 Component stacking for integrated circuit electronic package |
| 09/03/2013 | US8525328 Power device package structure |
| 09/03/2013 | US8525327 Stub minimization for assemblies without wirebonds to package substrate |
| 09/03/2013 | US8525326 IC package with capacitors disposed on an interposal layer |
| 09/03/2013 | US8525325 Integrated circuit packaging system with leads and method of manufacture thereof |
| 09/03/2013 | US8525324 Semiconductor package and method of fabricating the same |
| 09/03/2013 | US8525323 Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
| 09/03/2013 | US8525322 Semiconductor package having a plurality of input/output members |
| 09/03/2013 | US8525321 Conductive chip disposed on lead semiconductor package |
| 09/03/2013 | US8525320 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods |
| 09/03/2013 | US8525319 Selecting chips within a stacked semiconductor package using through-electrodes |
| 09/03/2013 | US8525318 Semiconductor device and fabricating method thereof |
| 09/03/2013 | US8525317 Integrated chip package having intermediate substrate with capacitor |
| 09/03/2013 | US8525316 Eutectic flow containment in a semiconductor fabrication process |
| 09/03/2013 | US8525315 Semiconductor power module and method of manufacturing the same |
| 09/03/2013 | US8525314 Stacked packaging improvements |
| 09/03/2013 | US8525313 Chip assembly with frequency extending device |
| 09/03/2013 | US8525312 Area array quad flat no-lead (QFN) package |
| 09/03/2013 | US8525310 Leadframe package for high-speed data rate applications |
| 09/03/2013 | US8525309 Flip-chip QFN structure using etched lead frame |
| 09/03/2013 | US8525307 Semiconductor device, lead frame assembly, and method for fabricating the same |
| 09/03/2013 | US8525306 Semiconductor device and method of manufacturing the same |
| 09/03/2013 | US8525305 Lead carrier with print-formed package components |
| 09/03/2013 | US8525304 Semiconductor device |
| 09/03/2013 | US8525289 Adjusting threshold voltage for sophisticated transistors by diffusing a gate dielectric cap layer material prior to gate dielectric stabilization |
| 09/03/2013 | US8525266 Semiconductor body having a terminal cell |
| 09/03/2013 | US8525265 Electrostatic discharge protection circuit |
| 09/03/2013 | US8525247 Non-volatile memory device having variable resistance element |
| 09/03/2013 | US8525235 Multiplying pattern density by single sidewall imaging transfer |
| 09/03/2013 | US8525214 Semiconductor chip assembly with post/base heat spreader with thermal via |
| 09/03/2013 | US8525183 Semiconductor device including multiple insulating films |
| 09/03/2013 | US8525174 Organic light emitting display device and method of manufacturing the same |
| 09/03/2013 | US8525173 Semiconductor device and manufacturing method thereof |
| 09/03/2013 | US8525168 Integrated circuit (IC) test probe |
| 09/03/2013 | US8525167 Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package |
| 09/03/2013 | US8525024 Hermetic sealing device and hermetic sealing structure |
| 09/03/2013 | US8524842 Silicone compositions crosslinkable into adhesive gels |
| 09/03/2013 | US8524607 Anisotropically conductive member and method of manufacture |
| 09/03/2013 | US8524538 Integrated circuit packaging system with film assistance mold and method of manufacture thereof |
| 09/03/2013 | US8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 09/03/2013 | US8524534 Semiconductor device and manufacturing method thereof |
| 09/03/2013 | US8524531 System and method for improving solder joint reliability in an integrated circuit package |
| 09/03/2013 | US8524530 Flexible semiconductor package and method for fabricating the same |
| 09/03/2013 | US8522430 Clustered stacked vias for reliable electronic substrates |
| 08/29/2013 | WO2013126893A1 System in package and method for manufacturing the same |
| 08/29/2013 | WO2013126679A1 Semiconductor power modules and devices |
| 08/29/2013 | WO2013126269A1 Method for package-on-package assembly with wire bonds to encapsulation surface |
| 08/29/2013 | WO2013126199A1 Metallic capped interconnect structure with high electromigration resistance and low resistivity |
| 08/29/2013 | WO2013126153A1 Method for processing semiconductors using a combination of electron beam and optical lithography |
| 08/29/2013 | WO2013126018A1 A method for plating a component |
| 08/29/2013 | WO2013124711A1 A semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods |
| 08/29/2013 | WO2013123972A1 Liquid cooling system and method for cooling at least one radio unit |
| 08/29/2013 | WO2013123970A1 Cooling system and method for cooling a heat generating unit |
| 08/29/2013 | WO2013098629A8 Semiconductor device |
| 08/29/2013 | WO2013087101A8 Substrate-supported circuit parts with free-standing three-dimensional structures |
| 08/29/2013 | WO2013045364A3 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer |
| 08/29/2013 | US20130224947 Semiconductor device and manufacturing method thereof |
| 08/29/2013 | US20130224914 Method for package-on-package assembly with wire bonds to encapsulation surface |
| 08/29/2013 | US20130224911 Semiconductor device and method for manufacturing a semiconductor device |
| 08/29/2013 | US20130224653 Crosslinked polyimide, composition comprising the same and method for producing the same |
| 08/29/2013 | US20130223010 Semiconductor package, cooling mechanism and method for manufacturing semiconductor package |
| 08/29/2013 | US20130221544 Molding die, microchip manufactured by using molding die, and manufacturing apparatus for manufacturing microchip |
| 08/29/2013 | US20130221543 Integrated circuit packaging system with interconnects and method of manufacture thereof |
| 08/29/2013 | US20130221542 Functional Spacer for SIP and Methods for Forming the Same |
| 08/29/2013 | US20130221541 Integrated circuits including air gaps around interconnect structures, and fabrication methods thereof |
| 08/29/2013 | US20130221540 Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules |
| 08/29/2013 | US20130221539 Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact |
| 08/29/2013 | US20130221538 Semiconductor device |
| 08/29/2013 | US20130221537 Semiconductor device and electronic apparatus |
| 08/29/2013 | US20130221536 Enhanced flip chip structure using copper column interconnect |
| 08/29/2013 | US20130221535 Diffusion Barrier Layer, Metal Interconnect Arrangement and Method of Manufacturing the Same |
| 08/29/2013 | US20130221534 Through Silicon Via Layout Pattern |
| 08/29/2013 | US20130221533 High speed, high density, low power die interconnect system |
| 08/29/2013 | US20130221532 Semiconductor module with switching elements |
| 08/29/2013 | US20130221531 Semiconductor device, memory system and method of manufacturing the semiconductor device |
| 08/29/2013 | US20130221530 Semiconductor device |
| 08/29/2013 | US20130221529 Hybrid interconnect structure for performance improvement and reliability enhancement |
| 08/29/2013 | US20130221528 Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure |
| 08/29/2013 | US20130221527 Metallic capped interconnect structure with high electromigration resistance and low resistivity |
| 08/29/2013 | US20130221526 System in Package and Method for Manufacturing The Same |
| 08/29/2013 | US20130221525 Semiconductor Package with Integrated Selectively Conductive Film Interposer |
| 08/29/2013 | US20130221524 Integrated circuits with improved interconnect reliability using an insulating monolayer and methods for fabricating same |
| 08/29/2013 | US20130221523 Electronic device and electronic component |
| 08/29/2013 | US20130221522 Mechanisms of forming connectors for package on package |
| 08/29/2013 | US20130221521 Solder bump stretching method for forming a solder bump joint in a device |
| 08/29/2013 | US20130221520 Semiconductor device and method of manufacturing semiconductor device |
| 08/29/2013 | US20130221519 Semiconductor devices including dummy solder bumps |
| 08/29/2013 | US20130221518 Printed wiring board |
| 08/29/2013 | US20130221517 Semiconductor workpiece with backside metallization and methods of dicing the same |
| 08/29/2013 | US20130221516 Power semiconductor module |
| 08/29/2013 | US20130221515 Semiconductor device and method of manufacturing the same |
| 08/29/2013 | US20130221514 Semiconductor device and fabrication method for the same |
| 08/29/2013 | US20130221513 Power Semiconductor Module System with Undercut Connection |
| 08/29/2013 | US20130221512 Structure and manufacturing method of chip scale package |
| 08/29/2013 | US20130221511 Method for forming die assembly with heat spreader |